Patents Assigned to CENTERA PHOTONICS INC.
  • Patent number: 10234643
    Abstract: An optical connector includes a substrate, plural optical channels for transmitting an optical signal, a light source, an oblique structure, and a photo detector. The light source is located on the substrate to emit a first optical signal. The oblique structure has an optical reflective surface to reflect the first optical signal emitted by the light source to at least one of the optical channels. The photo detector is located on the substrate to receive a second optical signal emitted by at least one of the optical channels. The optical reflective surface has at least one gap, such that the optical reflective surface is divided into at least two segments by the gap, and the segments are not electrically connected with each other.
    Type: Grant
    Filed: February 17, 2017
    Date of Patent: March 19, 2019
    Assignee: CENTERA Photonics Inc.
    Inventor: Hsin-Chieh Wu
  • Patent number: 9923103
    Abstract: A detachable package structure that includes an assembly substrate, a first semiconductor substrate, a second semiconductor substrate, and a combination element is provided. The first semiconductor substrate is disposed on the assembly substrate and has a first alignment portion. The second semiconductor substrate has a second alignment portion. The combination element allows the first semiconductor substrate and the second semiconductor substrate to be detachably combined together, such that the first alignment portion and the second alignment portion are aligned and combined.
    Type: Grant
    Filed: May 20, 2015
    Date of Patent: March 20, 2018
    Assignee: Centera Photonics Inc.
    Inventors: Hsu-Liang Hsiao, Guan-Fu Lu, Tzu-Ching Yeh, Chun-Chiang Yen
  • Patent number: 9729243
    Abstract: An optoelectronic transmitter including a semiconductor substrate, at least one laser source, and a high numerical aperture (NA) waveguide is provided. The laser source is disposed on the semiconductor substrate and configured to emit at least one laser beam. The high numerical aperture (NA) waveguide has an NA greater than or equal to 0.5 and is disposed on the semiconductor substrate. At least a part of the laser beam from the laser source enters the high NA waveguide, wherein no lens is disposed on the light path of the laser beam between the laser source and the high NA waveguide. An optoelectronic receiver and an optoelectronic transceiver are also provided.
    Type: Grant
    Filed: April 23, 2015
    Date of Patent: August 8, 2017
    Assignee: Centera Photonics Inc.
    Inventors: Tzu-Ching Yeh, Hsiao-Chin Lan, Chin-Ta Chen, Po-Kuan Shen
  • Publication number: 20170123156
    Abstract: A method for manufacturing an optical electrical module includes steps as follow. Forming first patterns on a first substrate by a first mask, wherein an angle between a primary flat of the first substrate and an arrangement direction having a maximum number of first pattern units of the first mask is (?+90°*n), wherein ? is between 22° to 39°, and n is an integer. Subjecting the first substrate to a first patterning process using the first patterns as a mask to form accommodating grooves and a reflective groove connected with the accommodating grooves in the first substrate, wherein an extension direction of each of the accommodating grooves is perpendicular to an extension direction of the reflective groove.
    Type: Application
    Filed: January 6, 2017
    Publication date: May 4, 2017
    Applicant: Centera Photonics Inc.
    Inventors: Shang-Jen Yu, Chun-Chiang Yen
  • Patent number: 9581772
    Abstract: An optical electrical module includes a first substrate, a second substrate, a bearing portion and at least one optical electrical element. The second substrate is combined with the first substrate and has a reflective surface facing the first substrate. The bearing portion is disposed between the first substrate and the second substrate to limit at least one light guide element. The optical electrical element is disposed on a surface of the first substrate facing the reflective surface and faces the reflective surface. The optical electrical element is configured for providing or receiving light signals. The reflective surface and the light guide element are disposed on an optical path of the light signals.
    Type: Grant
    Filed: October 3, 2014
    Date of Patent: February 28, 2017
    Assignee: Centera Photonics Inc.
    Inventors: Hsiao-Chin Lan, Shang-Jen Yu
  • Patent number: 9488791
    Abstract: The present invention provides an optoelectronic module including a substrate, an optoelectronic device and a control unit. The substrate includes a top surface, a bottom surface, a concave structure, a through hole structure and a conductive material. The concave structure is disposed on the top surface. The through hole structure passes through the substrate from the top surface to the bottom surface. The conductive material is filled into the through hole structure. The optoelectronic device is disposed on the substrate for providing or receiving an optical signal. The control unit is configured on the top surface and electrically connected to the conductive material and the optoelectronic device for controlling the optoelectronic device.
    Type: Grant
    Filed: April 28, 2015
    Date of Patent: November 8, 2016
    Assignee: Centera Photonics Inc.
    Inventors: Chia-Chi Chang, Guan-Fu Lu, Chun-Chiang Yen
  • Patent number: 9064988
    Abstract: A photoelectric device package and a detachable package structure are provided. The photoelectric device package includes a bottom-plate, a top-plate, at least one photoelectric device, and at least one light-guiding element. The bottom-plate has a first carrying part and a first substrate part on the first carrying part. The first carrying part has first alignment portions. The first substrate part has second alignment portions. The top-plate has a second carrying part and a second substrate part on the second carrying part. The second carrying part has third alignment portions. The second substrate part has fourth alignment portions. The top-plate and the bottom-plate are assembled by the first and third alignment portions. The first and second substrate parts are positioned by the second and fourth alignment portions. Each photoelectric device is disposed on the first substrate part. Each light-guiding element is disposed between the first and second substrate parts.
    Type: Grant
    Filed: December 20, 2012
    Date of Patent: June 23, 2015
    Assignee: Centera Photonics Inc.
    Inventors: Hsu-Liang Hsiao, Guan-Fu Lu, Tzu-Ching Yeh, Chun-Chiang Yen
  • Patent number: 9057850
    Abstract: The present invention provides an optoelectronic module including a substrate, an optoelectronic device and a control unit. The substrate includes a top surface, a bottom surface, a concave structure, a through hole structure and a conductive material. The concave structure is disposed on the top surface. The through hole structure passes through the substrate from the top surface to the bottom surface. The conductive material is filled into the through hole structure. The optoelectronic device is disposed on the substrate for providing or receiving an optical signal. The control unit is configured on the top surface and electrically connected to the conductive material and the optoelectronic device for controlling the optoelectronic device.
    Type: Grant
    Filed: March 22, 2012
    Date of Patent: June 16, 2015
    Assignee: Centera Photonics Inc.
    Inventors: Chia-Chi Chang, Guan-Fu Lu, Chun-Chiang Yen
  • Patent number: 8940563
    Abstract: A method for manufacturing an optoelectronic module is proposed. The method comprises the following steps: providing a top cover with a reflective surface. Then, a light-guiding structure is formed. A mounting device is provided. Next, an optoelectronic device is formed on the mounting device with a first precision. A control chip is formed on the mounting device with a second precision different from the first precision. The top cover combines with the mounting device, wherein the light-guiding structure is between the top cover and the mounting device, and the optoelectronic device faces the reflective surface.
    Type: Grant
    Filed: November 15, 2013
    Date of Patent: January 27, 2015
    Assignee: Centera Photonics Inc.
    Inventors: Shang-Jen Yu, Chien-Chen Hsieh, Chun Chiang Yen
  • Publication number: 20130309801
    Abstract: A wafer-level process for fabricating a plurality of photoelectric modules is provided. The wafer-level process includes at least following procedures. Firstly, a wafer including a plurality of chips arranged in an array is provided. Next, a plurality of photoelectric devices are mounted on the chips. Next, a cover plate including a plurality of covering units arranged in an array is provided. Next, a plurality of light guiding mediums are formed over the cover plate. Next, the cover plate is bonded with the wafer by an adhesive, wherein each of the covering units covers and bonds with one of the chips, and the light guiding mediums are sandwiched between the cover plate and the wafer. Then, the wafer and the cover plate are diced to obtain the plurality of photoelectric modules.
    Type: Application
    Filed: May 15, 2012
    Publication date: November 21, 2013
    Applicant: CENTERA PHOTONICS INC.
    Inventors: Hsu-Liang Hsiao, Chun-Chiang Yen, Guan-Fu Lu
  • Patent number: 8580589
    Abstract: A wafer-level process for fabricating a plurality of photoelectric modules is provided. The wafer-level process includes at least following procedures. Firstly, a wafer including a plurality of chips arranged in an array is provided. Next, a plurality of photoelectric devices are mounted on the chips. Next, a cover plate including a plurality of covering units arranged in an array is provided. Next, a plurality of light guiding mediums are formed over the cover plate. Next, the cover plate is bonded with the wafer by an adhesive, wherein each of the covering units covers and bonds with one of the chips, and the light guiding mediums are sandwiched between the cover plate and the wafer. Then, the wafer and the cover plate are diced to obtain the plurality of photoelectric modules.
    Type: Grant
    Filed: May 15, 2012
    Date of Patent: November 12, 2013
    Assignee: Centera Photonics Inc.
    Inventors: Hsu-Liang Hsiao, Chun-Chiang Yen, Guan-Fu Lu
  • Publication number: 20130270427
    Abstract: A photoelectric device package and a detachable package structure are provided. The photoelectric device package includes a bottom-plate, a top-plate, at least one photoelectric device, and at least one light-guiding element. The bottom-plate has a first carrying part and a first substrate part on the first carrying part. The first carrying part has first alignment portions. The first substrate part has second alignment portions. The top-plate has a second carrying part and a second substrate part on the second carrying part. The second carrying part has third alignment portions. The second substrate part has fourth alignment portions. The top-plate and the bottom-plate are assembled by the first and third alignment portions. The first and second substrate parts are positioned by the second and fourth alignment portions. Each photoelectric device is disposed on the first substrate part. Each light-guiding element is disposed between the first and second substrate parts.
    Type: Application
    Filed: December 20, 2012
    Publication date: October 17, 2013
    Applicant: CENTERA PHOTONICS INC.
    Inventors: Hsu-Liang Hsiao, Guan-Fu Lu, Tzu-Ching Yeh, Chun-Chiang Yen
  • Publication number: 20120241600
    Abstract: An optical electrical module includes a first substrate, a second substrate, a bearing portion and at least one optical electrical element. The second substrate is combined with the first substrate and has a reflective surface facing to the first substrate. The bearing portion is disposed between the first substrate and the second substrate to limit at least one light guide element. The optical electrical element is disposed on a surface of the first substrate facing to the reflective surface and faces to the reflective surface. The optical electrical element is configured for providing or receiving light signals. The reflective surface and the light guide element are disposed on an optical path of the light signals.
    Type: Application
    Filed: March 18, 2012
    Publication date: September 27, 2012
    Applicant: CENTERA PHOTONICS INC.
    Inventors: Yun-Chih Lee, Chang-Feng Lu, Chun-Chiang Yen, Shang-Jen Yu, Hsu-Liang Hsiao
  • Publication number: 20120241795
    Abstract: The present invention provides an optoelectronic module including a substrate, an optoelectronic device and a control unit. The substrate includes a top surface, a bottom surface, a concave structure, a through hole structure and a conductive material. The concave structure is disposed on the top surface. The through hole structure passes through the substrate from the top surface to the bottom surface. The conductive material is filled into the through hole structure. The optoelectronic device is disposed on the substrate for providing or receiving an optical signal. The control unit is configured on the top surface and electrically connected to the conductive material and the optoelectronic device for controlling the optoelectronic device.
    Type: Application
    Filed: March 22, 2012
    Publication date: September 27, 2012
    Applicant: Centera Photonics Inc.
    Inventors: Chia-Chi CHANG, Guan-Fu Lu, Chun-Chiang Yen