Abstract: A probe card device and a transmission structure are provided. The transmission structure includes a supporting layer, a plurality of metal conductors spaced apart from each other and slantingly inserted into the supporting layer, and an insulating resilient layer formed on the supporting layer. Each of the metal conductors includes a positioning segment held in the supporting layer, a connecting segment and an embedded segment respectively extending from two ends of the positioning segment, and an exposed segment extending from the embedded segment. Each of the embedded segments is embedded and fixed in the insulating resilient layer, and each of the exposed segments protrudes from the insulating resilient layer. When any one of the exposed segments is pressed by an external force, the insulating resilient layer is configured to absorb the external force through the corresponding embedded segment so as to have a deformation providing a stroke distance.

Abstract: A cantilever probe card device and a focusing probe thereof are provided. The focusing probe includes a soldering segment, a testing segment, two outer elastic arms spaced apart from each other, and a focusing portion. The testing segment is spaced apart from the soldering segment along an arrangement direction, and has a needle tip, an outer edge, and an inner edge that is opposite to the outer edge. Each of the two outer elastic arms has two end portions respectively connected to the soldering segment and the inner edge of the testing segment. The focusing portion is connected to the inner edge and is located between the needle tip and the two outer elastic arms, and has a plurality of focusing points arranged on one side thereof away from the two outer elastic arms.

Abstract: A cantilever probe card and a carrier thereof are provided. The carrier includes a seat, a metal sheet, and a plurality of coarse adjustment members. The metal sheet is assembled to the seat and has a carrying surface. The coarse adjustment members are spaced apart from each other and are disposed between the seat and the metal sheet. Each of the coarse adjustment members is configured to be independently operable along a testing direction for changing a distance between the carrying surface and the seat. The carrying surface has a plurality of assembling regions spaced apart from each other, and at least two of the assembling regions have an assembling tolerance therebetween along the testing direction. The metal sheet of the carrier is deformable through at least one of the coarse adjustment members so as to reduce the assembling tolerance along the testing direction.

Abstract: A board-like connector, a single-arm bridge of a board-like connector, and a wafer testing assembly are provided. The board-like connector includes a plurality of single-arm bridges spaced apart from each other and an insulating layer. Each of the single-arm bridges includes a carrier, a cantilever extending from and being coplanar with the carrier, an abutting column, and an abutting end portion, the latter two of which extend from the cantilever and are respectively arranged at two opposite sides of the cantilever. The insulating layer connects the carriers of the single-arm bridges, and the abutting column of each of the single-arm bridges protrudes from the insulating layer. The abutting column and the abutting end portion of each of the single-arm bridges are configured to abut against two boards, respectively.

Abstract: A board-like connector, a dual-arm bridge of a board-like connector, and a wafer testing assembly are provided. The board-like connector includes a plurality of dual-arm bridges spaced apart from each other and an insulating layer. Each of the dual-arm bridges includes a carrier, a first cantilever, a second cantilever, a first abutting column, and a second abutting column, the latter two of which extend from the first and second cantilevers along two opposite directions. The first cantilever and the second cantilever extend from and are coplanar with the carrier. The insulating layer connects the carriers of the dual-arm bridges. The first abutting column and second abutting column of each of the dual-arm bridges respectively protrude from two opposite sides of the insulating layer, and are configured to abut against two boards, respectively.

Abstract: A probe card device and a self-aligned probe are provided. The self-aligned probe includes a fixing end portion configured to be abutted against a space transformer, a testing end portion configured to detachably abut against a device under test (DUT), a first connection portion connected to the fixing end portion, a second connection portion connected to the testing end portion, and an arced portion that connects the first connection portion and the second connection portion. The fixing end portion and the testing end portion jointly define a reference line passing there-through. The first connection portion has an aligned protrusion, and a maximum distance between the arced portion and the reference line is greater than 75 ?m and is less than 150 ?m.

Abstract: A board-like connector, a dual-ring bridge of a board-like connector, and a wafer testing assembly are provided. The board-like connector includes a plurality of dual-ring bridges spaced apart from each other and an insulating layer. Each of the dual-ring bridges includes two carrying rings, two cantilevers respectively extending from and being coplanar with the two carrying rings, two abutting columns respectively extending from the two cantilevers along two opposite directions, and a bridging segment that connects the two carrying rings. The insulating layer connects the two carrying rings of the dual-ring bridges, and the two abutting columns of the dual-ring bridges respectively protrude from two opposite sides of the insulating layer. The two abutting columns of each of the dual-ring bridges are configured to be respectively abutted against two boards.

Abstract: A probe card device and a dual-arm probe are provided. The dual-arm probe has a probe length, and includes a bifurcation end portion and a testing end portion. The dual-arm probe has two broad side surfaces respectively arranged on two opposite sides thereof. The dual-arm probe has a separation slot that is recessed from a bifurcation opening of the bifurcation end portion toward the testing end portion and that penetrates from one of the two broad side surfaces to the other one, so that two branch arms of the dual-arm probe are defined by the separation slot and are spaced apart from each other. The separation slot has a slot length being 50% to 90% of the probe length. In a cross section of the two branch arms, an area of any one of the two branch arms is 90% to 110% of that of the other one.

Abstract: A probe card device and a disposable adjustment film thereof are provided. The disposable adjustment film is integrally formed as a single one-piece structure, and includes a probe hole and a plurality of first slots that are parallel to each other. The disposable adjustment film defines two predetermined lines respectively extending from two opposite lateral edges thereof to the probe hole. The two predetermined lines respectively extend across the first slots. In a plane that the disposable adjustment film is located thereon, when the disposable adjustment film is applied with forces that act in opposite directions and that are parallel to any one of the first slots, the disposable adjustment film is broken into two abandoned films along the two predetermined lines.

Abstract: A probe card device and a spring-like probe are provided. The spring-like probe defines a longitudinal direction and a separation plane that is parallel to the longitudinal direction, and includes a fixing end portion, a testing end portion, and two stroke arms that are arranged between the fixing end portion and the testing end portion. The two stroke arms are spaced apart from each other and are respectively located at two opposite sides of the separation plane. Each of the two stroke arms is in a curved shape. Two projection regions defined by orthogonally projecting the two stroke arms onto the separation plane have at least one intersection point. In a cross section of the two stroke arms perpendicular to the longitudinal direction, an area of any one of the two stroke arms is 95% to 105% of an area of another one of the two stroke arms.

Abstract: A split thin-film probe card and an elastic module thereof are provided. The elastic module includes an elastic cushion and a thin-film sheet. The elastic cushion has a plurality of partition slots so as to define a plurality of independent elastic segments. The thin-film sheet includes a carrier, a plurality of signal circuits disposed on the carrier, and a plurality of conductive protrusions that are respectively formed on the signal circuits. The carrier has a plurality of grooves so as to divide the carrier into a plurality of action segments respectively disposed on the independent elastic segments. The signal circuits are respectively disposed on the action segments. When any one of the conductive protrusions is pressed, only the corresponding independent elastic segment is deformed through the corresponding signal circuit and the corresponding action segment.

Abstract: A probe card device and a fence-like probe thereof are provided. The fence-like probe includes a stroke segment, a fan-out segment, and a testing segment. The stroke segment is in an elongated shape defining a longitudinal direction, and the stroke segment has two end portions and a plurality of penetrating slots that are arranged along a fan-out direction perpendicular to the longitudinal direction, so that the stroke segment is deformable to store an elastic force by being applied with a force. The fan-out segment and the testing segment are respectively connected to the two end portions of the stroke segment. The fan-out segment has a fixing point arranged away from the stroke segment, and the testing segment has an abutting point arranged away from the stroke segment. Along the fan-out direction, the fixing point is spaced apart from the abutting point by a fan-out distance.

Abstract: A probe card device and a neck-like probe thereof are provided. The neck-like probe includes a conductive pin and a ring-shaped insulator. The conductive pin includes a stroke segment and two end segments extending from the stroke segment. The stroke segment has two broad side surfaces and two narrow side surfaces, and each of the broad side surfaces has a long slot extending from one of the narrow side surfaces to the other one. The two long slots have a minimum distance therebetween that is 75%-95% of a maximum distance between the two broad side surfaces. The ring-shaped insulator surrounds a portion of the conductive pin having the two long slots, and a portion of the neck-like probe corresponding in position to a part of the ring-shaped insulator on the two broad side surfaces has a thickness that is 85%-115% of the maximum distance.

Abstract: A probe card device and a directivity probe thereof are provided. The directivity probe having an elongated shape includes a conductive pin and a ring-shaped insulator. The conductive pin includes a stroke segment and two end segments respectively extending from the stroke segment. The stroke segment has two broad side surfaces and two narrow side surfaces, and has only one transverse slot that is recessed in one of the two broad side surfaces and that extends from one of the two narrow side surfaces to the other narrow side surface. The transverse groove has a maximum depth that is 1%-10% of a maximum distance between the two broad side surfaces. The stroke segment of the directivity probe can be bent by applying a force to the two end segments, and an inflection point of the bent stroke segment is located in the transverse slot.

Abstract: A thin-film probe card and a test module thereof are provided. The test module includes a carrying unit, a plurality of vertical probes fixed in position by the carrying unit, an elastic cushion disposed on the carrying unit, and a thin sheet. The thin sheet includes a carrier partially disposed on the elastic cushion, a plurality of signal circuits disposed on the carrier, and a plurality of electrically conductive protrusions that are respectively formed on the signal circuits. An end of the vertical probes is arranged at an inner side of the electrically conductive protrusions and is coplanar with free ends of the electrically conductive protrusions.

Abstract: A staggered probe card and a conductive probe are provided. The staggered probe card includes an upper guide board, a lower guide board spaced apart from the upper guide board, and a plurality of conductive probes arranged in rows and passing through the upper and lower guide boards. Each of the conductive probes has an elongated structure defining a longitudinal direction, and includes a bottom surface and two long side surfaces respectively connected to two edges of the bottom surface. A distance between the two long side surfaces gradually decreases in a tapering direction that extends away from the bottom surface. In two of the rows of the conductive probes adjacent to each other, any two long side surfaces respectively belonging to the two adjacent rows and arranged adjacent to each other have a lateral interval along a direction that is non-parallel to the arrangement direction.

Abstract: An integrated circuit with antenna in package (AiP IC) testing apparatus is provided, and includes: a carrier board, a test socket, and a receiving antenna circuit board. The test socket is disposed on the carrier board and configured to carry an AiP IC which emits a wireless signal. The receiving antenna circuit board is adjacent to the test socket and configured to receive the wireless signal. The receiving antenna circuit board and the reflector are integrated into the AiP IC testing apparatus, so that the AiP IC testing apparatus can be used not only for testing a feedback signal transmitted by a test pin of the IC, but also for testing the wireless signal from the IC.

Abstract: The present disclosure provides a probe card device and a conductive probe thereof. The conductive probe includes a metallic pin, an outer electrode, and a dielectric layer. The metallic pin includes a middle segment, a first connecting segment and a second connecting segment respectively extending from two opposite ends of the middle segment, and a first contacting segment and a second contacting segment respectively extending from the first connecting segment and second contacting segment along two opposite directions away from the middle segment. At least part of the outer electrode corresponds in position to the middle segment and is arranged adjacent to the first connecting segment. The dielectric layer is sandwiched between and entirely separates the metallic pin and the outer electrode, so that the outer electrode, the dielectric layer, and the metallic pin are jointly configured to generate a capacitance effect.

Abstract: A probe card device includes a first die, a second die, and a plurality of rectangular probes. Each of the rectangular probes includes a middle segment, two extending segments, and two contact end segments. In each of the rectangular probes, the two extending segments are respectively arranged in the first die and the second die, the two contact end segments respectively extend from two opposite ends of the two extending segments along a direction away from the middle segment, each of the two contact end segments includes a conductive portion, and at least one of the two contact end segments includes a piercing portion partially embedded in the conductive portion thereof. A conductivity of the piercing portion is less than that of each of the two conductive portions, and a Vickers hardness number of the piercing portion is larger than that of each of the two conductive portions.

Abstract: A three-dimensional (3D) signal transfer structure of a probe card device includes a transfer plate, a supporting frame, and a guiding plate. The transfer plate has a first surface and a second surface that is opposite to the first surface. The transfer plate includes a plurality of signal circuits each having a signal contact arranged on the first surface. The supporting frame is abutted against and fixed onto the first surface of the transfer plate. A portion of the first surface abutted against the supporting frame is arranged outside the signal contacts. The guiding plate has a plurality of thru-holes and is disposed on the supporting frame. The guiding plate, the supporting frame, and the transfer plate jointly and surroundingly define a receiving space, and the signal contacts of the transfer plate are arranged in the receiving space.