Abstract: A computer system shares memory between multiple processors by dividing the memory into a plurality of sections, subsections, and banks, and by providing a memory path between each processor and each section of memory. Each processor may generate references to the memory from any one of four ports, which are multiplexed to the memory paths and onto the sections of memory. The system provides that each processor has an associated register in each subsection of memory and that each processor can make no more than one reference to a subsection at a time. Reference conflict resolution means are provided at the processor level to arbitrate conflicts between ports in the processors attempting to reference the same section or subsection in the memory. Reference conflict resolution means are provided at the subsection level of the memory to arbitrate conflicts between different processors attempting to reference the same banks of memory.

Abstract: A ceramic chip carrier package for integrated circuits is described which provides reduced interlead capacitance. A cavity for the placement of the integrated circuit chip is centrally located on a substrate. The leads of the package are bridged between the cavity and the outer periphery of the substrate. The leads are bonded to the substrate using adhesive glass placed on the substrate at the outer periphery of the cavity and at the outer periphery of the substrate. Sealing glass is placed on the outer periphery of the substrate over the leads to provide a bonding material for a lid to the package. The area between the cavity and the outer periphery of the substrate has no adhesive or sealing glass which thus provides an air dielectric between the leads so that interlead capacitance is reduced.

Abstract: A circuit board module for a supercomputer includes quick connections for power, ground, coolant quick connects, and circuit quick connects. The quick connections provide for insertion of modules with substantial savings in time and effort. The electrical power and ground connections and the liquid coolant connections engage and disengage automatically upon insertion and removal of the modules. The circuit quick connects require only insertion of a camming tool for connection and disconnection. The modules require no bolting or unbolting of clamps or hoses for the various connections.

Abstract: Z-axis pin connectors for interconnecting stacked printed circuit boards are formed from resilient material and have contact sections larger than cooperating through-plated holes formed in the boards. The pin connectors are drawn through the through-plated holes in the stacked circuit board, causing the contact section of the pin connector to frictionally engage the through-plated holes on at least two boards.

Abstract: A multiple disk drive array storage device is described which emulates the operation of a single disk drive so that the handshaking and protocol between the array storage device and the host computer appears to the host computer to be that of a single disk drive. The array storage device includes a plurality of individual disk drives, each of which having its spindle synchronized to the other disk drives using a master clock synchronization. Digital data words are received by the array storage device controller which divides the words into subparts and writes each subpart to a different disk drive within the storage device. The buffering and formatting of the digital data for reading and writing from the individual disk drives is accomplished by the controller transparent to the host computer.

Abstract: A flexible automated bonding apparatus electrically interconnects integrated circuit carriers, printed circuit boards, and other devices. A metallized interconnect pattern is deposited on the surface of the substrate. The metallized interconnects in the pattern span apertures created in the substrate using an excimer laser. Thus, the metallized interconnects can be electrically bonded through the apertures to elements lying underneath the substrate.

Abstract: The present invention provides an improved method for manufacturing circuit boards with high power, high density interconnects. Printed circuit board technology, integrated circuit technology, and heavy-build electroless plating are combined to produce multilayer circuit boards comprised of substrates with different interconnect densities. In the higher density substrates, thick metallized layers are built-up by combining additive and subtractive technique. These thicker foils minimize DC voltage drop so that conductors can run for longer distances. The conductors are substantially more square than their thin film equivalents, thus providing better performance for high frequency signals. Power distribution capabilities are enhanced by the present invention, so that circuit boards fully populated with dense, high-speed, high-power integrated circuits can easily be supplied with their necessary power requirements.

Abstract: A system for scheduling instruction issuance in a vector register computer achieves increased efficiency of operation by performing pre-issuance checks to determine if resources requested by the instruction will be available when the instruction issues. A decoding apparatus first determines particular resources requested by the instruction, which includes apparatus for decoding vector register requests, functional unit requests, and address and scalar register path requests. Following decoding, a conflict resolution apparatus checks resource reservation flags to determine if the requested resources will be available when the instruction issues. If any requested resources will be busy, the system issues a primary conflict signal. At the scheduled instruction issuance time, the system again checks the resource reservation flags in response to the primary conflict signal.

Abstract: An electrical backplane makes high density electrical connections with logic boards in a computer system. The electrical backplane is comprised of an assembly pressure connector and a connector interconnect board that connects the logic boards to external wiring. The assembly pressure connector has electrical contact bumps on its surfaces for making electrical connections with contact points on the surface of the logic boards. The assembly pressure connector prevents the permanent deformation of its electrical contact bumps by using resilient bumps. The resilient bumps are formed from the end portions of interconnecting wires extending through the assembly pressure connector. The interconnecting wires are bent in the shape of a leaf spring. Thus, the wires are compressed within the elastic range of their composing material and are not permanently deformed by the force applied to the assembly pressure connector.

Abstract: A generic chip carrier is described which includes, as integral parts, a voltage bus and a plurality of terminating resistors connected between the voltage bus and signal traces on the carrier. The voltage bus wraps around the chip carrier, thus providing a large area of metal. Through the selective use of the terminating resistors, the generic carrier can be customized for a particular type of integrated circuit, i.e., source or destination termination of signals. A signal trace may be customized by "operating" the terminating resistor with a current spike applied by a standard electrical probe. Spare bonding pads and terminating resistors are placed at intervals about the periphery of the carrier as insurance against defective or mistakenly removed terminating resistors.

Abstract: A high reliability, non-blocking air filter for filtering large volumes of low pressure air from equipment to be maintained free of dust and impurities while being ventilated during operation is disclosed. The filter media is mounted in a frame having a U-shaped cross section construction, which is attached over an air intake opening of the piece of equipment. The filter media includes a planar base surface and a plurality of projections. The tops of the projections define a surface above said planar base surface for supporting free-flowing articles so as such that these articles do not obstruct the air flow through the air intake filter.

Abstract: Z-axis pin connectors for interconnecting stacked printed circuit boards are formed from resilient material and have contact sections larger than cooperating through-plated holes formed in the boards. The pin connectors are drawn through the through-plated holes in the stacked circuit board, causing the contact section of the pin connector to frictionally engage the through-plated holes on at least two boards. Formation of pin connectors from a resilient thermoplastic material coated with a conductive layer is also disclosed.

Abstract: A method and apparatus for interconnecting circuit board assemblies using memory metal wires mechanically inserted into through-plated holes. The invention has its application in the interconnection of stacked circuit board assemblies where kinked memory metal wires are stretched so the wires are substantially straight; inserted into axially aligned through-plated holes of circuit boards; and released so that the memory metal wires reform their original kinked shaped within the through-plated holes, forming an electrical connection between the circuit boards. Memory metal alloys are used in the construction of the kinked memory metal wires to take advantage of the pseudoelastic behavior of the alloys in the austenitic phase below the forming temperature range.

Abstract: An integrated circuit chip carrier having reduced and predicable interlead capacitance, reduced glass chip formation, and improved wirebonding characteristics is disclosed. The chip carrier includes a substrate having a central cavity for locating an integrated circuit die, an inner channel and an outer channel, adhesive glass located in the channels and overflowing above the substrate surface, a leadframe mounted on the substrate having a plurality of leads embedded in the adhesive glass overflow and coplanarly resting on the substrate, the leads extending from beyond the substrate periphery inward to near the cavity rim, and a thin layer of sealing glass extending from the periphery of the substrate over the outer channel for hermetically sealing the chip carrier.

Abstract: An air-jet impingement cooling method combined with a miniature pin-fin heat sink provides equivalent fluid flow to each IC package in a module and achieves a high heat transfer rate per volume. The packaging design is comparable to high-density packaging systems utilizing low-temperature coolant.

Abstract: The present invention discloses an improved method and apparatus for dissipating heat from printed circuit boards and electronic devices mounted thereon. Printed circuit boards are provided with apertures therethrough for receiving thermal conductor pads. The thermal conductor pads may be secured in the apertures through the use of glue or by means of an interference fit. Glue may also be deposited on top of the thermal conductor pad to secure an electronic device thereto. The glue is cured in a manner that limits its thickness to a minimum value. The electronic device may be further secured to the printed circuit board by wave soldering. The opposite end of the thermal conductor pad contacts the cold plate.

Abstract: An electrical end connector (10) of the zero insertion force type includes a pair of opposing blocks (21, 40), one of which blocks is slideably mounted in a housing (22). Opposite corresponding pairs of female receptacles (34) and male pins (31) are cooperatively mounted on the opposing blocks (21, 40). The housig (22) has two sets of oppositely disposed windows formed through the longitudinal ends. One block (40) has a channel formed therethrough, such that the block (40) is urged transversely upon insertion of a cam-like slider device (70), thereby selectively engaging or disengaging the male pins (31) and female receptacles (43).