Abstract: A saccharide residue-functional organopolycarbosiloxane containing at least two monosaccharide or polysaccharide groups per molecule in which a specific site on the monosaccharide or polysaccharide is bonded to silicon through a thioether bond. Also, a method of preparing the saccharide residue-functional organopolycarbosiloxane, comprising condensing a saccharide residue-functional metal thiolate compound wherein the metal is an alkali metal atom or alkaline-earth metal atom, and an organopolycarbosiloxane containing groups having the formula —R2Q wherein R2 is C2 to C10 alkylene, and Q is a group selected from halogen atoms, C1 to C10 alkylsulfonate groups, and C6 to C20 arylsulfonate groups.

Abstract: An electrically conductive silicone rubber composition comprises, at least, (A) 100 parts by weight of an organopolysiloxane having at least two alkenyl groups per molecule, (B) an organopolysiloxane having at least two silicon-bonded hydrogen atoms per molecule (an amount sufficient to cure the present composition), (C) a platinum based catalyst (an amount sufficient to promote the cure of the present composition), (D) 50 parts by weight to 5,000 parts by weight of a metal based electrically conductive filler, and (E) 5 parts by weight to 500 parts by weight of spherical silicone rubber particles with a surface active agent content of not more than 0.3 wt %.

Abstract: Method for preparation of an aqueous emulsion from a curable silicone composition consisting of (A) an organopolysiloxane having at least two silicon-bonded hydroxyl groups, (B) an organohydrogensiloxane, and (C) a curing catalyst, said method being characterized by (i) continuously supplying component (A), component (B) and component (C), or a mixture of components (A) and (B) and component (C) through individual inlet ports into a continuous mixer and mixing said components at a temperature not exceeding 10° C., (ii) continuously supplying the obtained mixture and (D) an aqueous solution of a surface-active agent to an emulsifier, and emulsifying the components at a temperature not exceeding 20° C. An apparatus for the preparation of an aqueous emulsion of a curable silicone composition comprising of a continuous mixer for mixing components (A) through (C), a distribution unit connected to the lower part of the mixer, and an emulsifier.

Abstract: A curable organic resin composition comprising (A) 100 parts by weight of a curable organic resin and (B) 0.01 to 100 parts by weight of a thiocyanato-containing organohydrocarbonoxysilane or an isothiocyanato-containing organohydrocarbonoxysilane represented by the general formula: X—R1—Si(OR2)nR33-n, wherein X is NCS— or SCN—, R1 is an alkylene or alkyleneoxyalkylene group, R2 and R3 are monovalent hydrocarbon groups, and the subscript n is 1, 2, or 3. The curable organic resin composition possesses superior moldability and, when cured, exhibits superior adhesive properties on substrates such as metals.

Abstract: A film-forming silicone resin composition, comprising a reaction product obtained by a method comprising the step of heating (A) an alkoxysilyl-functional organopolysiloxane obtained by running an equilibration reaction with components comprising (A1) a polydiorganosiloxane and (A2) an alkylpolysilicate in the presence of (A3) an equilibration polymerization catalyst; (B) colloidal silica, aluminum oxide, antimony oxide, titanium oxide, or zirconium oxide; and (C) water, and a curable film-forming silicone resin composition, comprising above film-forming silicone resin composition and (E) a condensation reaction catalyst.

Abstract: A saccharide residue-functional organopolysiloxane containing at least two monosaccharide or polysaccharide groups per molecule in which a specific site on the monosaccharide or polysaccharide is bonded to silicon through a thioether bond. Also, a method of preparing the saccharide residue-functional organopolysiloxane, comprising condensing a saccharide residue-functional metal thiolate compound wherein the metal is an alkali metal atom or alkaline-earth metal atom. and an organopolysiloxane containing groups having the formula —R2 Q wherein R2 is C2 to C10 alkylene, and Q is a group selected from halogen atoms, C1 to C10 alkylsulfonate groups, and C6 to C20 arylsulfonate groups.

Abstract: A heat-conductive silicone composition comprising at least (A) an organopolysiloxane, (B) a heat-conductive filler, and (C) a specific organosiloxane. The silicone composition is excellent in handleability, even when it contains a large amount of a heat-conductive filler for the purpose of attaining higher heat conductivity.

Abstract: The invention relates to a straight-oil finishing composition comprising (A) 100 parts by weight of a polydimethylsiloxane oil or liquid paraffin having a viscosity of 3 to 70 mm2/s at 25 centigrade temperature; and (B) 0.5 to 100 parts by weight of an organopolysiloxane resin, which contains silanol groups and silicon-bonded alkoxy groups and wherein 20 mole % or more of all siloxane units are siloxane units represented by formula C3H7SiO3/2. This composition is useful for treating fiber yarn.

Abstract: An aqueous suspension of cross-linked silicone particles comprising (A) cross-linked silicone particles having an average diameter of 0.1 to 500 ?m, (B) polyoxyethylene sorbitan monolaurate, and (C) water. And, in a second embodiment, an aqueous emulsion of cross-linked silicone particles comprising (A) cross-linked silicone particles having an average diameter of 0.1 to 500 ?m, (B) polyoxyethylene sorbitan monolaurate, (C) water, and (D) oil.

Abstract: A room-temperature-curable silicone rubber composition comprising (A) 100 parts by weight of a polydiorganosiloxan mixture comprising: (A-1) 20 to 95 wt. % of a polydiorganosiloxane having both molecular terminals capped with dialkoxysilyl groups or trialkoxysilyl groups, (A-2) 5 to 80 wt. % of a polydiorganosiloxane having a molecular terminal capped with dialkoxysilyl group or trialkoxysilyl group and the other molecular terminal capped with monoalkoxysilyl group, hydrosilyl group, trialkylsilyl group or trialkoxyalkylsilyl group, and (A-3) 0 to 30 wt. % of a polydiorganosiloxane having both molecular terminals capped with monoalkoxysilyl group, hydlosilyl group, trialkylsilyl group or trialkoxyalkylsilyl group, (B) one or more alkoxysilanes of the formula R5bSi(OR6)4-b or partial hydrolysis and condensation products thereof, and (C) an organotitanium compound. The composition is used as a sealant.

Abstract: A curable organopolysiloxane composition capable of forming cured products of superior optical transmittance exhibiting little heat-induced yellowing over time. A semiconductor device having semiconductor elements encapsulated in a cured product of the composition. The composition includes (A) an organopolysiloxane having at least two silicon-bonded alkenyl groups per molecule and bearing silicon-bonded aryl groups, whose content relative to all silicon-bonded organic groups is not less than 40 mol %, (B) an organopolysiloxane having at least two silicon-bonded hydrogen atoms per molecule, and (C) an organosiloxane oligomer complex of platinum, where the oligomer has not more than eight silicon atoms per molecule and bears silicon-bonded alkenyl groups and silicon-bonded aryl groups.

Abstract: A saccharide residue-functional organopolysiloxane containing at least two monosaccharide or polysaccharide groups per molecule in which a specific site on the monosaccharide or polysaccharide is bonded to silicon through a thioether bond. Also, a method of preparing the saccharide residue-functional organopolysiloxane, comprising condensing a saccharide residue-functional metal thiolate compound wherein the metal is an alkali metal atom or alkaline-earth metal atom, and an organopolysiloxane containing groups having the formula —R2Q wherein R2 is C2 to C10 alkylene, and Q is a group selected from halogen atoms, C1 to C10 alkylsulfonate groups, and C6 to C20 arylsulfonate groups.

Abstract: Method for preparation of an aqueous emulsion from a curable silicone composition consisting of (A) an organopolysiloxane having at least two silicon-bonded hydroxyl groups, (B) an organohydrogensiloxane, and (C) a curing catalyst, said method being characterized by (i) continuously supplying component (A), component (B) and component (C), or a mixture of components (A) and (B) and component (C) through individual inlet ports into a continuous mixer and mixing said components at a temperature not exceeding 10° C., (ii) continuously supplying the obtained mixture and (D) an aqueous solution of a surface-active agent to an emulsifier, and emulsifying the components at a temperature not exceeding 20° C. An apparatus for the preparation of an aqueous emulsion of a curable silicone composition comprising of a continuous mixer for mixing components (A) through (C), a distribution unit connected to the lower part of the mixer, and an emulsifier.

Abstract: A cross-linked silicone adhesive sheet has stability of peeling surfaces during peeling protective films away from both sides of the sheet. An adhesive sheet of a cross-linked silicone has protective films on both sides of the sheet. The protective films each have a thickness of 100 ?m or less. A force of peeling of the protective films from the sheet is equal to or below 5.0 N/m. The difference between peeling forces of the films is equal to or exceeds 0.2 N/m. A method of manufacturing the adhesive sheet of a cross-linked silicone includes the steps of forming a film-like body by placing a cross-linkable silicone composition in a layer having a thickness of 100 ?m or less between two protective films of different materials and then cross-linking the composition.

Abstract: A method for manufacturing metal salts of radical-polymerizable compounds with reduced amount of water in the below-mentioned component (A) by subjecting an aqueous solution of an alkali-metal salt, alkali earth-metal salt, or a zinc salt of the radical-polymerizable compound (A) to heating under a reduced pressure in the presence of an aqueous polymerization inhibitor for removal of aqueous components by distillation from aforementioned compounds (A).

Abstract: A curable epoxy resin composition comprising at least: (A) a crystalline epoxy resin, (B) a phenol resin, and (C) a silicone resin composed of epoxy-containing organic groups and phenyl groups that define an average unit formula of this component. Component (C) is used in an amount of 0.1 to 500 parts by weight for 100 parts by weight of the sum of weights of components (A) and (B). The composition of the invention is suitable for transfer and injection molding and may find use as a curable epoxy resin composition for sealing parts of electrical and electronic devices.

Abstract: A photocurable organic polymer composition can be quickly cured into a moisture-penetration-resistant solid body by irradiation with ultraviolet rays, electron beams, or the like, and imparts adhesiveness to a cured body after aging. The photocurable organic polymer composition includes: (D) a photoinitiator and either (I) a composition or (II) a reaction product; where (I) the composition includes (A) a liquid organic polymer having at least one hydroxy group per molecule; (B) a radiation curable alkoxysilane; and (C) a condensation-reaction catalyst; and (II) the reaction product comprises (F) a reaction product of components (A), (B), and (C).

Abstract: Liquid alkoxysilyl-functional silicone resins having excellent storage stability and a method of preparing these liquid alkoxysilyl-functional silicone resins comprising running an equilibration polymerization reaction with components comprising (A) a polydiorganosiloxane and (B) an alkyl polysilicate in the presence of (C) an equilibration polymerization catalyst. Curable silicone resin compositions comprising the aforesaid liquid alkoxy-functional silicone resins which have excellent curability and when cured form a water-repellent coating on a variety of substrate surfaces.

Abstract: An anisotropically electroconductive adhesive film is characterized by containing an electroconductive elastomer that traverses the thickness of the adhesive film and is insulated in the plane of the adhesive film comprising electrically insulating elastomer, and both the electroconductive elastomer and the electrically insulating elastomer have a modulus of elasticity at 150° C. that is no greater than 100 MPa. A method for producing the anisotropically electroconductive adhesive film is characterized by forming through holes across the thickness of the adhesive film comprising electrically insulating elastomer, thereafter filling the through holes with an electroconductive elastomer composition, and curing the electroconductive elastomer composition to form the electroconductive elastomer after filling the through holes.

Abstract: A process for preparing a silicone compound, the process comprising reacting (A) a silicon compound having silicon-bonded alkoxy groups or silicon-bonded aryloxy groups and (B) a disiloxane in the presence of (C) a carboxylic acid, (D) an acid catalyst, and (E) a carboxylic anhydride, and a process for preparing a silicone compound, the process comprising reacting (F) a silicon compound having silicon-bonded acyloxy groups and (B) a disiloxane compound in the presence of (D) an acid catalyst, (E) a carboxylic anhydride, and (G) an alcohol.