Patents Assigned to Duksan Hi-Metal Co., Ltd.
  • Patent number: 10661394
    Abstract: Disclosed is a metal core solder ball having improved heat conductivity, including a metal core having a diameter of 40˜600 ?m, a first plating layer formed on the outer surface of the metal core, and a second plating layer formed on the outer surface of the first plating layer.
    Type: Grant
    Filed: November 18, 2013
    Date of Patent: May 26, 2020
    Assignee: DUKSAN HI-METAL CO., LTD.
    Inventors: Yong Cheol Chu, Hyun Kyu Lee, Jung Ug Kwak, Seung Jin Lee, Sang Ho Jeon, Yong Sik Choi
  • Patent number: 10651414
    Abstract: A metal nanowire according to an embodiment of the invention includes at least one bent portion. An angle (?) between an n-th wire portion and an (n+1)-th wire portion connected to the n-th wire portion through an n-th bent portion satisfies an inequation of 0°<?<180°.
    Type: Grant
    Filed: June 21, 2018
    Date of Patent: May 12, 2020
    Assignee: Duksan Hi-Metal Co., Ltd.
    Inventors: Young Zo Yoo, Yoon Soo Choi, Yeong Jin Lim
  • Patent number: 10636994
    Abstract: A metal nanowire according to an embodiment of the invention includes at least one bent portion. An angle (?) between an n-th wire portion and an (n+1)-th wire portion connected to the n-th wire portion through an n-th bent portion satisfies an inequation of 0°<?<180°.
    Type: Grant
    Filed: June 21, 2018
    Date of Patent: April 28, 2020
    Assignee: DUKSAN HI-METAL CO., LTD
    Inventors: Young Zo Yoo, Yoon Soo Choi, Yeong Jin Lim
  • Patent number: 10629838
    Abstract: A metal nanowire according to an embodiment of the invention includes at least one bent portion. An angle (?) between an n-th wire portion and an (n+1)-th wire portion connected to the n-th wire portion through an n-th bent portion satisfies an inequation of 0°<?<180°. Also, a metal nanowire according to another embodiment of the invention includes at least two wire portions. The metal nanowire includes an n-th wire portion and an (n+1)-th wire portion connected to the n-th wire portion. A diameter of the n-th wire portion is different from a diameter of the (n+1)-th wire portion. In addition, a core-shell nanowire according to yet another embodiment includes a nanowire core; and a metal-compound shell formed on the nanowire core. A method of manufacturing a metal nanowire according to an embodiment includes preparing a reaction mixture and synthesizing a nanowire.
    Type: Grant
    Filed: January 26, 2015
    Date of Patent: April 21, 2020
    Assignee: DUKSAN HI-METAL CO., LTD.
    Inventors: Young Zo Yoo, Yoon Soo Choi, Yeong Jin Lim
  • Publication number: 20180026224
    Abstract: A nanowire according to an embodiment of the invention comprises a nanowire core and a metal-compound coated on the nanowire core, wherein the nanowire core comprises at least two bent portions, and wherein an angle (?) between an n-th wire portion and an (n+1)-th wire portion connected to the n-th wire portion through an n-th bent portion satisfies an inequation of 0<?<180°.
    Type: Application
    Filed: January 26, 2015
    Publication date: January 25, 2018
    Applicant: DUKSAN HI-METAL CO., LTD.
    Inventors: Young Zo YOO, Yoon Soo CHOI, Yeong Jin LIM
  • Publication number: 20140183733
    Abstract: Disclosed is a metal core solder ball having improved heat conductivity, including a metal core having a diameter of 40˜600 ?m, a first plating layer formed on the outer surface of the metal core, and a second plating layer formed on the outer surface of the first plating layer.
    Type: Application
    Filed: November 18, 2013
    Publication date: July 3, 2014
    Applicant: DUKSAN HI-METAL CO., LTD
    Inventors: Yong Cheol CHU, Hyun Kyu LEE, Jung Ug KWAK, Seung Jin LEE, Sang Ho JEON, Yong Sik CHOI
  • Patent number: 8221560
    Abstract: Disclosed herein are a lead-free solder alloy and a manufacturing method thereof. More specifically, disclosed are: a lead-free solder alloy, which comprises 0.8-1.2 wt % silver (Ag), 0.8-1.2 wt % copper (Cu), 0.01-1.0 wt % palladium (Pd), 0.001-0.1 wt % tellurium (Te), and a balance of tin (Sn), and thus has a melting point similar to those of prior lead-free solder alloys, excellent wettability, very low segregation ratio, and excellent weldability with a welding base metal, such that it improves temperature cycle performance and drop impact resistance simultaneously, when it is applied to electronic devices and printed circuit boards; a manufacturing method of the above alloy; and electronic devices and printed circuit boards which include the same.
    Type: Grant
    Filed: September 4, 2008
    Date of Patent: July 17, 2012
    Assignee: Duksan Hi-Metal Co., Ltd.
    Inventors: Kang Hee Kim, Yong Cheol Chu, Myoung Ho Chun, Sang Ho Jeon, Hyun Kyu Lee
  • Publication number: 20120067629
    Abstract: The present invention relates to a solder adhesive and a production method for the same, and to an electronic device comprising the same, and more specifically it relates to a solder adhesive comprising an alloy including tin and having a melting point of from 130 to 300° C., a first binder including a rosin compound, and a second binder having a thermosetting resin, as well as to a production method for the same and an electronic device comprising the same.
    Type: Application
    Filed: September 22, 2011
    Publication date: March 22, 2012
    Applicant: DUKSAN HI-METAL CO., LTD.
    Inventors: Yong Un Jang, Sung Chul Kim, Yong Cheol Chu, Seung Jun Jang, Yoon Sang Son
  • Publication number: 20100272598
    Abstract: Disclosed herein are a lead-free solder alloy and a manufacturing method thereof. More specifically, disclosed are: a lead-free solder alloy, which comprises 0.8-1.2 wt % silver (Ag), 0.8-1.2 wt % copper (Cu), 0.01-1.0 wt % palladium (Pd), 0.001-0.1 wt % tellurium (Te), and a balance of tin (Sn), and thus has a melting point similar to those of prior lead-free solder alloys, excellent wettability, very low segregation ratio, and excellent weldability with a welding base metal, such that it improves temperature cycle performance and drop impact resistance simultaneously, when it is applied to electronic devices and printed circuit boards; a manufacturing method of the above alloy; and electronic devices and printed circuit boards which include the same.
    Type: Application
    Filed: September 4, 2008
    Publication date: October 28, 2010
    Applicant: DUKSAN HI-METAL CO., LTD.
    Inventors: Kang Hee Kim, Yong Cheol Chu, Myoung Ho Chun, Sang Ho Jeon, Hyun Kyu Lee