Patents Assigned to E-SMILE CO., LTD.
  • Patent number: 9681976
    Abstract: An interdigital pad for toes having a larger diameter engaging ring fitted on the big toe, a smaller diameter engaging ring fitted on the fourth toe, a base connecting said engaging rings and positioned on the sole of the foot, a projection fitted between and caught by the second and third toes, said base and two engaging rings forming an arched edge contacting the roots of respective toes, and a thickness of a lower ring of said larger diameter engaging ring and a thickness of the base of the second toe being thicker than a thickness of a portion located from the third to the fifth toes, so a height from the floor surface at a side of the little toe and fourth toe is a higher than at a side of the big toe.
    Type: Grant
    Filed: April 9, 2014
    Date of Patent: June 20, 2017
    Assignee: E-SMILE Co., Ltd.
    Inventor: Jun Nakamura
  • Publication number: 20160270942
    Abstract: An interdigital pad for toes having a larger diameter engaging ring fitted on the big toe, a smaller diameter engaging ring fitted on the fourth toe, a base connecting said engaging rings and positioned on the sole of the foot, a projection fitted between and caught by the second and third toes, said base and two engaging rings forming an arched edge contacting the roots of respective toes, and a thickness of a lower ring of said larger diameter engaging ring and a thickness of the base of the second toe being thicker than a thickness of a portion located from the third to the fifth toes, so a height from the floor surface at a side of the little toe and fourth toe is a higher than at a side of the big toe.
    Type: Application
    Filed: April 9, 2014
    Publication date: September 22, 2016
    Applicant: E-SMILE CO., LTD.
    Inventor: Jun NAKAMURA