Abstract: Provided is a maintenance member or the like capable of easily maintaining an electric contact in a substrate holder. It relates to a maintenance member to maintain a substrate holder including an electric contact configured to supply power to a substrate. The maintenance member includes an abrasive body having a shape corresponding to the substrate that is a holding target of the substrate holder, and disposed to come in contact with the electric contact when held by the substrate holder.

Abstract: Provided is a technique that allows measuring a film thickness of a substrate in a plating process. A plating apparatus 1000 includes a plating tank 10, a substrate holder 20, a rotation mechanism 30, a plurality of contact members 50, a coil 60, a current sensor 65, and a film thickness measuring device 70. The plurality of contact members 50 are disposed in a substrate holder and arranged in a circumferential direction of the substrate holder. The plurality of contact members 50 contact an outer peripheral edge of a lower surface of a substrate to supply electricity to the substrate in the plating process. The coil 60 generates a current by an electromagnetic induction due to a magnetic field generated by a current flowing into the contact member, the contact member being rotate together with the substrate holder in the plating process. The current sensor 65 detects the current generated in the coil.

Abstract: There is disclosed a polishing apparatus which can regulate a surface temperature of the polishing pad without causing a defect such as a scratch on a substrate such as a wafer. The polishing apparatus includes: a non-contact type pad-temperature regulating device; a pad-temperature measuring device. The pad-temperature measuring device is arranged adjacent to the pad-temperature regulating device and on a downstream side of the pad-temperature regulating device in a rotation direction of a polishing table.

Abstract: A polishing apparatus that is capable of referring to a storage in which a machine learning model is stored, the machine learning model being learned using learning data in which a feature amount of a signal regarding a frictional force between a polishing member and a substrate in polishing or a feature amount of a temperature of the polishing member or the substrate in polishing is input, and data regarding a film thickness of the polished substrate or a parameter related to yield of a product included in the polished substrate is output, the device including: a polishing table provided with the polishing member and configured to be rotatable; a polishing head facing the polishing table and configured to be rotatable, wherein the substrate is attachable to a surface facing the polishing table; a control unit configured to perform control to polish the substrate by pressing the substrate against the polishing member while rotating the polishing table and the polishing head having the substrate attached there

Abstract: A method of inspecting a leak detection system in a short time is disclosed. The leak detection system includes a leak detection line, an on-off valve, a flow mater, an operation controller configured to detect a fluid leak from a fluid line based on a first flow rate measured by the flow mater, a drain line, and a drain valve attached to the drain line. The inspection method includes: opening the on-off valve and the drain valve, with a supply valve and a return valve closed; measuring a second flow rate of fluid in the leak detection line by the flow mater; and determining that the leak detection system has a defect when the second flow rate is lower than a predetermined reference value.

Abstract: A control device of a substrate processing apparatus is configured to execute: calculating patterns for changing an order of loading to the substrate processing apparatus for multiple substrates loaded to the substrate processing apparatus; generating, for each obtained pattern, a time table in which process end times in the polishing device, the cleaning device, and the transport device are associated, so that an idling state does not occur from a time when the substrates are loaded to the substrate processing apparatus until a cleaning process ends; selecting a time table with a shortest time from a time when a process of a substrate initially loaded to the substrate processing apparatus starts until a process of a lastly loaded substrate ends in the obtained time tables; and controlling timings of loading the substrates to the substrate processing apparatus based on the selected time table.

Abstract: An accuracy of detecting a slip out of a substrate from a top ring is improved. A polishing unit 300 includes a polishing table 350, a top ring 302, a light emitting member 371, a slip-out detector 370, and an elimination mechanism 380. A polishing pad 352 that polishes a substrate WF is attached to the polishing table 350. The top ring 302 holds the substrate WF to press the substrate WF against the polishing pad 352. The light emitting member 371 emits a light to a detection area 372 on the polishing pad 352. The slip-out detector 370 detects a slip out of the substrate WF from the top ring 302 based on the light reflected from the detection area 372. The elimination mechanism 380 eliminates a polishing liquid flowing into the detection area 372.

Abstract: A paddle capable of reducing an influence of blocking the electric field and capable of improving its mechanical strength is disclosed. The paddle, which is configured to agitate a processing liquid in a processing tank by moving in the processing tank, includes a plurality of agitating beams that form a honeycomb structure. The honeycomb structure has a plurality of hexagonal through-holes formed by the plurality of agitating beams.

Abstract: A cleaning chemical liquid supply device includes: first and second mixers respectively mixing first chemical liquid with dilution water and respectively supplying to first and second nozzles respectively supplying the first chemical liquid adjusted to desired flow rates and concentrations to a first position and a second, different position of the substrate in the cleaning device; a first dilution water control box controlling flow rates of the dilution water supplied to the first and second mixers; third and fourth mixers respectively mixing second, different chemical liquid with the dilution water and respectively supplying to third and fourth nozzles for respectively supplying the second chemical liquid adjusted to desired flow rates and concentrations to a third position and a fourth, different position of the substrate in the cleaning device; and a second dilution water control box controlling flow rates of the dilution water supplied to the third and fourth mixers.

Abstract: A cleaning member mounting mechanism has: a cleaning member holding part, to which a cleaning member assembly having a cleaning member for cleaning a substrate W can be mounted; a member rotation part for rotating the cleaning member assembly held by the cleaning member holding part; and a moving part which moves the cleaning member holding part along an axial direction when the cleaning member assembly is removed, thereby to bring the cleaning member holding part into a rotation fixed position to restrict a rotation of the cleaning member holding part.

Abstract: A substrate processing apparatus includes a polishing head defining plural pressure chambers D1 to D5 for pressing a wafer W on a polishing pad 42, a pressure control unit performing pressure feedback control by individually controlling pressures in the pressure chambers D1 to D5, a film thickness measurement unit measuring a film thickness distribution of the wafer W being polished, a storage unit storing multiple pieces of information on a preset pressure of the pressure chambers D1 to D5, and a response characteristic acquisition unit changing the preset pressure every time a predetermined condition is satisfied during polishing of the wafer W, measuring a polishing rate applied to the wafer W, and acquiring a response characteristic of the polishing of the wafer W. The response characteristic indicates responsiveness of the polishing of the wafer W to the pressure feedback. The response characteristic is acquired based on the obtained polishing rates.

Abstract: A machine learning apparatus (4) generates a learning model (6) to be used in a sliding-surface diagnosis apparatus (1A) for diagnosing a condition of sliding surfaces of a fixed-side sliding member and a rotation-side sliding member. The machine learning apparatus (4) includes: a learning-data memory (41) configured to store learning data including input data containing at least data on motor current value in a predetermined period, data on contact electric resistance in the predetermined period, and data on vibration (AE wave or acceleration) in the predetermined period; a machine learning section (42) configured to input the learning data to the learning model (6) to cause the learning model (6) to learn a correlation between the input data and diagnostic information of the sliding surfaces; and a learned-model memory (43) configured to store the learning model (6) that has learned by the machine learning section (42).

Abstract: A polishing apparatus which can efficiently polish an entirety of a back surface of a substrate, with the back surface facing downward, is disclosed. The polishing apparatus includes: a substrate holder configured to rotate the substrate; a polishing head configured to polish the back surface of the substrate; a tape advancing device; and a translational rotating mechanism configured to cause the polishing head to make a translational rotating motion. The substrate holder includes a plurality of rollers which are rotatable about their own axes. The plurality of rollers have substrate-holding surfaces capable of contacting a periphery of the substrate. The polishing head is disposed below the substrate-holding surfaces. The polishing head includes a polishing blade configured to press the polishing tape against the back surface of the substrate, and a pressing mechanism configured to push the polishing blade upward.

Abstract: A substrate processing apparatus includes a first processing unit and a second processing unit placed in upper and lower two stages. Each processing unit has: a plurality of processing tanks arranged in series; a partition wall defining a conveyance space extending along an arrangement direction outside the plurality of processing tanks; a conveyance mechanism placed in the conveyance space and being configured to convey a substrate between the processing tanks along the arrangement direction; and an air guide duct provided to extend along the arrangement direction in the conveyance space. The air guide duct is connected with a fan filter unit. Each of the processing tanks is connected with an exhaust duct. An opening is formed in each of parts facing the processing tank in the air guide duct. The conveyance spaces of the first and second processing units are separated into upper and lower segments by the partition wall.

Abstract: In a plating apparatus, a short circuit of a wiring between a rectifier and a plating device is detected without using a substrate in vain. In the plating apparatus that supplies a current from the rectifier to the substrate to plate the substrate, a short circuit detection method includes a step of outputting a current with a predetermined current value from the rectifier, in a state where the substrate and a substrate holder holding the substrate are not electrically connected to the rectifier, a step of acquiring an output voltage value of the rectifier, a step of comparing the output voltage value with a predetermined reference voltage value, and a step of determining that a short circuit occurs in a circuit for connecting the rectifier and the substrate, in a case where the output voltage value is lower than the reference voltage value.

Abstract: A resin molded rotor includes a rotor, a main shaft, and a resin mold. The rotor is configured to hold a magnet. The main shaft is provided with the rotor mounted thereto and is configured to transmit power to the outside. The resin mold is configured to integrally cover the rotor and part of the main shaft on respective sides in an axial direction of the rotor. An O-ring is placed between the resin mold and the main shaft to seal between the resin mold and the main shaft.

Abstract: A method is provided and includes making a polishing table and a dummy disk rotate; bringing the dummy disk into contact with a table surface of the polishing table while a liquid is supplied to the table surface; measuring heights of the table surface at a plurality of measurement points while the dummy disk is moved on the table surface; and creating a table profile showing tilt of the table surface from measurement values of the heights of the table surface.

Abstract: An eddy current sensor assembly includes an eddy current sensor and an output signal processing circuit that processes an output signal from the eddy current sensor. The output signal processing circuit includes a mixer circuit that accepts the output signal and a signal of the predetermined frequency as input, multiplies the two signals received as input, and outputs an output signal obtained by the multiplication, and a low-pass filter that accepts the output signal output by the mixer circuit as input, cuts a high-frequency signal included in the output signal received as input, and outputs at least a direct-current (DC) signal.

Abstract: As an aspect of the present invention, a cleaning apparatus for cleaning member has a holding part holding a cleaning member assembly having a cleaning member; an inner cleaning liquid supply part; an outer cleaning liquid supply part; and a control part controlling the substrate cleaning apparatus to perform a first process in which the cleaning member is pressed against a dummy substrate at a first pressure and the outer cleaning liquid supply part supplies the cleaning liquid to the dummy substrate, and to perform a second process in which the cleaning member is separated from the dummy substrate or is pressed against the dummy substrate at a second pressure which is equal to or less than the first pressure and the inner cleaning liquid supply part supplies the cleaning liquid.