Abstract: A mining bit includes: a shank; and cutting tips attached to the shank, each cutting tip having a plurality of layers and a plurality of abrasive particles, wherein the layers have a shape of an arch with flat surfaces in such a manner as to be laminated onto each other in a horizontal direction with respect to a cut surface of each cutting tip, and a distance (D2) between the abrasive particles on the adjacent layers is less than a distance (D1) between the abrasive particles on each layer.

Abstract: Disclosed are a drill bit for drilling and a method for manufacturing same, in which the hardness of a body part of a shank can be selectively improved by performing rapid cooling in a forced cooling method after performing rapid heating selectively only on the body part of the shank in a high-frequency induction heating method after completing infiltration.

Abstract: Disclosed are a drill bit for drilling and a method for manufacturing same, in which the hardness of a body part of a shank can be selectively improved by performing rapid cooling in a forced cooling method after performing rapid heating selectively only on the body part of the shank in a high-frequency induction heating method after completing infiltration.

Abstract: A chemical mechanical polishing (CMP) method includes preparing a polishing pad, determining a first load to be applied to a conditioning disk during conditioning of the polishing pad and a first indentation depth at which tips of the conditioning disk are inserted into the polishing pad when the first load is applied to the conditioning disk, preparing a conditioning disk, and positioning the conditioning disk on the polishing pad and conditioning a surface of the polishing pad by using the conditioning disk while applying the first load to the conditioning disk.

Abstract: Disclosed herein is a scribing wheel having a predetermined thickness and a disk shape. The scribing wheel includes: a wheel body configured in such a way that at least a peripheral edge portion thereof is gradually reduced in thickness from the center to the radial outside; and a cutter part including recesses and cutting blade teeth which are alternately arranged along the peripheral edge portion. Each recess is formed by a combination of side recess portions formed in opposite side surfaces of the peripheral edge portion of the wheel body and an edge recess portion formed in the peripheral edge of the wheel body.

Abstract: The present invention relates to a CMP pad conditioner having a substrate and a cutting tip pattern formed on at least one surface of the substrate, and more particularly to a CMP pad conditioner having cutting tip patterns, in which the cutting tip patterns have an improved structure that can increase the productivity of the CMP pad conditioner and that can sufficiently ensure the strength and safety of the cutting tip patterns.

Abstract: A chemical mechanical polishing (CMP) method includes preparing a polishing pad, determining a first load to be applied to a conditioning disk during conditioning of the polishing pad and a first indentation depth at which tips of the conditioning disk are inserted into the polishing pad when the first load is applied to the conditioning disk, preparing a conditioning disk, and positioning the conditioning disk on the polishing pad and conditioning a surface of the polishing pad by using the conditioning disk while applying the first load to the conditioning disk.

Abstract: Disclosed herein is a grinding tool, which includes a plate, a plurality of holders formed on the plate and having sliding grooves, a shoe coupled to the sliding groove of each of the holders, and grinding tips arranged on the shoe. The shoe includes a fastening part fastened to the sliding groove, and an upper plate part formed on the fastening part and located on an upper surface of the holder outside the sliding groove. The shoe can be fastened to the holder in two or more directions, and the grinding tips can be arranged in two or more forms when viewed from the plane.

Abstract: The present invention relates to an electrodeposited diamond wire saw using patterned non-conductive materials in which non-conductive materials are pre-patterned along the outer circumference of a wire on which diamond grit should not be rubbed, before the diamond grit is upset, in order to efficiently improve the manufacturing process, and to a method for manufacturing same. According to one preferred embodiment of the invention, the method for manufacturing an electrodeposited diamond wire saw includes: printing a masking solution on the outer circumference of a wire in a plurality of directions when the wire is inserted for patterning; and upsetting diamond grit on the remaining regions of the outer circumference of the wire, with the exception of the patterned region.

Abstract: The present disclosure provides a brazing bond type diamond tool having excellent cuttability. The diamond tool includes a shank having a body with a thickness of 2 mm or less and a tip portion formed along an edge of the body, the tip portion being thinner than the body; and a brazing bond layer formed on the tip portion of the shank to secure diamond particles having a particle size of 25 to 50 mesh with a brazing bond, wherein the brazing bond layer has a greater thickness than a difference between half the thickness of the shank body and half the thickness of the shank tip portion, such that some part of the shank body can penetrate into a surface of an object to be cut, and the tip portion of the shank has a curved surface at an end thereof.

Abstract: Provided is a chemical mechanical polishing (CMP) apparatus that includes a swing unit installed apart from a platen, on which a CMP pad to be conditioned is placed, at a predetermined interval, a connector installed on an upper end of the swing unit at one end thereof in a perpendicular direction to the swing unit and pivoting around the swing unit above the CMP pad, a rotator rotatably installed on the other end of the connector, a CMP pad conditioner coupled to the rotator and conditioning the CMP pad when rotated, and a vibration meter installed on the connector and detecting vibrations to measure a vibration acceleration of the CMP pad conditioner, thereby predicting a wear rate of the CMP pad based on the vibration acceleration and a state in which the CMP pad conditioner is installed or being used.

Abstract: This invention relates to a conditioner for a CMP (Chemical Mechanical Polishing) pad, which is used in a CMP process which is part of the fabrication of a semiconductor device, and more particularly, to a CMP pad conditioner in which the structure of the cutting tips is such that the change in the wear of the polishing pad is not great even when different kinds of slurry are used and when there are changes in pressure of the conditioner, and to a method of manufacturing the same.

Abstract: A reaming shell for mining is provided. The reaming shell has a shank, and a plurality of pads attached at circumferential intervals from each other to extend lengthwise on an outer periphery of the shank. The reaming shell is coupled to a core bit of a diamond drilling tool for mining. The reaming shell includes a water groove of a recessed shape formed respectively between each adjacent pair of the pads, and extending from a leading edge along a length of the shank.

Abstract: Provided is a chemical mechanical polishing (CMP) apparatus that includes a swing unit installed apart from a platen, on which a CMP pad to be conditioned is placed, at a predetermined interval, a connector installed on an upper end of the swing unit at one end thereof in a perpendicular direction to the swing unit and pivoting around the swing unit above the CMP pad, a rotator rotatably installed on the other end of the connector, a CMP pad conditioner coupled to the rotator and conditioning the CMP pad when rotated, and a vibration meter installed on the connector and detecting vibrations to measure a vibration acceleration of the CMP pad conditioner, thereby predicting a wear rate of the CMP pad based on the vibration acceleration and a state in which the CMP pad conditioner is installed or being used.

Abstract: Disclosed is a grinding tool, which includes a first disk having an installation hole in a center portion thereof such that the grinding tool is installed on a grinder, a second disk forming a discharge passage with partitions on a bottom surface of the first disk, wherein air intaken from a central lower portion of the grinding tool is discharged to an outside thereof through the discharge passage, and a ring-shaped shank disposed under the second disk and including grinding tips to grind a target.

Abstract: There is provided a method of cutting or drilling workpiece including stone such as marble and granite, brick, concrete and asphalt, using a frame gang saw. There are provided a workpiece cut by a frame gang saw that includes one or a plurality of blades having multiple cutting tips or that includes a blade without including a cutting tip; a method of cutting the workpiece by using a frame gang saw; and a product provided by the cutting method. The workpiece is provided to include one or more grooves into which at least a portion of at least one cutting tip among the multiple cutting tips or at least a portion of the blade without a cutting tip is inserted and which is formed in a surface thereof. Here, an initial cutting time on a workpiece may be shortened to greatly improve productivity and the quality of a product and a lifespan of a frame gang saw blade may be improved by significantly decreasing deflection in the blade.

Abstract: The present invention relates to an electrodeposited diamond wire saw using patterned non-conductive materials in which non-conductive materials are pre-patterned along the outer circumference of a wire on which diamond grit should not be rubbed, before the diamond grit is upset, in order to efficiently improve the manufacturing process, and to a method for manufacturing same. According to one preferred embodiment of the invention, the method for manufacturing an electrodeposited diamond wire saw includes: printing a masking solution on the outer circumference of a wire in a plurality of directions when the wire is inserted for patterning; and upsetting diamond grit on the remaining regions of the outer circumference of the wire, with the exception of the patterned region.

Abstract: There is provided a drill bit comprising a bit body having a receptor portion formed therein, the receptor portion being filled with a cutting oil; a drilling portion extended from one end of the bit body, having a channel coupled to the receptor portion formed therein, and having an opening formed in one end thereof and connected to the channel; and a cutting portion provided at a periphery of the opening of the drilling portion for drilling a workpiece, wherein the channel of the drilling portion has a small diameter in order that the cutting oil is not discharged outside of the channel by external pressure or gravitational force, and the channel of the drilling portion has a structure in which capillary action occurs due to cut chips flowing through the channel during drilling of the workpiece so that the cutting oil may be discharged by the capillary action.

Abstract: The present invention relates to a wafer retaining ring used in a chemical mechanical polishing process (CMP) for semiconductor device manufacturing, and in particular, to a pad conditioning and wafer retaining ring designed to prevent a wafer from slipping during the CMP process and, simultaneously condition a pad uniformly, and to a manufacturing method thereof.