Abstract: An improved way of preparing packaged electronic circuitry using molded plastics, Thick Film, and Build Up Technology, and achieving shielding of the circuitry and components of the package. In this invention at least one of the electronic devices in the package is supported in a molded pocket in the molded substrate, and using Build Up Technology circuit traces are added to the surface of the substrate and the electronic device, simultaneously creating the circuit traces and making the interconnections with the components at the same time. Shielding, which is optional, can easily be printed or plated over the planar surface of the packaged circuit traces and components.

Abstract: An improved way of preparing packaged electronic circuitry using molded plastics, ceramic Thick Film technology, and Polymer Thick Film technology. In this invention at least one of the electronic devices in the package is supported in a plastic molded substrate, and the circuit traces area added to the surface of the electronic device.