Abstract: Disclosed is a semiconductor device including: a first switch controlling connection between a first data line pair a second data line pair; a first amplifier connected to the first data line pair; a second switch controlling the connection between the second data line pair and a third data line pair; a second amplifier amplifying data on the second data line pair and delivering the amplified data to the third data line pair; a third amplifier connected to the third data line pair; and a switch control circuit controlling the second switch. Based upon a first control signal that controls precharging and equalization of the first data line pair, the switch control circuit renders the second switch conductive when precharging and equalization of the first data line pair is not carried out, and renders the second switch non-conductive when precharging and equalization of the first data line pair is carried out.

Abstract: A latency counter includes a counter circuit and a point-shift FIFO circuit. Latch circuits included in the point-shift FIFO circuit are divided into n groups having wired-OR outputs, and an output of a latch circuit that belongs to a group different from a current group is selected each time a count value is updated.

Abstract: A semiconductor device includes a sense amplifier, transistors selectively establishing electrical connection between the sense amplifier and a data bus, depending on address; a write amplifier connected to the data bus, an external terminal outputting data from a memory cell to outside via the sense amplifier, the transistors, and the data bus in a first operation mode and supplying data from outside to the sense amplifier via the write amplifier, the data bus, and the transistors in a second operation mode, and a control circuit supplying an electric potential to gate electrodes of first transistors that establish the electrical connection depending on the address, wherein in a first operation mode, the control circuit supplies a first electric potential to the gate electrodes of the first transistors, so that the first transistors exhibit a first impedance value and in the second operation mode, the control circuit supplies a second electric potential to gate electrodes of the first transistors, so that th

Abstract: A semiconductor device includes a first semiconductor pillar, a first insulating film covering a side face of the first semiconductor pillar, a first electrode covering the first insulating film, a second semiconductor pillar, a second insulating film covering a side face of the second semiconductor pillar, and a second electrode covering the second insulating film. The top level of the second electrode is higher than the top level of the first electrode.

Abstract: A solid-state memory device includes: a superlattice laminate having plural crystal layers laminated therein, the crystal layers including first and second crystal layers having mutually opposite compositions; a lower electrode provided on a first surface in a laminating direction of the superlattice laminate; and an upper electrode provided on a second surface of the superlattice laminate in the laminating direction. The first crystal layer included in the superlattice laminate is made of a phase change compound. According to the present invention, the superlattice laminate laminated in opposite directions of the upper and lower electrodes is sandwiched between these electrodes. Therefore, when an electric energy is applied to the superlattice laminate via these electrodes, a uniform electric energy can be applied to a laminated surface of the superlattice laminate. Accordingly, fluctuation of a resistance is small even when information is repeatedly rewritten, and data can be read stably as a result.

Abstract: In accordance with a bandgap circuit and a method of starting the bandgap circuit, a start signal is continuously supplied to a differential amplifier circuit to start up the differential amplifier circuit that controls a bandgap core circuit until the differential amplifier circuit has started up, and then the supply of the start signal to the differential amplifier circuit is discontinued after the differential amplifier circuit has started up.

Abstract: Disclosed herein is a device includes first and second core chips and a test circuit. The first core chip outputs an internal signal to a second node thereof in response to a core-chip test signal supplied to a first node thereof. The second core chip outputs an internal signal to a second node thereof in response to the core-chip test signal supplied to a first node thereof. The test circuit generates test result signals based on the internal signal of the first core chip being output from the second node of the first core chip, and the internal signal of the second core chip being output from the third node of the first core chip.

Abstract: Provided is a device, including: a first terminal which receives an external clock signal; a clock generation circuit connected to the first terminal to generate an internal clock signal based on the external clock signal; word lines and bit lines; amplifier circuits connected to the bit lines, respectively; and a control unit. The control unit controls, in a test operation, at least one of the word lines to repeat a selected state and an unselected state in accordance with the internal clock signal during a first period, and maintains the amplifier circuits in an active state during the first period. The control unit further controls, in a normal operation, the amplifier circuits to switch between the active state and an inactive state depending on switching between the selected state and the unselected state of the at least one of the word lines.

Abstract: In a semiconductor device including a row-based control circuit applied with a current reduction circuit having a standby state and an active state, a refresh control circuit generates a refresh request signal every predetermined time interval on a self-refresh mode and time-sequentially generates an internal active signal at N times in connection with the refresh request signal once. The row-based control circuit time-sequentially refreshes information of memory cells on the based of the internal active signal at the N times. The refresh control circuit inactivates the row-based control circuit by making the current reduction circuit the standby state.

Abstract: In order to solve a problem of increased noise accompanying increased area of a return path in a stacked package structure, provided is a semiconductor device which is formed in a stacked package such as a PoP package, which realizes low noise without changing a package size. An additional power supply wiring that runs along a signal wiring between an upper PoP and a lower PoP is newly added in the lower PoP of a package having a PoP structure.

Abstract: A semiconductor device comprises a capacitor in which a lower electrode, an adhesive layer, a capacitance insulating film, and an upper electrode are provided in series. The capacitance insulating film has laminated films in which a first metal oxide film and a second metal oxide film are alternatively laminated so that the first metal oxide film contacts with the adhesive layer. The adhesive layer has thickness of 0.3 nm or more and is an oxide film including at least one element selected from element contained in the lower electrode.

Abstract: A semiconductor device according to the present invention performs, when a first word structure is designated, control such that input and output of data is performed from a first data input/output terminal and from a second data input/output terminal in response to a first strobe signal and a second strobe signal. The semiconductor device performs, when a second word structure is designated and when a first control signal is supplied, control such that input and output of data is performed from the first data input/output terminal in response to the first strobe signal. The semiconductor device performs, when the second word structure is designated and when a second control signal is supplied, control such that input and output of data is performed from the second data input/output terminal in response to the second strobe signal.

Abstract: To provide a dielectric film having good crystallinity while suppressing an influence of the size effects and preventing the dielectric film from being divided by an Al-doped layer although there is provided the Al-doped layer for improving the leakage characteristics in the dielectric film of a capacitor, the dielectric film has at least one Al-doped layer, and an area density of Al atoms in one layer of the Al-doped layer is smaller than 1.4E+14 atoms/cm2. Further, to achieve the area density, there is employed a combination of formation of a dielectric film using a general ALD method and Al doping using an adsorption site blocking ALD method including adsorbing a blocker molecule restricting an adsorption site of an Al source, adsorbing the Al source, and introducing a reaction gas for reaction.

Abstract: A semiconductor device includes a multi-level wiring structure that includes a first wring layer, a plurality of first patterns, and a first mark. The first wring layer is disposed at a first wiring level of the multi-level wiring structure. The plurality of first patterns is disposed over the first wring layer. The plurality of first patterns is disposed at a second wiring level of the multi-level wiring structure. The second wiring level is above the first wiring level. The plurality of first patterns is disposed over the first wring layer. The plurality of first patterns is disposed at a second wiring level of the multi-level wiring structure. The second wiring level is above the first wiring level. The first mark is disposed over the first wring layer. The first mark is disposed at a third wiring level. The third wiring level is above the second wiring level.

Abstract: A semiconductor device includes first and second interconnects, a variable resistance element that may assume a first resistance value or a second resistance value in response to the current flowing therein, and second transistors connected between the first and second interconnects in series with each other on both sides of the variable resistance element, and a power supply circuit unit that delivers the power supply to a control electrode of the first transistor.

Abstract: A semiconductor device includes a substrate and a plurality of bumps. The substrate is compartmentalized into a bump-free area provided along four sides of the substrate and a bump area which is surrounded by the bump-free area. The plurality of bumps is aligned in the bump area. The plurality of bumps includes a first group of bumps aligned along the four sides and a second group of bumps surrounded by the first group. A first subgroup of bumps included in the first group and aligned along one side of the four sides is shifted with respect to a second subgroup of bumps included in the first group and aligned along an opposing side of the four sides in a direction parallel to the one side.

Abstract: In a method for manufacturing a semiconductor memory device, a three dimensional lower electrode including a titanium nitride film is formed on a semiconductor substrate, and a dielectric film is formed on the surface of the lower electrode. After a first upper electrode is formed at a temperature that the crystal of the dielectric film is not grown on the surface of the dielectric film, the first upper electrode and the dielectric film are heat-treated at a temperature that the crystal of the dielectric film is grown to convert at least a portion of the dielectric film into a crystalline state. Thereafter, a second upper electrode is formed on the surface of the first upper electrode.

Abstract: A simulation method includes determining a relationship between stress time and a degradation rate of drain current on a basis of a table in which data of a lifetime of a transistor, or the degradation rate of the transistor, is written, and calculating an amount of change in drain current accordance with the degradation rate, using a table in which information indicating a change in the drain current, being dependent on voltage, is written, based on actually measured data of drain current of the transistor after degradation, drain current in an initial state of a particular transistor model, and the relationship between stress time and the degradation rate of drain current.

Abstract: A semiconductor device includes: first and second circuit cell arrays extending in first direction; first and second power supply lines each extending in first direction and arranged over first circuit cell array, first power supply line being supplied with first power source voltage; third power supply line extending in first direction separately from second power supply line, arranged over second circuit cell array, and supplied with second power source voltage; first transistor coupled between second and third power supply lines; and first circuit arranged on first circuit cell array and operating on first and second power source voltages supplied from first and second power supply lines, respectively.

Abstract: The present invention provides a semiconductor device having a plurality of vertical transistors, which includes, on a substrate, a semiconductor pillar 5; gate electrode 11 provided on the side of the pillar via gate insulating film 10; first diffusion layer 9 connected to the bottom of the pillar; and second diffusion layer 16 connected to the top of the pillar, second diffusion layer 16 includes first portion 14 formed within the area over the pillar, and second portion 15 which is an epitaxial growth layer, formed on the first portion and contacting with insulating film 17 which is provided between adjacent vertical transistors.