Abstract: A BGA semiconductor device includes a semiconductor package and a mounting board mounting thereon the semiconductor package, wherein an array of signal electrodes of the semiconductor package and an array of signal electrodes of the mounting board are coupled together via signal bumps. The BGA semiconductor device also includes a dummy bump, which reinforces the bending strength of the BGA semiconductor device and is broken by a shearing force caused by thermal expansion to alleviate the stress for the signal bumps.

Abstract: A clock control circuit includes a phase determination circuit that generates a first phase determination signal based on a phase of an external clock signal, a counter circuit that updates a count value based on a second phase determination signal for each sampling period, a delay line that generates an internal clock signal by delaying the external clock signal based on the count value, and an invalidation circuit that generates the second phase determination signal which is obtained by invalidating a change of the first phase determination signal within a same sampling period in response to a fact that the first phase determination circuit indicates a predetermined logical level.

Abstract: To include a first level shift circuit that converts a first internal clock signal having an amplitude value of a first voltage into a second internal clock signal having an amplitude value of a second voltage, a second level shift circuit that converts a first internal data signal having the amplitude value of the first voltage into a second internal data signal having the amplitude value of the second voltage, a clock dividing circuit that generates third and fourth internal clock signals, which are complementary signals, based on the second internal clock signal, and an output circuit that outputs external data signals continuously from a data output terminal in synchronization with the third and fourth internal clock signals based on the second internal data signal. According to the present invention, because a level shift of a signal is performed before it is input to the output circuit, there occurs no skew in output data.

Abstract: A semiconductor device includes a plurality of MOS transistors and wiring connected to a source electrode or a drain electrode of the plurality of MOS transistors and, the wiring being provided in the same layer as the source electrode and the drain electrode in a substrate, or in a position deeper than a surface of the substrate.

Abstract: To provide a duty detection circuit including: a plurality of duty detectors that detect a duty ratio of internal clocks; a controller that controls the plurality of duty detectors so that the plurality of duty detectors operates in different phases from one another; and an output selecting unit that selects one of duty detection signals from the plurality of duty detectors. According to the present invention, since the duty detectors operate in the different phases from one another, the output selecting unit can output a duty detection signal with a higher frequency than a generation frequency with which each duty detector generates the duty detection signal. Accordingly, when the duty detection circuit according to the present invention is used to adjust a clock of the DLL circuit, a control period of the DLL circuit can be reduced.

Abstract: plurality of core chips to which chip identification information different from each other is allocated and an interface chip are layered, the plurality of core chips are commonly connected to the interface chip through a first current path including at least a through silicon via, the interface chip serially supplies an enable signal to the plurality of core chips through the first current path, and the plurality of core chips are activated based on a logic level of a bit corresponding to the chip identification information among a plurality of bits configuring the enable signal. The present invention can reduce the number of through silicon vias required to supply an enable signal.

Abstract: A method including forming an intermediate product, the intermediate product being configured to include a wiring substrate including a plurality of first electrodes, a plurality of second electrodes and a plurality of test electrodes, a first semiconductor chip mounted over the wiring substrate and including a plurality of first pads electrically connected respectively to the first electrodes, and a second semiconductor chip stacked over the first semiconductor chip and including a plurality of second pads electrically connected respectively to the second electrodes; encapsulating the first and second semiconductor chips; and performing electrical tests on the first and second semiconductor chips by use of the test electrodes, after the encapsulating of the first and second semiconductor chips.

Abstract: A method of manufacturing a semiconductor device includes forming silicon pillar 11 on substrate 10, forming a protective film which covers an upper end portion and a lower end portion of a side surface of silicon pillar 11, forming a constricted portion by anisotropic etching in a portion of the side surface of silicon pillar 11 which is not covered with the protective film after forming the protective film, removing the protective film after forming the constricted portion, forming gate oxide film 12 which covers the side surface of silicon pillar 11 in which the constricted portion is formed, and forming gate electrode 13 which covers gate oxide film 12.

Abstract: A semiconductor device includes low voltage and high voltage transistors over a substrate. The low voltage transistor is configured by at least one unit transistor. The high voltage transistor is configured by a greater number of the unit transistors than the at least one unit transistor that configures the low voltage transistor. Each of the unit transistors may include a vertically extending portion of semiconductor providing a channel region and having a uniform height, a gate insulating film extending along a side surface of the vertically extending portion of semiconductor, a gate electrode separated by the gate insulating film from the vertically extending portion of semiconductor, and upper and lower diffusion regions being respectively disposed near the top and bottom of the vertically extending portion of semiconductor. The greater number of the unit transistors are connected in series to each other and have gate electrodes eclectically connected to each other.

Abstract: A semiconductor device includes groove-like regions that are formed between two adjacent bit lines among a plurality of bit lines each having upper and side surfaces covered with a cap insulating film and a side-wall insulating film, respectively, a SiON film that contains more O (oxygen) than N (nitrogen) and continuously covers inner surfaces of the groove-like regions, and a silicon dioxide film formed by reforming polysilazane and filled in the groove-like regions with the SiON film interposed therebetween.

Abstract: A semiconductor device includes: a first vertical type transistor having a first lower diffusion layer, a first upper diffusion layer, and a gate electrode; a second vertical type transistor having a second lower diffusion layer, a second upper diffusion layer, and a second gate electrode; a gate wiring connected to the first and second gate electrodes; a first wiring connected to the first lower diffusion layer and second upper diffusion layer; and a second wiring connected to the first upper diffusion layer and second lower diffusion layer.

Abstract: A switching regulator includes: a switching element that controlling supply of power supply voltage according to a control signal; a smoothing circuit smoothing the power supply voltage supplied via the switching element and supplying the smoothed power supply voltage as an output voltage to an output terminal; an error amplifier outputting an error signal according to a difference between the output voltage supplied to the output terminal and a reference voltage; a delta sigma modulation circuit generating a delta sigma modulation signal according to the error signal; and a power supply abnormality detection circuit outputting the delta sigma modulation signal as the control signal and detecting an abnormality in the power supply voltage based on the delta sigma modulation signal.

Abstract: A data transfer method is disclosed in a multi-chip semiconductor device which comprises a plurality of inter-chip wires. First, a test is conducted to determine whether or not each inter-chip wire is capable of normally transferring data, on circuits arranged on chips between which the inter-chip wire is connected. When an inter-chip wire incapable of normally transferring data exists, the data transfer speed of the buffer circuit that is on the chip on the transmission and that is connected to an inter-chip wire capable of normally transferring data is increased. The buffer circuit, whose data transfer speed has been increased, transfers data which would otherwise be transferred through the inter-chip wire incapable of normally transferring data, together with the data which should be transferred thereby, to the chip on the reception side chip through an inter-chip wire connected to the buffer circuit at the data transfer speed.

Abstract: An outputting transistor circuit of a push-pull structure has an outputting PMOS transistor and an outputting NMOS transistor connected in series between a first power supply and a grounded power supply. In a standby state, a voltage level of a gate terminal of the outputting PMOS transistor is set to a voltage level of a second power supply higher than a voltage level of the first power supply. In an active state, a voltage level of the gate terminal of the outputting PMOS transistor is changed to a voltage level of the first power supply in response to an active command or a read command, or in response to the state of a semiconductor memory device changing to the active state or a read state, and either the outputting PMOS transistor or the outputting NMOS transistor is turned ON in response to a data read signal from a memory cell.

Abstract: A plurality of memory cells are tested in order. Each time a defective memory cell is detected by the test, error pattern information is updated based on a relative arrangement relationship between a plurality of defective memory cells, and error address information is updated based on the addresses of at least part of the plurality of defective memory cells. According to the present invention, it is possible to significantly reduce the storage capacity of the analysis memory. This allows the implementation of the analysis memory itself in the semiconductor device, in which case external testers need not include the analysis memory.

Abstract: In order to provide a semiconductor memory apparatus which can flexibly change the priority of reading requests when the reading request is issued and which do not exclusively use the memory bus, a semiconductor memory apparatus includes: a main memory which stores data at an address while maintaining a corresponding relationship between the data and the address; a read request input portion receiving a read request which maintains a corresponding relationship between address information that is referred to when reading the data and priority information that indicates priority for reading the data; a read data storing portion which stores the data and priority while maintaining a corresponding relationship thereof; a data reading portion reads the data corresponding to address information which is input by the read request input portion from the main memory; a read data registration portion storing both the priority information input by the read request input and the data read by the data reading portion to t

Abstract: To include a plurality of pad groups each including a first data I/O pad, a first power supply pad, a second data I/O pad, and a second power supply pad arranged in order in an X direction. The first data I/O pad is connected to a first data I/O buffer, and the second data I/O pad is connected to a second data I/O buffer. The first power supply pad supplies a first power supply potential to the first and second data I/O buffers, and the second power supply pad supplies a second power supply potential to the first and second data I/O buffers. The first data I/O pad included in each of the pad groups is adjacent to the second power supply pad included in other pad group or any one of a plurality of power supply pads not included in any one of the pad groups.

Abstract: A semiconductor device includes a plurality of first chips, a second chip that controls the first chips, and internal wiring that connects the first chips and the second chip. The first chips each include: an optical fuse; a first latch circuit that retains information on the optical fuse; a second latch circuit that retains information on an electrical fuse, the information being supplied from the second chip through the internal wiring; and a select circuit that selects the information retained in either one of the first and second latch circuits. A redundancy determination signal is generated from the information selected. The information on the electrical fuse is transferred from the second chip to the first chips through the internal wiring.

Abstract: A controller includes a set of first terminals to be coupled to a device that is under control of the controller, and a control circuit configured to generate and output onto the set of first terminals synchronous mode information including a selected one of selection and non-selection modes, the selection mode causing the device to return to the controller a first data signal while activating a first data strobe signal that is synchronous in phase with a system clock, the non-selection mode causing the device to return to the controller a second data signal while activating a second data strobe signal that is asynchronous in phase with the system clock signal, and edge specifying information including a selected one of first and second states, the first state causing the device to activate the first data strobe signal at a first timing.

Abstract: To provide a semiconductor device including: plural capacitors each including a cylindrical lower electrode having an internal wall and an external wall, and an upper electrode that covers the external wall of the lower electrode via a capacitance dielectric film; and a supporting film having a buried portion buried in an internal region surrounded by the internal wall of the lower electrode, and a supporting portion a part of which is positioned within the internal region and remaining parts of which are positioned at outside of the internal region. The supporting portion sandwiches an upper end of the lower electrode at both ends of the upper end by covering the internal wall and the external wall of the upper end of the lower electrode.