Abstract: A low impedance interconnection assembly for use with high frequency switching power semiconductor devices includes a modular capacitor, multi-layer bus structure and semiconductor switching devices assembled as a laminated unitary structure. Terminals electrically and physically connect the positive electrode of the modular capacitor to the positive DC voltage potential carried by the bus structure and the positive DC input of the semiconductor switch and other terminals electrically and mechanically couple the negative electrode of the modular capacitor to the negative DC voltage potential layer of the bus structure and the negative DC input of the switching device. The modular capacitor is made of a number of capacitor elements having their respective positive electrodes bonded to a copper foil pattern strip to define a positive electrode and their respective negative electrode terminals to a second copper foil strip to define the negative electrode.

Abstract: An input control current command signal is modified in accordance with a number of compensation factors stored in a memory and corresponding to each of a number of angular shaft positions to provide a control signal to cause an inverter to drive each of the number of phases of a permanent magnet axial-field motor to cause the motor to produce a ripple-free torque output. The compensation values stored in the memory are identified and determined in accordance with the source of the torque ripple such as vibration, load operation, noise and variations within the motor construction.