Patents Assigned to Enermax Technology Corporation
  • Patent number: 11736052
    Abstract: A fan control circuit with temperature compensation includes an on-off unit and a speed adjustment unit. When determining that a loading is greater than or equal to an adjustable start threshold according to a load signal, the on-off unit controls the fan entering a working mode. In the working mode and determining that the loading is less than a speed-adjusting threshold, the on-off unit maintains a speed value of the fan at a first fixed speed. When determining the loading is greater than or equal to the speed-adjusting threshold, the speed adjustment unit adjusts the speed value according to the loading. The speed adjustment unit generates a speed displacement according to a temperature signal to compensate the speed value.
    Type: Grant
    Filed: March 30, 2021
    Date of Patent: August 22, 2023
    Assignee: ENERMAX TECHNOLOGY CORPORATION
    Inventors: Chin-Yun Chang, Chien-Kuei Hsu
  • Patent number: 11348860
    Abstract: A water-cooling thermal dissipating method controls at least one of a fan, a pump, and a throttle valve to cool a heat generating element inside an electronic device through a cooling liquid. The method includes steps of: (a) performing a self-condition inspection, (b) detecting whether a working temperature of the cooling liquid is greater than a first predetermined temperature, and detecting whether a working temperature of the heat generating element is greater than a second predetermined temperature, (c) outputting a first warning signal if the working temperature of the cooling liquid is greater than the first predetermined temperature and a liquid level of the cooling liquid is not lower than a threshold liquid level, and outputting a second warning signal if the working temperature of the heat generating element is greater than the second predetermined temperature, and (d) displaying the first warning signal and the second warning signal.
    Type: Grant
    Filed: April 13, 2020
    Date of Patent: May 31, 2022
    Assignee: ENERMAX TECHNOLOGY CORPORATION
    Inventors: Jer-Sheng Hwang, Teng-Kai Chang, Chin-Chen Chu
  • Patent number: 10665528
    Abstract: A water-cooling thermal dissipating system includes an electronic device and a thermal dissipating device. The electronic device includes a computing module includes a computing unit releasing heat when operation. The thermal dissipating device includes a thermal conducting unit, a pump, a tank, a thermal exchanger, and a controlling module; the thermal conductive unit is attached to the computing unit for thermal conduction; the pump is coupled to the thermal conductive unit, the pump, the tank, and the thermal exchanger for pumping a cooling-liquid therethrough, such that the cooling liquid is allowed to flow into the thermal conductive unit for absorbing heat. The controlling module generates an abnormal signal when the thermal dissipating device is sensed to be in an abnormal state, and the computing module forces to shut down the electronic device after continually receiving the abnormal signal for a predetermined time.
    Type: Grant
    Filed: May 29, 2019
    Date of Patent: May 26, 2020
    Assignee: ENERMAX TECHNOLOGY CORPORATION
    Inventors: Jer-Sheng Hwang, Teng-Kai Chang, Chin-Chen Chu
  • Patent number: 10338649
    Abstract: A fan control apparatus used to control a plurality of fans, and the fan control apparatus includes a power port, a control unit, a drive unit, and a trigger switch. The control unit receives a PWM signal with a duty cycle outputted from a processor and the control unit determines whether the duty cycle is greater than at least one threshold value set by the control unit. When the duty cycle is greater than at least one threshold value, the control unit controls the fans through the drive unit.
    Type: Grant
    Filed: July 27, 2017
    Date of Patent: July 2, 2019
    Assignee: ENERMAX TECHNOLOGY CORPORATION
    Inventors: Chih-Chun Tseng, Chin-Chen Chu
  • Patent number: 10312180
    Abstract: A water-cooling thermal dissipating system includes an electronic device and a thermal dissipating device. The electronic device includes a computing module includes a computing unit releasing heat when operation. The thermal dissipating device includes a thermal conducting unit, a pump, a tank, a thermal exchanger, and a controlling module; the thermal conductive unit is attached to the computing unit for thermal conduction; the pump is coupled to the thermal conductive unit, the pump, the tank, and the thermal exchanger for pumping a cooling-liquid therethrough, such that the cooling liquid is allowed to flow into the thermal conductive unit for absorbing heat. The controlling module generates an abnormal signal when the thermal dissipating device is sensed to be in an abnormal state, and the computing module forces to shut down the electronic device after continually receiving the abnormal signal for a predetermined time.
    Type: Grant
    Filed: June 13, 2017
    Date of Patent: June 4, 2019
    Assignee: Enermax Technology Corporation
    Inventors: Jer-Sheng Hwang, Teng-Kai Chang, Chin-Chen Chu
  • Patent number: 9518783
    Abstract: A liquid cooling heat exchanger module filled with a cooling liquid includes a casing (10) and a cooling structure (11), and the interior of the casing (10) is hollow, and the cooling structure (11) is installed in the casing (10), and the cooling structure (11) is formed by a plurality of fins (14) erected vertically and arranged equidistantly apart from one another to form a plurality of flow channels (15), and the cooling structure (11) includes one or more of transversally cut grooves (111) between the fins (15), so as to achieve the effects of extending the time for the cooling liquid to stay in the heat exchanger module (1), maximizing the cooling effect of the cooling liquid, and improving the heat dissipating efficiency.
    Type: Grant
    Filed: December 30, 2012
    Date of Patent: December 13, 2016
    Assignee: ENERMAX TECHNOLOGY CORPORATION
    Inventors: Jer-Sheng Hwang, Teng-Kai Chang
  • Patent number: 9482472
    Abstract: A liquid cooling heat exchanger module filled with a cooling liquid includes a casing (10) and a cooling structure (11), and the interior of the casing (10) is hollow, and the casing (10) has an inlet (100) and an outlet (101) interconnected to the interior, and the cooling structure (11) is installed in the casing (10), and the cooling structure (11) has a vortex generating area (110) concavely formed at a position opposite to the inlet (100), such that a cooling liquid is filled from the inlet (100) into the casing (10) and impacted in the vortex generating area (110) to form a vortex, so as to achieve the effects of extending the time for the cooling liquid to stay in the heat exchanger module (1), maximizing the cooling effect of the cooling liquid, and improving the heat dissipating efficiency.
    Type: Grant
    Filed: July 31, 2012
    Date of Patent: November 1, 2016
    Assignee: ENERMAX TECHNOLOGY CORPORATION
    Inventors: Jer-Sheng Hwang, Teng-Kai Chang
  • Patent number: 9163884
    Abstract: A heat dissipating apparatus with a vortex generator includes a heat conducting base, a heat pipe, and a plurality of heat dissipating fins. Each heat dissipating fin has a pair of vortex generators installed with an interval apart and disposed adjacent to a side of the heat pipe, and each vortex generator has two guiding oblique surfaces protruding from a surface of the heat dissipating fin, and the two guiding oblique surfaces protrude in a tapered form. A through hole is formed at a wide position of the tapered form and penetrates through the heat dissipating fin, such that the vortex generators of each heat dissipating fin induce a stack effect at corresponding upper and lower part of the heat dissipating fin to improve the heat dissipating efficiency.
    Type: Grant
    Filed: May 16, 2011
    Date of Patent: October 20, 2015
    Assignee: ENERMAX TECHNOLOGY CORPORATION
    Inventors: Jer-Sheng Hwang, Sheam-Chyun Lin
  • Patent number: 9151544
    Abstract: A liquid-cooling heat-dissipating module is configured for allowing a cooling liquid to be filled therein and includes a casing and a cooling assembly. The casing has a hollow interior and is provided with an inlet and an outlet in communication with its interior. The cooling assembly is provided in the casing and formed with a conical eddy generation region at a position corresponding to the outlet. The cooling liquid generates an eddy in the eddy generation region to flow into the outlet. By this structure, the staying time of the cooling liquid in the heat exchange module is increased, so that the cooling effect and the heat-dissipating efficiency of the cooling liquid are improved greatly.
    Type: Grant
    Filed: July 31, 2012
    Date of Patent: October 6, 2015
    Assignee: ENERMAX TECHNOLOGY CORPORATION
    Inventors: Jer-Sheng Hwang, Teng-Kai Chang
  • Patent number: 9051942
    Abstract: A fan with a fluid diversion mechanism includes a fan frame structure and a vane wheel, and the fan frame structure has a containing space, an air inlet and an air outlet, and the fan frame structure includes a coaming plate having a plurality of diversion components, and an opening formed at any one of the diversion components and arranged in a direction towards the air inlet, and the vane wheel is installed in the containing space of the fan frame structure, so that when the vane wheel is operated, air current produced by vanes of the fan guides the air current entered from the diversion component to an external side of a retaining platform which is a leeward side, and the air current has an effective coverage for blowing a desired heat source and improves the overall airflow and air pressure of the fan.
    Type: Grant
    Filed: October 25, 2012
    Date of Patent: June 9, 2015
    Assignee: ENERMAX TECHNOLOGY CORPORATION
    Inventor: Yen-Wen Su
  • Patent number: 8860350
    Abstract: A motor driving apparatus is applied to a fan and motor mechanism and a voltage supply unit. The motor driving apparatus includes a motor driving unit, a voltage division resistor, a first resistor, a first switch unit, a second resistor, a second switch unit, a third resistor, a third switch unit, a transistor switch, and a pulse width modulation unit. The first switch unit, the second switch unit, and the third switch unit are configured to select the rotational speed upper limitation of the fan and motor mechanism for suppressing noise.
    Type: Grant
    Filed: October 4, 2012
    Date of Patent: October 14, 2014
    Assignee: Enermax Technology Corporation
    Inventor: Yen-Wen Su
  • Publication number: 20140097770
    Abstract: A motor driving apparatus is applied to a fan and motor mechanism and a voltage supply unit. The motor driving apparatus includes a motor driving unit, a voltage division resistor, a first resistor, a first switch unit, a second resistor, a second switch unit, a third resistor, a third switch unit, a transistor switch, and a pulse width modulation unit. The first switch unit, the second switch unit, and the third switch unit are configured to select the rotational speed upper limitation of the fan and motor mechanism for suppressing noise.
    Type: Application
    Filed: October 4, 2012
    Publication date: April 10, 2014
    Applicant: ENERMAX TECHNOLOGY CORPORATION
    Inventor: Yen-Wen SU
  • Publication number: 20130283253
    Abstract: A water-cooling thermal dissipation system is connected to an electronic device for dissipating heat generated by a thermal generating member. The electronic device includes a motherboard where the heat generating member disposed. The water-cooling heat dissipation system includes at least one thermal-cycling loop, a controlling module, and a connecting member. A cooling liquid of the thermal-cycling loop flows in at least one pump and at least one thermal exchanger through a plurality pipes. The controlling module is electrically connected to the thermal-cycling loop and monitors the operating temperatures of the thermal generating member and the cooling liquid, and outputs a warning signal when one of operation temperatures of the thermal generating member and the cooling liquid is higher than a predetermined value. The connecting member is connected to the controlling module and the motherboard, so that signals can transmit between the controlling module and the motherboard.
    Type: Application
    Filed: March 18, 2013
    Publication date: October 24, 2013
    Applicant: ENERMAX TECHNOLOGY CORPORATION
    Inventors: Jer-Sheng HWANG, Teng-Kai CHANG, Chin-Chen CHU
  • Publication number: 20130118713
    Abstract: A liquid cooling heat exchanger module filled with a cooling liquid includes a casing (10) and a cooling structure (11), and the interior of the casing (10) is hollow, and the cooling structure (11) is installed in the casing (10), and the cooling structure (11) is formed by a plurality of fins (14) erected vertically and arranged equidistantly apart from one another to form a plurality of flow channels (15), and the cooling structure (11) includes one or more of transversally cut grooves (111) between the fins (15), so as to achieve the effects of extending the time for the cooling liquid to stay in the heat exchanger module (1), maximizing the cooling effect of the cooling liquid, and improving the heat dissipating efficiency.
    Type: Application
    Filed: December 30, 2012
    Publication date: May 16, 2013
    Applicant: ENERMAX TECHNOLOGY CORPORATION
    Inventor: Enermax Technology Corporation
  • Patent number: 8123467
    Abstract: A fan device with a vibration attenuating structure is disclosed. The fan device with a vibration attenuating structure comprises a fan and a frame covering the fan. The frame entirely covers the fan, and two opposing sides of the frame have an opening thereon. The openings are corresponding to blades of the fan to form the flowing path of the air. As above-mentioned, the frame performs as a buffering member for attenuating the vibration of the fan so as to prevent the noise generated by the vibration.
    Type: Grant
    Filed: March 12, 2009
    Date of Patent: February 28, 2012
    Assignee: Enermax Technology Corporation
    Inventor: Chun-Ju Lin
  • Patent number: D802543
    Type: Grant
    Filed: March 1, 2016
    Date of Patent: November 14, 2017
    Assignee: ENERMAX TECHNOLOGY CORPORATION
    Inventors: Jer-Sheng Hwang, Sheam-Chyun Lin
  • Patent number: D819578
    Type: Grant
    Filed: July 14, 2016
    Date of Patent: June 5, 2018
    Assignee: ENERMAX TECHNOLOGY CORPORATION
    Inventor: Yen-Wen Su
  • Patent number: D905844
    Type: Grant
    Filed: October 31, 2018
    Date of Patent: December 22, 2020
    Assignee: ENERMAX TECHNOLOGY CORPORATION
    Inventor: Yen-Wen Su
  • Patent number: D931760
    Type: Grant
    Filed: September 9, 2020
    Date of Patent: September 28, 2021
    Assignee: ENERMAX TECHNOLOGY CORPORATION
    Inventor: Yen-Wen Su
  • Patent number: D949061
    Type: Grant
    Filed: September 9, 2020
    Date of Patent: April 19, 2022
    Assignee: ENERMAX TECHNOLOGY CORPORATION
    Inventor: Yen-Wen Su