Patents Assigned to Flextronics AP, LLC
-
Patent number: 8379411Abstract: The present invention relates to voltage transformers, comprising multi-layer structures of piezoelectric ceramics, so-called piezoelectric transformers. The present invention further relates to switched mode power supplies, comprising such a piezoelectric transformer as part of a piezoelectric converter. The piezoelectric transformer according to the invention comprises a primary-side electrode arrangement (102) that can be connected to the primary-side voltage, a secondary-side electrode arrangement (104) on which the secondary-side voltage can be tapped, and an auxiliary electrode arrangement (106) for creating an auxiliary electrode voltage proportional to the secondary-side voltage, wherein the auxiliary electrode arrangement (106) is formed by at least two plane electrodes located opposite one another.Type: GrantFiled: June 9, 2008Date of Patent: February 19, 2013Assignee: Flextronics AP, LLCInventors: Michael Bothe, Stefan Mörbe
-
Patent number: 8378222Abstract: This invention relates to a substrate with via and pad structure(s) to reduce solder wicking. Each via and pad structure connects a component to conductive layers associated with the substrate. The substrate includes one or more plated vias, solder mask(s) surrounding the plated vias, and a conductive pad with a conductive trace connected to each plated via. The conductive pad extends beyond the terminal sides to increase solder formation and the solder mask reduces solder formation at the terminal end of the component. The via and pad structure is suitable for a variety of components and high component density. The invention also provides a computer implemented method for calculating the maximum distance of a conductive pad extending beyond the terminal side of a component.Type: GrantFiled: December 11, 2009Date of Patent: February 19, 2013Assignee: Flextronics AP, LLCInventors: Glen C. Shepherd, Anthony Aaron Lynn Burton, Michael Ryan Ng, Mimi Munson Tantillo, Dieu-Huong Nguyen Tran
-
Publication number: 20130027600Abstract: A camera module including a particle trap. The particle trap may be disposed in the camera module and may be operable to prevent particles from obstructing an optical path defined between a lens assembly and an image sensor. The particle trap may include a particle getter to retain particles in contact with the particle trap. The camera module may be operative to move the lens assembly so as to provide focus on the image sensor for objects at various distances from the camera module. The movement of the lens assembly may be a source of particles retained by the particle trap.Type: ApplicationFiled: October 10, 2011Publication date: January 31, 2013Applicant: Flextronics AP, LLCInventors: Prebesh Pavithran, Yeow Thiam Ooi, Haw Chyn Cheng, Hung Khin Wong, Giap Chye Toh, Shun Kyo Low
-
Patent number: 8363439Abstract: An power converter that is operable to convert AC power into DC power that may be delivered to a load. The power converter includes a transformer and a controllable switch. The switching frequency of the power converter is configured to be dependent on the level of the AC voltage of an AC power source. The switching frequency may be proportional to the AC voltage to provide a constant magnetic flux density swing for the transformer in the power converter. The switching frequency may be controlled by using a circuit that converts the AC voltage from the AC power source into a frequency signal that is proportional to the AC voltage.Type: GrantFiled: April 22, 2008Date of Patent: January 29, 2013Assignee: Flextronics AP, LLCInventor: Zaohong Yang
-
Publication number: 20130016476Abstract: An electronic device such as an AC/DC power adapter includes a conductive heat dissipation system. The device contains heat generating components and is powered via power supply leads by an external power supply circuit. The device further contains a thermally conductive mass that is thermally coupled to both the heat generating components and to the power supply leads. When the power supply leads are coupled to receive electricity from the external power supply circuit, heat generated by the device is thermally conducted into the external power supply circuit via the power supply leads.Type: ApplicationFiled: August 30, 2012Publication date: January 17, 2013Applicant: Flextronics AP, LLCInventors: Bahman Sharifipour, Arian Jansen
-
Patent number: 8342862Abstract: A power connector comprises a slidably positionable earth pin. The earth pin is able to be positioned in a travel, or small form factor and in an operational form factor. The housing of the connector comprises a member having a slot that defines a sliding path for the earth pin. The member also has two sets of grooves for receiving a set of spring loaded protrusions on the earth pin. The protrusions come to rest in one of the sets of grooves thereby defining a small form factor and an operational form factor.Type: GrantFiled: November 16, 2010Date of Patent: January 1, 2013Assignee: Flextronics AP, LLCInventors: Roland Konersmann, Andreas Kniesel
-
Patent number: 8339231Abstract: A magnetics package comprising: a primary coil configured to conduct a current flow; a secondary coil electrically isolated from the primary coil and configured to conduct a current flow, wherein the secondary coil is embedded in a mold compound; and a magnetic core inductively coupling the primary coil and the secondary coil, wherein a current flow in the primary coil produces a magnetic field in the magnetic core, and the magnetic field in the magnetic core induces a current flow in the secondary coil.Type: GrantFiled: March 22, 2010Date of Patent: December 25, 2012Assignee: Flextronics AP, LLCInventor: Rajeev Joshi
-
Patent number: 8328067Abstract: A novel inert environment enclosure includes an object inlet where production objects enter the enclosure and an object outlet where the production objects exit. At least one of the object inlet and the object outlet includes both a top-side flow obstructer and a bottom-side flow obstructer for preventing air from entering the enclosure. In a particular embodiment, the top-side flow obstructer and the bottom-side flow obstructer each include a curtain constructed from a flexible fabric having a plurality of individual adjacent fingers. In another particular embodiment, the inert environment enclosure is a nitrogen hood that houses a wave soldering machine. A inert gas nozzle is mounted at or near the inlet and/or the outlet. The inert environment enclosure maintains a positive pressure with respect to the surrounding environment when production objects are passed through the enclosure.Type: GrantFiled: January 30, 2012Date of Patent: December 11, 2012Assignee: Flextronics AP LLCInventors: Larry Yanaros, Frederick Wagner
-
Patent number: 8328077Abstract: In one embodiment, a method for soldering photovoltaic solar cells includes providing a first and second PV cell, a holder, soldering ribbon and a mass reflow oven. The method further includes placing the soldering ribbon in a fixture groove in the holder. The method further includes placing the first and second PV cell in the holder such that the soldering ribbon is position in a desired position on the first and second PV cell. The method further includes placing the holder and the first and second PV cell with the soldering ribbon into the mass reflow oven. The method further includes heating the holder and the first and second PV cell with the soldering ribbon in the mass reflow oven to solder the first and second PV cell. The method further includes cooling the holder and the first and second PV cell with the soldering ribbon.Type: GrantFiled: November 1, 2011Date of Patent: December 11, 2012Assignee: Flextronics AP, LLCInventors: Dennis Willie, Chris Stratas, David Geiger
-
Patent number: 8302301Abstract: Methods of backdrilling printed circuit boards (PCBs) to remove via stubs and related apparatuses. The method may include removing a via stub through a combination of backdrilling and chemical etching. The backdrilling may remove a masking layer from the via stub. Portions of an underlying layer may remain in the region of the via stub after the backdrilling is completed. The remaining portions of the underlying layer may be removed in a subsequent etching process thereby removing the via stub from the PCB. As the backdrilling step may be used for the limited purpose of removing the outer layer and portions of the underlying layer remaining in the via can be tolerated, the diameter of the backdrilling need not be as large as traditional backdrilling where all layers within the via must be ensured of being completely removed.Type: GrantFiled: March 8, 2011Date of Patent: November 6, 2012Assignee: Flextronics AP, LLCInventor: Cheuk Ping Lau
-
Patent number: 8295048Abstract: An electronic device such as an AC/DC power adapter includes a conductive heat dissipation system. The device contains heat generating components and is powered via power supply leads by an external power supply circuit. The device further contains a thermally conductive mass that is thermally coupled to both the heat generating components and to the power supply leads. When the power supply leads are coupled to receive electricity from the external power supply circuit, heat generated by the device is thermally conducted into the external power supply circuit via the power supply leads.Type: GrantFiled: December 20, 2010Date of Patent: October 23, 2012Assignee: Flextronics AP, LLCInventors: Bahman Sharifipour, Arian Jansen
-
Patent number: 8295349Abstract: A method and system for video compression prediction mode determination is disclosed. For one embodiment of the invention, the frequency domain characteristics (FDCs) of an image block are determined. The FDCs of the image block are compared to the FDCs of each of a number of prediction modes. The prediction mode having FDCs most similar to those of the image block is then determined and selected for encoding the block. For one embodiment of the invention the FDCs of the nine 4×4 prediction modes of the H.264 standard and the FDCs of a 4×4 image block are defined using a frequency domain transform. For one embodiment of the invention, one or more additional prediction modes are evaluated, and of these, the prediction mode resulting in RD optimization is selected for encoding the block.Type: GrantFiled: May 23, 2006Date of Patent: October 23, 2012Assignee: Flextronics AP, LLCInventors: Vibhor Tikiya, Pallapothu Shyam Sundera Bala Koteswara Gupta, Kopparapu Suman
-
Patent number: 8289741Abstract: A regulated power supply apparatus and method are provided. The apparatus includes a converter circuit for generating a regulated voltage signal. The converter circuit includes a first switching circuit and a second switching circuit both coupled with an output circuit. A first and a second transformer include a first and a second secondary, which are coupled with each other in series or alternatively, coupled with each other in parallel. An input rectifier circuit is coupled with the first and the second switching circuit. The input rectifier circuit is configured for receiving an AC input voltage and for generating a rectified voltage. The input rectifier circuit includes controlled switches and a first and second configuration of a bridge rectifier that couples the first and second switching circuits in series or parallel depending if the AC input power signal is “high-line” or “low-line.” A controller circuit is provided for enabling either the first configuration or the second configuration.Type: GrantFiled: January 14, 2010Date of Patent: October 16, 2012Assignee: Flextronics AP, LLCInventor: Aaron Jungreis
-
Publication number: 20120254345Abstract: Methods and apparatus are disclosed for servicing a target device with a remote access device. The target device has a target-device input/output interface and the remote access device has a remote-access-device input/output interface that are operatively coupled at the hardware level. A wireless communication link is established between the remote access device and a communications network to establish a communication link between a computer remote from the target device and from the remote access device. Service instructions are received from the computer at the remote access device over the communication link The received service instructions are transmitted through the coupled input/output interfaces to service the target device.Type: ApplicationFiled: July 30, 2010Publication date: October 4, 2012Applicant: FLextronics AP, LLCInventor: Adam Montoya
-
Patent number: 8279646Abstract: A regulated power supply apparatus and method is provided. A converter circuit is configured to generate a regulated voltage signal from an unregulated voltage signal. A power sequencing circuit includes an unregulated voltage source input terminal and is configured for coupling an unregulated voltage signal to an unregulated voltage signal input terminal of the converter circuit. The power sequencing circuit includes an enable output coupled to the enable signal input terminal and includes a power limiting circuit and a trigger circuit. The power limiting circuit includes a first cascade of discrete analog components as controls for a first switching element and the trigger circuit includes a second cascade of discrete analog components as controls for a second switching element. The first cascade is configured as a charge control circuit for controlling a rate of charge of a first filter network and includes a zener diode coupled in parallel.Type: GrantFiled: December 12, 2008Date of Patent: October 2, 2012Assignee: Flextronics AP, LLCInventor: James R. Hamstra
-
Patent number: 8274486Abstract: A touch screen assembly and method of manufacturing thereof that includes a single layer of conductive material is provided. The conductive material is configured to include a horizontal pattern and a vertical pattern of electrodes, with one of the patterns having gaps between the electrodes, such that the electrodes in the horizontal pattern do not come into direct contact with electrodes in the vertical pattern. To provide a connection between the electrodes separated by gaps in the interrupted pattern, an insulating material is placed onto the gaps over the uninterrupted pattern, and a printable and electrically conductive connector is positioned over the insulating material and functions to couple at least two electrodes together. In one embodiment, the conductive connector includes carbon nanotubes.Type: GrantFiled: December 22, 2008Date of Patent: September 25, 2012Assignee: Flextronics AP, LLCInventors: Fabrice Barbier, Farouk Zabel
-
Patent number: 8267443Abstract: A computer housing (10) is disclosed, that uses a camming action to move a latch (62). The latch (62) is movable between at least two positions—a latching position and an unlatching position. Moving the latch (62) to its unlatching position causes the latch (62) to engage and move one or more latching members or snaps (42) that detachably engage a bezel (38). Once the latching members or snaps (42) have been sufficiently moved, the bezel (38) may be moved away from the remainder of the computer housing (10). Reattaching the bezel (38) to the computer housing (10) automatically moves the latch (62) back to its latching position.Type: GrantFiled: May 20, 2008Date of Patent: September 18, 2012Assignee: Flextronics AP, LLCInventors: Chen-Chien Kuo, Huai-Wen Fu
-
Patent number: 8257156Abstract: Provided are electronics chassis having air inlets with increased cross-sectional area that facilitate airflow through the chassis and thereby provide improved cooling. As electronics chassis are often stacked, it has been determined that the upper surfaces of a lower chassis may be utilized to at least partially define the air inlet of the upper chassis. In this regard, an upper portion of the lower chassis may be removed to increase the size of an air inlet. That is, portions of an upper wall and/or the top wall of a lower chassis are removed and connected by a connecting wall (e.g. a tapered and/or a chamfered wall). Likewise, the bottom wall of an upper chassis may be removed. When stacked, the air inlet of the upper chassis may be disposed above the truncated portion of the lower chassis. In such an arrangement, the size of the resulting air intake is significantly increased.Type: GrantFiled: March 20, 2007Date of Patent: September 4, 2012Assignee: Flextronics AP, LLCInventors: Younes Shabany, Hans Yum, Todd Collis, Steve Bisbikis, Steve Koo, Kieran Miller
-
Patent number: 8248523Abstract: A disclosed method of manufacturing a camera module includes providing an image capture device, providing an electronic component, providing a flexible circuit substrate, mounting the image capture device on a first portion of the flexible circuit substrate, mounting the electronic component on the second portion of the flexible circuit substrate, and positioning the second portion above the first portion. The method further includes providing a chip carrier including a bottom surface defining a cavity and a top surface adapted to receive the image capture device and positioning the chip carrier between the image capture device and the flexible circuit substrate. The method further includes mounting a second electronic component within the cavity.Type: GrantFiled: November 5, 2009Date of Patent: August 21, 2012Assignee: Flextronics AP, LLCInventors: Albert John Y. Chua, Abhijit Limaye
-
Patent number: 8228306Abstract: An integrated touch screen and display device includes a polarizer with a layer of transparent conductive material deposited thereon. A touch screen controller is coupled to electrodes of the transparent conductive layer to detect the location of touches by, for example, a finger or stylus. A method for producing an integrated touch screen and display device includes applying a transparent conductive coating to an outer surface of a polarizer of a display device, creating electrodes in the conductive coating, and coupling the electrodes to a touch screen controller. A double super twisted nematic display that includes a capacitive touch panel integrated into a compensation cell of the display is also provided herein.Type: GrantFiled: July 22, 2009Date of Patent: July 24, 2012Assignee: Flextronics AP, LLCInventors: Ding Hua Long, Hai Long Zhang, Hai Hui Zhang