Abstract: A regulated power supply apparatus is provided. The apparatus includes an input power converting circuit for generating a rectified voltage signal, an output power converting circuit comprising a plurality of switching elements, the output power converting circuit coupled to receive the rectified voltage signal, an output power storing element coupled with the output power converting circuit, and an output power bidirectional regulating circuit comprising an integrated circuit coupled with the output power converting circuit, the bidirectional regulating circuit including control signals for operating the switching elements to store power on the output power storing element and to deliver power to an output load from the output power storing element. An integrated circuit controlled regulator circuit is provided for controlling a plurality of switches a boost and buck converter. A method of regulating power supply is also provided.

Abstract: A method for manufacturing a touch screen sensor assembly that includes providing a first transparent substrate, depositing a first non-metallic conductive layer onto the first substrate, removing the first conductive layer from a viewing portion of the first substrate, depositing a second non-metallic conductive layer onto the viewing portion, and removing portions of the second and first conductive layers to respectively form a first electrode pattern and a plurality of traces. The disclosed method also includes providing a second transparent substrate, depositing a third non-metallic conductive layer onto a viewing portion of the second substrate, removing portions of the third conductive layer to form a second electrode pattern, and bonding the first substrate to the second substrate using an optically clear adhesive. Each trace on the first substrate formed from the first conductive layer is electrically coupled to at least one electrode of either the first or second electrode patterns.

Abstract: A novel micro camera module that is manually adjustable between a close-up mode and an infinite mode includes a lens assembly adjustably mounted within a sleeve that is adjustably mounted into a housing. In a particular embodiment the sleeve includes a channel (cam groove) that is engaged by a plurality of pins fixed to the housing. Further, a biasing member is disposed between the sleeve and the housing such that an upward force will enable the pins to firmly engage the lower portion of the channel. In a more particular embodiment, the channel defines two detents that secure the sleeve into predetermined positions with respect to the housing. In an even more particular embodiment, the channel is sloped such that upon rotation of the sleeve, the distance between the lens assembly and an image capture device is changed. In another particular embodiment, the camera module includes an electrical mode detecting switch that is indicative of the position of the camera module.

Abstract: A multi-turn coil device comprising a flexible circuit board and a plurality of serially electrically coupled coils coupled to both sides of the flexible circuit board. The coils are formed such that when the circuit board is folded in an accordion manner, the coils are substantially aligned and have the same direction of current flow. The coils are serially coupled sequentially from front to back and back to front wherein the coupling of the coils is through a plated through hole in the flexible circuit board.

Abstract: A control circuit for a primary controlled switched-mode power supply that has a primary-side switch and a transmitter. It also relates to an associated switched-mode power supply. The control circuit can be connected to a control input of the primary-side switch so that the primary-side switch is controlled based on a secondary-side current flow time period in which a current flows through the secondary-side winding of the transmitter in order to regulate the output voltage. The secondary-side current flow time period can be used as a control parameter instead of the actual output voltage in order to then control the primary-side switch. Because the secondary-side current flow time period can be determined indirectly on the primary side, no direct feedback is necessary between the output voltage on the secondary side and the control circuit on the primary side.

Abstract: Some embodiments of the present invention are internal antennae for mobile devices. For example, an internal antenna for a mobile device that is a continuous length of wire formed into a collection of antenna features. Other embodiments relate to methods of manufacturing internal antennae for mobile devices; for example, manufacturing an internal antenna for a mobile device from a continuous length of wire. Still other embodiments relate to an iterative antenna production and re-design cycle. Preferably, antennae consistent with some embodiments of the invention include multiple radiator portions, a contact region, and integral configured to form a torsion spring of the contact region and parts of the radiator portions that reacts against displacement of the contact region toward those parts of the radiator portions.

Abstract: A solder return apparatus for a wave solder machine that collects solder exiting a nozzle and returns the solder to a solder reservoir while limiting the degree to which the solder can splash onto electronic substrates (e.g., printed circuit boards), components of the wave solder machine, and/or the like. The apparatus includes a mounting section that may be placed over an upper surface of the nozzle and a collection section that collects the solder and returns the solder to the solder reservoir. The collection section includes a trough having an opening in a bottom wall of the trough and a flow control member that can adjust a quantity of solder exiting the trough as well as the velocity of the solder exiting the trough. One or more deflection plates can be mounted so as to extend from the trough into solder in the solder reservoir to further contain the solder and limit the degree to which splashing solder can reach unintended locations.

Abstract: An injection molding machine is provided that allows the use of two conventional molds. The injection molding machine utilizes an injection material distributing platen having a first mold mounting surface and a second opposing mold mounting surface. A conventional mold may be mounted to each mold mounting surface. To provide injection material to the molds, an injection unit may provide injection material to an internal passageway within the distributing platen between the first and second mold mounting surfaces. The injection material may be selectively distributed to molds attached in the first and second mold mounting surfaces. To reduce the overall size of the machine, the injection unit may be a vertical injection unit that is disposed above the distributing platen.

Abstract: Apparatus and methods for removing components soldered to a printed circuit board (PCB). Embodiments presented generally include a contact plate having a component specific platform offset from the contact plate body. The offset platform may be substantially identical in size and shape as the component to be removed. Accordingly, contact between a heated platform and component may allow for conductive heating to occur based on contact with the component. Thus, forced air or convective heating of the component does not occur such that solder joint defects in adjacent components may be prevented. A vacuum retention port may be provided at an interface of the platform and component when in contact. The vacuum retention port may allow the freed component to be removed from the PCB using vacuum to hold the freed component to the platform. Also, apparatus for automation of a process according to the forgoing are presented.

Abstract: A camera housing positionably coupled to an electronic appliance is disclosed. Preferably, the camera housing is positionable in two discrete positions such that the camera can be positioned to face towards or away from the user. The appliance includes a recess sized to receive the camera housing. A cellular telephone includes a camera housing which is positionable in two discrete positions. In the first position, the camera faces the user. In the second position, the camera faces away from the user. The camera housing is coupled to the cellular telephone by a hinge mechanism that latches the camera into one of the two positions.

Abstract: A novel inert environment enclosure includes an object inlet where production objects enter the enclosure and an object outlet where the production objects exit. At least one of the object inlet and the object outlet includes both a top-side flow obstructer and a bottom-side flow obstructer for preventing air from entering the enclosure. In a particular embodiment, the top-side flow obstructer and the bottom-side flow obstructer each include a curtain constructed from a flexible fabric having a plurality of individual adjacent fingers. In another particular embodiment, the inert environment enclosure is a nitrogen hood that houses a wave soldering machine. A inert gas nozzle is mounted at or near the inlet and/or the outlet. The inert environment enclosure maintains a positive pressure with respect to the surrounding environment when production objects are passed through the enclosure.

Abstract: A regulated power factor corrected power supply apparatus is provided. The apparatus includes an input rectifier circuit for receiving an input AC voltage and outputting a full-wave rectified DC voltage. A single-stage isolated buck-type converter is coupled with the input circuit. The converter circuit comprises an isolated buck-type converter circuit including an isolation transformer. An output rectifier and semiconductor tap switch are coupled to a secondary winding of the isolation transformer. The tap switch couples a larger portion of the secondary winding to an output bulk capacitor during the portions of the input sinewave half-cycle, which are low in amplitude. The tap switch enables the single-stage isolation buck-type converter to operate over a much larger portion of the input sinewave, but also allows the converter to operate at high-efficiency over the majority of the input sinewave.

Abstract: Systems and methods electrically connect a first electronic device or electrical component, having a external electrical connector, to a circuit board of a second electronic device. A low-cost, user-installable connection system isolates mechanical stresses imposed on the external electrical connector to within the user-installable connection system, thereby preventing the mechanical stresses from reaching the circuit board in the second electronic device. If the connection becomes faulty, only the low-cost, user-installable connection system must be replaced.

Abstract: A low-cost wafer-level packaging (WLP) method for attaching glass to optical image-sensor devices on a semiconductor wafer in order to increase the yield of image-sensor modules during later steps of assembly. One embodiment relates to applications with image-sensors (and microlenses) fabricated on a wafer. A glass wafer is singulated, aligned to mirror the die pattern on an image-sensor wafer, and then bonded to the image-sensor wafer such that optical adhesive forms a layer between the each image-sensor and its glass cover. Another embodiment applies cavity walls to singulated glass covers, which are then attached to image sensors which may be formed on a single wafer. The wafer can then be singulated and a plurality of image sensor packages is formed.

Abstract: A novel digital camera module includes an image capture device, a circuit substrate, a lens unit and a housing that is mounted to the circuit substrate before the image capture device is mounted to the circuit substrate. In one particular embodiment, the housing is formed onto the circuit substrate via molding. The housing includes a bore to receive the lens unit, with the diameter of the bore being larger than the diagonal of the image capture device such that image capture device can be mounted to the circuit substrate through the bore. In another particular embodiment, the circuit substrate includes an aperture so as to facilitate the flip-chip bonding of the image capture device. The order in which the image capture device and the housing are coupled to the circuit substrate helps prevent damage to the image capture device during the mounting of the housing to the circuit substrate.

Abstract: A miniature camera module comprising: a module frame comprising a surface with a conduit passing through the surface, thereby allowing light to pass through the surface via the conduit; a first blade coupled to the module frame and configured to rotate about a first axis between an open position and a closed position, wherein the first blade does not eclipse the conduit at all when in the open position and the first blade at least partially eclipses the conduit when in the closed position; a first solenoid coupled to the module frame; and a first pin coupled to the first solenoid, wherein an actuation of the first solenoid causes the first pin to rotate the first blade from the open position to the closed position. In some embodiments, the module includes additional blades, solenoids and pins.

Abstract: An apparatus for generating a compensation signal for a power converter where the second harmonic ripple on the voltage bus is substantially removed from the compensation signal. The apparatus comprises a frequency-locked clock generator, a bus voltage data generator, a stack, and a compensation signal generator. The frequency-locked clock is coupled to the power converter voltage bus that contains harmonics of the AC line frequency. The clock generator frequency locks to the second harmonic of the AC line frequency and creates a system clock which is used for the synchronous operations throughout the apparatus. The bus-voltage data generator inputs a power converter scaled-bus voltage, generates bus-voltage data at a sampling rate which is determined by the coupled system clock. The output of the bus-voltage generator is input into a stack.

Abstract: A devices cage comprises a first wall having m parallel channels across a length of the first wall and a second wall having n parallel channels across a length of the second wall. In some embodiments, n is at least equal to m. Each parallel channel is equal to a diameter of a head of a drive mounting screw. The first wall comprises at least one bridge positioned across each m parallel channel and at least one clamp spring integrally coupled to a top of each m parallel channel. The second wall also comprises at least one bridge positioned across each n parallel channel. Each end of the m parallel channel extends at an inwards slant toward a center of the first wall. The inwards slant terminates at a circular area around configured in a dome shape with a flat top.

Abstract: In accordance with a first embodiment, the present invention provides a circuit substrate comprising a first surface; a second surface; a first via having a first end near said first surface and a second end near said second surface; a second via having a first end near said first surface and a second end near said second surface; a first conductive element electrically coupling said first end of said first via and said first end of said second via; a second conductive element electrically coupling said second end of said first via and said second end of said second via; an input signal line coupled to said first via; and an output signal line coupled to said second via.

Abstract: A power supply apparatus and method of regulating is provided. A clock generator circuit is configured for generating a clock signal at a predetermined frequency. An amplifier circuit is coupled with the clock generator circuit. The amplifier circuit includes a gain circuit coupled with the clock generator circuit. The amplifier circuit is configured to receive the clock signal at a switching element of the gain circuit. A controller circuit is configured for receiving a modulated error signal of the amplifier circuit and is configured for generating a pulse width modulated signal for controlling a duty cycle of the switching circuit. The switching circuit is configured for receiving the modulated error signal. The error signal is modulated using the clock signal to vary a gain value of the gain circuit according to the predetermined frequency. An output circuit is coupled with the switching circuit and is configured for generating a regulated voltage signal.