Patents Assigned to Foxconn Technology Co., Ltd.
  • BASE WITH HEAT ABSORBER AND HEAT DISSIPATING MODULE HAVING THE BASE
    Publication number: 20140150993
    Abstract: An exemplary base includes a heat absorber and clips attached to the heat absorber. The heat absorber includes a top surface and a bottom surface. A pair of receiving grooves is defined in opposite lateral sides of the heat absorber, respectively. Each receiving groove is located above a level of the bottom surface and below a level of the top surface. Each clip includes a positioning beam. The positioning beam is received in a corresponding one of the receiving grooves with a portion of the heat absorber adjacent to the positioning beam deformed and fixed in the positioning beam thereby fixing the positioning beam in the receiving groove. A heat dissipating module having the base is also provided.
    Type: Application
    Filed: April 29, 2013
    Publication date: June 5, 2014
    Applicants: FOXCONN TECHNOLOGY CO., LTD., FURUI PRECISE COMPONENT (KUNSHAN) CO., LTD.
    Inventors: YI-CHANG LIU, JUI-WEN HUNG, JIAN-ZHONG LU
  • COOLING FAN WITH ROTOR SHAFT END ABUTTING POLYOXYMETHYLENE TUBE BOTTOM
    Publication number: 20140147281
    Abstract: An exemplary cooling fan includes a base, a central tube formed at the base, a stator, and a rotor being rotatable relative to the stator. The central tube is made of polyoxymethylene. The central tube includes a bottom plate mounted on the base and a peripheral sidewall extending upwardly from a peripheral edges of the bottom plate. The bottom plate and the sidewall cooperatively define a blind hole therebetween. The stator is mounted around the sidewall of the central tube. The rotor includes a hub and a shaft extending from the hub. The shaft includes a free end received in the blind hole and directly abutting the bottom plate.
    Type: Application
    Filed: December 13, 2012
    Publication date: May 29, 2014
    Applicants: FOXCONN TECHNOLOGY CO., LTD., FURUI PRECISE COMPONENT (KUNSHAN) CO., LTD.
    Inventor: QIAO-YUN SUN
  • COOLING FAN WITH ROTOR BLADE FLANGES FOR CONTROLLING ROTOR MOVEMENT
    Publication number: 20140134011
    Abstract: An exemplary cooling fan includes a housing having an air inlet and an air outlet opposite to the air inlet, a rotor received in the housing, and a stator received in the housing and rotatably supporting the rotor. The rotor includes a hub, blades extending outwardly from an outer periphery of the hub, and flanges slantwise extending from top edges of end portions of the blades. In operation of the cooling fan, air located at an outside of the cooling fan enters the air inlet and flows towards the blades and along the flanges thereby pressing the rotor towards a bottom of the stator along an axial direction of the cooling fan, and the air subsequently flows out of the cooling fan via the air outlet.
    Type: Application
    Filed: December 26, 2012
    Publication date: May 15, 2014
    Applicant: FOXCONN TECHNOLOGY CO., LTD.
    Inventors: WEN-CHENG CHEN, CHIEN-YAO LIAO
  • FLAT HEAT PIPE
    Publication number: 20140102671
    Abstract: An exemplary flat heat pipe includes a hollow, flattened casing and a first wick structure and a second wick structure received in the casing. The casing includes a top plate and a bottom plate opposite to the top plate. The first wick structure is formed by weaving wires, and the second wick structure is made of sintered metal powder. The first and second wick structures are disposed at inner sides of the bottom and top plates of the casing, respectively. The first and second wick structures contact each other. The casing defines two vapor channels at opposite lateral sides of the combined first and second wick structures, respectively.
    Type: Application
    Filed: December 26, 2013
    Publication date: April 17, 2014
    Applicants: FOXCONN TECHNOLOGY CO., LTD., FURUI PRECISE COMPONENT (KUNSHAN) CO., LTD.
    Inventors: SHENG-LIANG DAI, JIN-PENG LIU, YUE LIU, SHENG-GUO ZHOU, SHENG-LIN WU, NIEN-TIEN CHENG
  • Electronic device having heat dissipation device
    Patent number: 8686296
    Abstract: An exemplary heat dissipation device includes a bracket, and heat sink and a pressing member. The bracket includes a bottom plate. An opening is defined in the bottom plate. Two supporting portions are formed from an underside of the bottom plate. The heat sink extends through the opening of the bracket, with bottom edges of the heat sink rested on the supporting portions. The pressing member is mounted on the bracket and elastically presses the heat sink onto the supporting portions.
    Type: Grant
    Filed: December 29, 2011
    Date of Patent: April 1, 2014
    Assignee: Foxconn Technology Co., Ltd.
    Inventors: Ching-Bai Hwang, Jui-Wen Hung
  • Fastener and electronic assembly having the same
    Patent number: 8681499
    Abstract: An exemplary fastener includes a connecting member and a protecting member. The connecting member includes a head, and a connecting portion extending down away from the head. The protecting member includes a first engaging portion and a second engaging portion extending from the first engaging portion. The first and second engaging portions are coaxial. The connecting portion of the connecting member extends through the second engaging portion, the head of the connecting member is surrounded by the first engaging portion of the protecting member with a bottom surface of the head abutting a top end of the second engaging portion. A top end of the first engaging portion is above a top surface of the head and defines a receiving space above the head. The receiving space is adapted for receiving a tool therein.
    Type: Grant
    Filed: September 19, 2011
    Date of Patent: March 25, 2014
    Assignees: Furui Precise Component (Kunshan) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: Jia Rao, Zhi-Hui Zhao
  • Flat heat pipe and method for manufacturing the same
    Patent number: 8667684
    Abstract: An exemplary flat heat pipe includes a hollow, flattened casing and a first wick structure and a second wick structure received in the casing. The casing includes a top plate and a bottom plate opposite to the top plate. The first wick structure is formed by weaving wires, and the second wick structure is made of sintered metal powder. The first and second wick structures are disposed at inner sides of the bottom and top plates of the casing, respectively. The first and second wick structures contact each other. The casing defines two vapor channels at opposite lateral sides of the combined first and second wick structures, respectively. A method for manufacturing the heat pipe is also provided.
    Type: Grant
    Filed: June 28, 2010
    Date of Patent: March 11, 2014
    Assignees: Furui Precise Component (Kunshan) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: Sheng-Liang Dai, Jin-Peng Liu, Yue Liu, Sheng-Guo Zhou, Sheng-Lin Wu, Nien-Tien Cheng
  • HEAT PIPE AND METHOD FOR MANUFACTUREING THE SAME
    Publication number: 20140060781
    Abstract: An exemplary heat pipe includes a first pipe and a second pipe. The first pipe includes a condenser section and an evaporator section extending from the condenser section along a longitudinal direction thereof. The second pipe encloses the condenser section of the first pipe. The evaporator section is located at an outside of the second pipe. The second pipe includes a casing enclosing the condenser section, second wick structures and working fluid contained in the second wick structures. Opposite ends of each second wick structure are respectively adhered to an inner wall of the casing and an outer periphery of the condenser section.
    Type: Application
    Filed: September 16, 2012
    Publication date: March 6, 2014
    Applicants: FOXCONN TECHNOLOGY CO., LTD., FURUI PRECISE COMPONENT (KUNSHAN) CO., LTD.
    Inventors: ZHAO-HUI JIA, JIA-HONG WU, YU-LIANG LO
  • CLIP ASSEMBLY AND HEAT DISSIPATION DEVICE INCORPORATING THE SAME
    Publication number: 20140060895
    Abstract: An exemplary heat dissipation device includes a heat sink and a clip assembly spanning the heat sink. The clip assembly includes a wire clip and two fasteners engaging with the wire clip. The wire clip includes a main body and two engaging arms extending outwardly from two ends of the main body respectively. Each engaging arm includes a first section extending outwardly from the main body, a second section opposite to the first section, an engaging portion interconnecting the first section with the second section, and a hook bent outwardly from a free end of the second section. The main body and the hook of each engaging arm are hooked on the heat sink, and each fastener extends through the corresponding engaging portion. The engaging portions are resiliently pressed by the fasteners, and the heat sink is pressed downwardly by the main body of the wire clip.
    Type: Application
    Filed: December 25, 2012
    Publication date: March 6, 2014
    Applicants: FOXCONN TECHNOLOGY CO., LTD., CHAMP TECH OPTICAL (FOSHAN) CORPORATION
    Inventors: MING-WEI CHEN, JING ZHANG, TAO LI
  • CLIP ASSEMBLY AND HEAT DISSIPATION DEVICE INCORPORATING THE SAME
    Publication number: 20140060894
    Abstract: An exemplary heat dissipation device includes a heat sink and a clip assembly spanning the heat sink. The clip assembly includes two wire clips and two fasteners engaging with the wire clips, respectively. The wire clip includes two opposite engaging arms, and an engaging section interconnecting the two engaging arms. Each engaging arm includes a connecting section extending outwardly from the engaging section, and a hook bent outwardly from a free end of the connecting section. The hooks of each wire clip are hooked in the heat sink, each fastener extends through the engaging section of the corresponding wire clip, the engaging section of the wire clip is resiliently pressed by the fastener, and the heat sink is pressed downwardly by the connecting section of the wire clip.
    Type: Application
    Filed: December 25, 2012
    Publication date: March 6, 2014
    Applicants: FOXCONN TECHNOLOGY CO., LTD., CHAMP TECH OPTICAL (FOSHAN) CORPORATION
    Inventors: MING-WEI CHEN, JING ZHANG, TAO LI
  • Electronic device with heat pipe chamber cover for dissipating heat
    Patent number: 8659892
    Abstract: An exemplary electronic device includes a base, a cover, side plates, a heat conduct plate, a wick structure, a working medium and at least one electronic element. The cover and the base cooperatively define a cavity. The at least one side plate extends from the cover and receives in the cavity. The heat conduct plate and the at least side plate and the cover cooperatively defines a sealed chamber. The wick structure is attached to an inner surface of the sealed chamber. The working medium is received in the wick structure. The at least one electronic element is received in the cavity and thermally connected to the heat conduct plate.
    Type: Grant
    Filed: August 8, 2011
    Date of Patent: February 25, 2014
    Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: Qing-Ping Yan, De-Yu Wang, Jiang-Jun Hu, Chuen-Shu Hou
  • LED lamp
    Patent number: 8657471
    Abstract: An LED lamp includes a heat sink, a heat pipe and an LED. The heat sink includes a connecting core and fins mounted around the connecting core. Each of the fins includes a plate-shaped main body and a flange extending perpendicularly from a periphery side of the main body. The flanges of the fins cooperatively form an annular planar top surface of the heat sink. The heat pipe includes a condensing section, an evaporating section parallel to and higher than the condensing section and an adiabatic section connected between the condensing section and the evaporating section. The condensing section is fixed to and thermally connects with the top surface of the heat sink. The LED is directly mounted on the evaporating section with a light emitting surface thereof facing outwardly.
    Type: Grant
    Filed: June 27, 2011
    Date of Patent: February 25, 2014
    Assignee: Foxconn Technology Co., Ltd.
    Inventors: Wei-Jen Huang, Jui-Wen Hung, Ching-Bai Hwang
  • Method for manufacturing heat dissipating apparatus
    Patent number: 8656590
    Abstract: An exemplary method for manufacturing a heat dissipation apparatus includes, firstly, providing a fin assembly including a stack of fins spaced from each other. Each fin defines a through hole therein, and includes a collar formed at an edge of the through hole. Then a heat pipe is provided, and inserted in the through holes of the fins. Next, two opposing punching tools are provided. Each punching tool defines a series of recesses. The subassembly of the heat pipe and fins is positioned between the two punching tools, with the collar of each fin located between two corresponding recesses of the two punching tools. The two punching tools punch the collars of the fins from two opposite sides of the collars. Thereby, the collars shrink inwardly and press the heat pipe to deform until the heat pipe is fittedly mounted in the collars of the fins.
    Type: Grant
    Filed: July 25, 2011
    Date of Patent: February 25, 2014
    Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: Jing Zhang, Jian Liu, Xing-Hua He
  • METHOD FOR MANUFACTURING ROTOR
    Publication number: 20140027416
    Abstract: An exemplary method for manufacturing a rotor is disclosed. A fixture is firstly made. The fixture includes a base, a column extending upwardly from the base, and an annular protrusion extending upwardly from the column. A slot is defined in the column. A shaft is inserted in the slot. A hub is made and disposed on a top face of the annular protrusion. The hub includes a cover and a sidewall extending downwardly from the cover. The shaft contacts a center of the cover. A laser beam is used to illuminate the center of the cover to thereby weld the shaft with the cover.
    Type: Application
    Filed: December 14, 2012
    Publication date: January 30, 2014
    Applicant: Foxconn Technology Co., Ltd.
    Inventors: MING-HSIU CHUNG, YU-KAI TAI
  • HOUSING OF COOLING FAN AND METHOD MANUFACTURING OF THE SAME
    Publication number: 20140030075
    Abstract: An exemplary housing of a cooling fan includes a metallic base plate and a plastic bear seat. Clasps extend upwardly from the base plate. The bear seat is formed on the base plate via injection process. A bottom end of the bear seat directly contacts the base plate. The clasps are embedded in the bear seat.
    Type: Application
    Filed: September 13, 2012
    Publication date: January 30, 2014
    Applicant: Foxconn Technology Co., Ltd.
    Inventor: Wen-Cheng CHEN
  • Lamp incorporating supporting body for easily mounting to a support
    Patent number: 8628218
    Abstract: A lamp includes a supporting body and a lamp body. The supporting body is fixed to a support such as a ceiling. The supporting body defines a plurality of apertures each including a hole and a slot. The slot has a width less than a diameter of the hole. The lamp body includes a housing, a heat sink, a light source and a cover. The housing forms a plurality of protrusions each including a pole and a head. The head has a diameter larger than a width of the slot. The protrusions extend through the holes of the apertures and then are rotated into the slots, whereby the heads are located above the slots and engage with the supporting body. Thus, the lamp is suspended from the support. A resilient member is provided between the housing and the supporting body.
    Type: Grant
    Filed: April 27, 2012
    Date of Patent: January 14, 2014
    Assignees: Champ Tech Optical (Foshan) Corporation, Foxconn Technology Co., Ltd.
    Inventors: Guang Yu, Qian Xiang
  • HOUSING HAVING COATING
    Publication number: 20140011046
    Abstract: A housing having a coating is disclosed. The housing comprises a base substrate made of metallic material; a micro-arc oxide layer formed on the base substrate; and a protection outer film formed on the micro-arc oxide layer and comprising a coating layer and a metallic layer, wherein the metallic layer is formed on the micro-arc oxide layer and covers a portion of the micro-arc oxide layer; and the coating layer is formed on a remaining portion of the micro-arc oxide layer so that the micro-arc oxide layer is covered by the metallic layer and the coating layer.
    Type: Application
    Filed: September 13, 2013
    Publication date: January 9, 2014
    Applicants: Foxconn Technology Co., Ltd., Fu Zhun Precision Industry (Shen Zhen) Co., Ltd.
    Inventors: Zhe-Xuan ZHANG, Shih-Pin WANG, Yan XIONG, Che-Chao CHU
  • Heat pipe including a main wick structure and at least one auxiliary wick structure
    Patent number: 8622117
    Abstract: A heat pipe includes a casing, a main wick structure received in the casing, an auxiliary wick structure received in the main wick structure, and a working fluid contained in the casing. The main wick structure is attached to an inner surface of the casing. An inner peripheral surface of the main wick structure and an outer peripheral surface of the auxiliary wick structure cooperatively define a vapor channel. The auxiliary wick structure is hollow, and extends along a longitudinal direction of the casing. A liquid channel is defined in the auxiliary wick structure. Two ends of the auxiliary wick structure are both fixed on the two ends of the casing. The working fluid is saturated in the main wick structure and the auxiliary wick structure.
    Type: Grant
    Filed: June 25, 2009
    Date of Patent: January 7, 2014
    Assignees: Furui Precise Component (Kunshan) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: Sheng-Lin Wu, Yu-Liang Lo, Wen-Hu Chen, Yue Liu, Nien-Tien Cheng
  • Loop heat pipe
    Patent number: 8622118
    Abstract: An exemplary loop heat pipe includes an evaporator, a condenser, a vapor line and a liquid line each connecting the evaporator with the condenser to form a closed loop. A working medium is contained in the closed loop. A wick structure is received in the evaporator, and includes a bottom wall contacting the bottom plate, a support wall extending up from the bottom wall and contacting the cover plate, and guide walls extending out laterally from the support wall. The support wall separates an interior of the evaporator into a liquid chamber adjacent to the liquid line and a vapor chamber adjacent to the vapor line. The guide walls are located in the vapor chamber. Guide channels are defined between the guide walls for guiding the working medium in a vapor state to flow from the vapor chamber through the vapor line to the condenser.
    Type: Grant
    Filed: October 31, 2010
    Date of Patent: January 7, 2014
    Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: De-Yu Wang, Chao Xu, Jiang-Jun Hu
  • Fixing frame and heat dissipation device using the same
    Patent number: 8622119
    Abstract: A heat dissipation device includes one of heat sinks with different specifications each of which includes a core and supports extending outwards and radially from the core, and a fixing frame receiving the one of the heat sinks therein. The fixing frame comprises a side plate, a plurality of vertical walls extending downwardly from the side plate, and two sets of slots defined in an inner side of the side plate. Each of the slots extends upwardly from a bottom surface of the side plate to a certain depth to form a step at a top thereof. The slots are staggered with the vertical walls. The supports correspondingly slide in one set of slots and abut corresponding steps.
    Type: Grant
    Filed: May 17, 2010
    Date of Patent: January 7, 2014
    Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventor: Jian Yang