Abstract: The present invention relates to a method for laser-assisted bonding of substrates, in which these are connected together firstly frictionally by pressing together and subsequently strengthening of the connection between the substrates is effected by activation in regions which is induced by laser irradiation. The invention likewise relates to substrates produced accordingly.
February 21, 2008
Date of Patent:
July 15, 2014
Fraunhofer-Gesellschaft zur der Andewandten, Friedrich-Schiller-Universtaet Jena
Andreas Tuennermann, Ramona Eberhardt, Gerhard Kalkowski, Stefan Nolte