Patents Assigned to Hakko Corporation
  • Hot Air Nozzle and its Production Method
    Publication number: 20170336098
    Abstract: The invention is directed to a nozzle for a hot air device used in the electronic assembly industry to melt solder or heat shrink-wrap insulators. The nozzle provides a uniform temperature environment and suppresses the occurrence of local excess heating.
    Type: Application
    Filed: May 18, 2016
    Publication date: November 23, 2017
    Applicant: Hakko Corporation
    Inventors: Yoshitomo Teraoka, Hisao Nemoto
  • Desoldering tool nozzle and method of manufacturing the nozzle
    Patent number: 9776271
    Abstract: The object of the invention is to provide a nozzle for a desoldering tool that facilitates the removal of solder from components having a large difference between the width and thickness dimensions of the solder connection. The present application discloses a nozzle for use with a desoldering tool for melting and sucking solder away. The nozzle includes a distal end surface which is heated to a temperature melting the solder. The distal end surface, as an upstream end of a molten solder suction path, defines a non-circular elongated generally oval shaped opening.
    Type: Grant
    Filed: November 17, 2015
    Date of Patent: October 3, 2017
    Assignee: Hakko Corporation
    Inventor: Toshikazu Mochizuki
  • System and method for induction heating of a soldering iron
    Patent number: 9724777
    Abstract: A soldering iron system includes a power assembly that provides power to an induction heater at a variable voltage and a variable frequency. A control assembly adjusts the temperature of the heater in accordance with signals from a current detector coupled to the induction heater and a selection made by the user on an operating level selector.
    Type: Grant
    Filed: April 8, 2009
    Date of Patent: August 8, 2017
    Assignee: Hakko Corporation
    Inventor: Mitsuhiko Miyazaki
  • Heater sensor complex with high thermal capacity
    Patent number: 9700951
    Abstract: The invention is directed to designs for heater-sensor sub-assemblies for soldering cartridges and de-soldering cartridges for soldering systems. The designs provide a high thermal capacity and accurate tip temperature sensing and control features. The coil portion of the heater assembly is spaced proximally from the distal end of the subassembly to segregate the coil from the thermocouple temperature sensor. The solder cartridges include connector wires of dissimilar sizes and materials to couple the heater coil wire to the connections of a handle and the soldering station to reduce heat conduction to the handle.
    Type: Grant
    Filed: December 18, 2014
    Date of Patent: July 11, 2017
    Assignee: HAKKO CORPORATION
    Inventors: Kenji Matsuzaki, Hitoshi Takeuchi, Toshizaki Mochizuki
  • HOLDING STAND
    Publication number: 20170182576
    Abstract: A holding stand for a heating tool such as a soldering or de-soldering device. The holding stand has a rotary member for securing the heating tool and an assembly for moving and positioning the rotary member with the heating tool in any of three axis.
    Type: Application
    Filed: September 12, 2016
    Publication date: June 29, 2017
    Applicant: Hakko Corporation
    Inventors: Yoshitomo TERAOKA, Hisao Nemoto
  • Support Stand for Heating Tools
    Publication number: 20170165771
    Abstract: A support stand for a soldering or de-soldering handheld tool comprises a base and a cradle for supporting the handheld tool when it is not in use that protects the surrounding work area and accommodates user preferences.
    Type: Application
    Filed: June 2, 2016
    Publication date: June 15, 2017
    Applicant: Hakko Corporation
    Inventors: Yoshitomo Teraoka, Hisao Nemoto
  • Desoldering tool and control system
    Patent number: 9610645
    Abstract: A desoldering tool and control system including enhanced features for detecting solder clogging as well as on-delay and sleep mode functions to enhance the life of the desoldering tool components.
    Type: Grant
    Filed: November 17, 2015
    Date of Patent: April 4, 2017
    Assignee: Hakko Corporation
    Inventors: Toshikazu Mochizuki, Hitoshi Takeuchi, Tetsuo Yokoyama
  • Heater Sensor Complex With High Thermal Capacity
    Publication number: 20170028497
    Abstract: The invention is directed to designs for heater-sensor sub-assemblies for soldering cartridges and de-soldering cartridges for soldering systems. The designs provide a high thermal capacity and accurate tip temperature sensing and control features. The coil portion of the heater assembly is spaced proximally from the distal end of the subassembly to segregate the coil from the thermocouple temperature sensor. The solder cartridges include connector wires of dissimilar sizes and materials to couple the heater coil wire to the connections of a handle and the soldering station to reduce heat conduction to the handle.
    Type: Application
    Filed: December 18, 2014
    Publication date: February 2, 2017
    Applicant: Hakko Corporation
    Inventors: Kenji Matsuzaki, Hitoshi Takeuchi, Toshizaki Mochizuki
  • Desoldering Tool and Control System
    Publication number: 20160175959
    Abstract: A desoldering tool and control system including enhanced features for detecting solder clogging as well as on-delay and sleep mode functions to enhance the life of the desoldering tool components.
    Type: Application
    Filed: November 17, 2015
    Publication date: June 23, 2016
    Applicant: HAKKO CORPORATION
    Inventors: Toshikazu Mochizuki, Hitoshi Takeuchi, Tetsuo Yokoyama
  • Desoldering Tool Nozzle And Method of Manufacturing the Nozzle
    Publication number: 20160175958
    Abstract: The object of the invention is to provide a nozzle for a desoldering tool that facilitates the removal of solder from components having a large difference between the width and thickness dimensions of the solder connection. The present application discloses a nozzle for use with a desoldering tool for melting and sucking solder away. The nozzle includes a distal end surface which is heated to a temperature melting the solder. The distal end surface, as an upstream end of a molten solder suction path, defines a non-circular elongated generally oval shaped opening.
    Type: Application
    Filed: November 17, 2015
    Publication date: June 23, 2016
    Applicant: HAKKO CORPORATION
    Inventor: Toshikazu Mochizuki
  • Solder handling assembly
    Patent number: 9314863
    Abstract: A solder handling assembly comprises a heating portion, a casing, a variable resistor, a connecting member coupled to the variable resistor, and an elastic-resilient member movable from a first state to a second state. The connecting member is rotatable relative to the casing and is configured to adjust a resistor value of the variable resistor when the connecting member is rotated relative to casing. When the elastic-resilient member is in the first state, the connecting member is prevented from rotating relative to the casing. When the elastic-resilient member is in the second state, the connecting member can be rotated relative to the casing.
    Type: Grant
    Filed: November 1, 2012
    Date of Patent: April 19, 2016
    Assignee: Hakko Corporation
    Inventor: Yoshitomo Teraoka
  • Soldering assembly for detachable tip
    Patent number: 9168605
    Abstract: A soldering assembly comprises a heater, a lock member, and a bias member. The lock member is moveable relative to the heater, includes a ramp feature, and is configured to receive a tip or a tip holder. The bias member is configured to urge movement of the lock member away from a distal segment of the heater.
    Type: Grant
    Filed: November 29, 2012
    Date of Patent: October 27, 2015
    Assignee: Hakko Corporation
    Inventors: Mitsuhiko Miyazaki, Toshikazu Mochizuki, Aiko Wakamatsu
  • Grip for a hot air blowing tool for melting solder
    Patent number: D743764
    Type: Grant
    Filed: July 2, 2014
    Date of Patent: November 24, 2015
    Assignee: Hakko Corporation
    Inventor: Yoshitomo Teraoka
  • Controller for soldering iron
    Patent number: D762254
    Type: Grant
    Filed: June 9, 2015
    Date of Patent: July 26, 2016
    Assignee: HAKKO CORPORATION
    Inventor: Toshiyuki Kita
  • Controller for desoldering tool
    Patent number: D762754
    Type: Grant
    Filed: June 9, 2015
    Date of Patent: August 2, 2016
    Assignee: Hakko Corporation
    Inventor: Toshiyuki Kita
  • Grip for desoldering tool
    Patent number: D765482
    Type: Grant
    Filed: June 9, 2015
    Date of Patent: September 6, 2016
    Assignee: Hakko Corporation
    Inventor: Toshiyuki Kita
  • Holder for desoldering tool
    Patent number: D768218
    Type: Grant
    Filed: June 9, 2015
    Date of Patent: October 4, 2016
    Assignee: Hakko Corporation
    Inventor: Toshiyuki Kita
  • Thermometer
    Patent number: D774405
    Type: Grant
    Filed: March 17, 2015
    Date of Patent: December 20, 2016
    Assignee: Hakko Corporation
    Inventor: Satoshi Manda
  • Controller for soldering iron
    Patent number: D780241
    Type: Grant
    Filed: March 7, 2016
    Date of Patent: February 28, 2017
    Assignee: HAKKO CORPORATION
    Inventor: Yoshitomo Teraoka
  • Static electricity measuring instrument
    Patent number: D796977
    Type: Grant
    Filed: March 7, 2016
    Date of Patent: September 12, 2017
    Assignee: HAKKO CORPORATION
    Inventor: Tetsuo Yokoyama