Abstract: An electronic component mounting device is provided for mounting a plurality of electronic components, the plurality of the electronic component being placed in a predetermined portion, on a plurality of attachments each arranged at a predetermined interval from one another. The electronic component mounting device includes a removal mechanism for removing some of the plurality of the electronic components having been placed in the predetermined portion, a transport mechanism for transporting the electronic components removed by the removal mechanism, moving the electronic components so that intervals between the electronic components adjacent to one another are, respectively, the predetermined interval before reaching the attachments, and transporting the electronic components to the attachments, and a mounting and transfer mechanism for mounting the electronic components, which have been transported by the transport mechanism, on predetermined positions of the attachments.

Abstract: To provide a manufacturing apparatus of an electronic component using an interposer, having high installation flexibility and high production efficiency. The electronic component manufacturing apparatus includes a converter unit configured to place an interposer on a surface of a base circuit sheet, and an interposer supply unit configured to continuously convey carriers holding the interposers and supply the interposers to the converter unit. The interposer supply unit has the carriers that hold the interposers, and is configured to convey the interposers via the carriers.

Abstract: A transfer apparatus has a first conveying device for holding and conveying a transferring-work to be transferred; a second conveying device for holding and conveying a carrier work on which the transferring-work is placed; and a transfer device to receive the transferring-work from the first conveying device and transfer the transferring-work to the carrier work of the second conveying device. The transfer device has two or more end-effectors that revolve along the same circumference to convey the transferring-work, and each of the end-effectors revolves independently of the other end-effectors. Each of the end-effectors has a holding surface that holds the transferring-work, and the holding surface is able to advance and retract along a revolution axis of each of the end-effectors.

Abstract: A chip transfer apparatus includes a first carrier for feeding chips and a second carrier for carrying works on it. The transfer apparatus also includes a transfer engine including two or more coaxial revolvers, which can revolve coaxially with each other. Each of the coaxial revolvers includes an end-effector for receiving a chip from the first carrier and transferring the received chip onto a work on the second carrier. The end-effectors of the coaxial revolvers are arranged in a circle coaxial with the revolvers. The end-effectors sequentially receive chips from the first carrier at substantially zero speed relative to the first carrier and transfer the received chips onto works on the second carrier at substantially zero speed relative to the second carrier. While the end-effectors are revolving, they undergo periodic speed change control for timing adjustment and speed adjustment for the chip reception and transfer.

Abstract: A production method for producing sanitary tampons implements a cord placement step of placing at least two continuous string-like cords in parallel on surfaces of at least two cotton pad pieces sequentially placed along a sewing line in a sewing direction of a sewing machine, a first cord sewing step of sewing the cord to one of two cotton pad pieces placed in an adjacent manner, a second cord sewing step of sewing the cord to the other of the two cotton pad pieces, and a cord switching step of switching the cords to be sewn to the cotton pad piece between the first cord sewing step and the second cord sewing step.

Abstract: Manufacturing an electronic component 5 in which an interposer 50 is bonded to a base circuit sheet includes a base circuit forming step for forming a base-side terminal in a continuous base member 610 in continuous sheet form, an arranging/bonding step for arranging the interposer 50 on a surface of the continuous base member 610 in which the base-side terminal is formed and bonding the interposer 50, and a separating step for cutting out the electronic component 5 from the continuous base member 610 to which the interposer 50 is bonded. In this electronic component manufacturing method, for the common continuous base member 610, each of the steps is repeated in parallel while this continuous base material 610 is being advanced.

Abstract: An interposer bonding device 3 is intended for bonding an interposer 10 having an interposer-side terminal to a base circuit sheet 20 provided with a base-side terminal. The interposer bonding device 3 has a press anvil 31 that holds the base circuit sheet 20 on which the interposer 10 is laminated and a bonding head 32 that moves relatively with respect to the press anvil 31. The bonding head 32 has a pressing surface 320 that presses the rear surface of the interposer by abutting against this surface. The pressing surface 320 scans the rear surface of the interposer 10 by the relative movement of the bonding head 32 with respect to the press anvil 31 and presses the whole surface of the interposer-side terminal 12 toward the base circuit sheet 20.

Abstract: The invention relates to an RFID medium 1 in which an interposer 10 having a semiconductor chip 11 mounted on a sheet-like chip holding member 13 is bonded to a sheet-like base circuit sheet 20. The interposer 10 has the IC chip 11 mounted on a substantially planar surface of the chip holding member 13, and an interposer terminal that is electrically extended from a terminal of the IC chip 11. The base circuit sheet 20 has a base terminal 22 electrically connected to the interposer terminal 12, and has a through chip housing portion 210 for housing the semiconductor chip 11 on the interposer 10.

Abstract: To provide a manufacturing apparatus of an electronic component using an interposer, having high installation flexibility and high production efficiency. The electronic component manufacturing apparatus includes a converter unit configured to place an interposer on a surface of a base circuit sheet, and an interposer supply unit configured to continuously convey carriers holding the interposers and supply the interposers to the converter unit. The interposer supply unit has the carriers that hold the interposers, and is configured to convey the interposers via the carriers.

Abstract: An interposer bonding device bonds an interposer having an interposer-side terminal to a base circuit sheet provided with a base-side terminal. The interposer bonding device has a press anvil that holds the base circuit sheet on which the interposer is laminated and a bonding head that moves with respect to the press anvil. The bonding head has a pressing surface that presses the rear surface of the interposer by abutting against this surface. The pressing surface scans the rear surface of the interposer by the relative movement of the bonding head with respect to the press anvil and presses the whole surface of the interposer-side terminal toward the base circuit sheet.

Abstract: A production method for producing sanitary tampons implements a cord placement step of placing at least two continuous string-like cords in parallel on surfaces of at least two cotton pad pieces sequentially placed along a sewing line in a sewing direction of a sewing machine, a first cord sewing step of sewing the cord to one of two cotton pad pieces placed in an adjacent manner, a second cord sewing step of sewing the cord to the other of the two cotton pad pieces, and a cord switching step of switching the cords to be sewn to the cotton pad piece between the first cord sewing step and the second cord sewing step.

Abstract: A transfer apparatus has a first conveying device for holding and conveying a transferring-work to be transferred; a second conveying device for holding and conveying a carrier work on which the transferring-work is placed; and a transfer device to receive the transferring-work from the first conveying device and transfer the transferring-work to the carrier work of the second conveying device. The transfer device has two or more end-effectors that revolve along the same circumference to convey the transferring-work, and each of the end-effectors revolves independently of the other end-effectors. Each of the end-effectors has a holding surface that holds the transferring-work, and the holding surface is able to advance and retract along a revolution axis of each of the end-effectors.

Abstract: A chip transfer apparatus includes a first carrier for feeding chips and a second carrier for carrying works on it. The transfer apparatus also includes a transfer engine including two or more coaxial revolvers, which can revolve coaxially with each other. Each of the coaxial revolvers includes an end-effector for receiving a chip from the first carrier and transferring the received chip onto a work on the second carrier. The end-effectors of the coaxial revolvers are arranged in a circle coaxial with the revolvers. The end-effectors sequentially receive chips from the first carrier at substantially zero speed relative to the first carrier and transfer the received chips onto works on the second carrier at substantially zero speed relative to the second carrier. While the end-effectors are revolving, they undergo periodic speed change control for timing adjustment and speed adjustment for the chip reception and transfer.

Abstract: A chip transfer apparatus includes a first carrier for feeding chips and a second carrier for carrying works on it. The transfer apparatus also includes a transfer engine including two or more coaxial revolvers, which can revolve coaxially with each other. Each of the coaxial revolvers includes an end-effector for receiving a chip from the first carrier and transferring the received chip onto a work on the second carrier. The end-effectors of the coaxial revolvers are arranged in a circle coaxial with the revolvers. The end-effectors sequentially receive chips from the first carrier at substantially zero speed relative to the first carrier and transfer the received chips onto works on the second carrier at substantially zero speed relative to the second carrier. While the end-effectors are revolving, they undergo periodic speed change control for timing adjustment and speed adjustment for the chip reception and transfer.

Abstract: A conveying apparatus includes a first conveying device and a second conveying device for holding and conveying a work, and a transfer device for receiving the work from the first conveying device and transferring the received work to the second conveying device. The transfer device has two or more end-effectors that revolve along the same circumference to convey the work, and each of the end-effectors revolves independently of at least any of the other end-effectors.

Abstract: A chip transfer apparatus includes a first carrier for feeding chips and a second carrier for carrying works on it. The transfer apparatus also includes a transfer engine including two or more coaxial revolvers, which can revolve coaxially with each other. Each of the coaxial revolvers includes an end-effector for receiving a chip from the first carrier and transferring the received chip onto a work on the second carrier. The end-effectors of the coaxial revolvers are arranged in a circle coaxial with the revolvers. The end-effectors sequentially receive chips from the first carrier at substantially zero speed relative to the first carrier and transfer the received chips onto works on the second carrier at substantially zero speed relative to the second carrier. While the end-effectors are revolving, they undergo periodic speed change control for timing adjustment and speed adjustment for the chip reception and transfer.