Patents Assigned to HANGUK MOLD CO.,LTD
  • Publication number: 20250065548
    Abstract: A mold device includes: an outer mold part including a first outer mold, and a second outer mold that is moved toward the first outer mold to form a molding space with the first outer mold; and an inner mold part including an inner mold that is moved between a molding position disposed in the molding space of the outer mold part and an exit position deviating from the molding space. The inner mold is configured to mold a cylinder having a hollow part extending in a first direction between the inner mold part and the outer mold part when being located in the molding position. The inner mold is formed to correspond to the cylinder to form a space allowing introduction of a resin.
    Type: Application
    Filed: December 1, 2023
    Publication date: February 27, 2025
    Applicants: HYUNDAI MOTOR COMPANY, KIA CORPORATION, HANGUK MOLD CO.,LTD
    Inventors: Kyu Young Lee, Suk Joo Hong, Jung Hwan Park, Eui Hwan Son, Min Woo Chu, Byoung Jin Kwon, Ji Hun Kim