Patents Assigned to Harvatek Corporation
  • Patent number: 10355185
    Abstract: An LED package includes N number of first pins, six second pins and N number of LED units, where N is four or six. Each of the LED units includes first to third LEDs, each of which has first and second terminals. The first terminal of the first LED for each of (2j?1)th and (2j)th LED units is connected to a (2j?1)th first pin. The first terminals of the second and third LEDs for each of the (2j?1)th and (2j)th LED units are connected to a (2j)th first pin, where j is an integer and 0<j?N/2. The second terminals of the first, second and third LEDs for the (2j?1)th LED unit are connected to the 1st, 2nd and 3rd second pins, respectively. The second terminals of the first, second and third LEDs for the (2j)th LED unit are connected to the 4th, 5th and 6th second pins.
    Type: Grant
    Filed: December 27, 2017
    Date of Patent: July 16, 2019
    Assignee: Harvatek Corporation
    Inventors: Jen-Hung Chang, Song-Yi Hsiao
  • Publication number: 20190096292
    Abstract: A display device includes a plurality of packages arranged in an array. Each of the packages includes a substrate, a plurality of pixel members mounted on the substrate and arranged in an array, and an encapsulant covering the pixel members and the substrate. Each of the pixel members includes a first light emitting diode (LED) chip, a second LED chip, and a third LED chip. Each of the packages has a first spacing between the first LED chips of two adjacent ones of the pixel members. The first LED chip of each of the pixel members in each of the packages is spaced apart from a nearest one of the first LED chip of a nearest one of the packages by a second spacing. The first spacing is equal to the second spacing.
    Type: Application
    Filed: January 10, 2018
    Publication date: March 28, 2019
    Applicant: HARVATEK CORPORATION
    Inventors: Jen-Hung Chang, Song-Yi Hsiao
  • Publication number: 20190088841
    Abstract: An LED package includes N number of first pins, six second pins and N number of LED units, where N is four or six. Each of the LED units includes first to third LEDs, each of which has first and second terminals. The first terminal of the first LED for each of (2j?1)th and (2j)th LED units is connected to a (2j?1)th first pin. The first terminals of the second and third LEDs for each of the (2j?1)th and (2j)th LED units are connected to a (2j)th first pin, where j is an integer and 0<j?N/2. The second terminals of the first, second and third LEDs for the (2j?1)th LED unit are connected to the 1st, 2nd and 3rd second pins, respectively. The second terminals of the first, second and third LEDs for the (2j)th LED unit are connected to the 4th, 5th and 6th second pins.
    Type: Application
    Filed: December 27, 2017
    Publication date: March 21, 2019
    Applicant: HARVATEK CORPORATION
    Inventors: Jen-Hung Chang, Song-Yi Hsiao
  • Patent number: 10145526
    Abstract: A headlamp module comprises a connecting base, a substrate, and at least two edge-type light emitting diode (LED) units. The at least two edge-type LED units are mounted to opposite surfaces of the substrate facing away from each other. Each edge-type LED unit comprises an LED chip, a wavelength converting layer, and a light reflecting layer. The LED chip comprises a bottom surface, a light emitting surface facing away from the bottom surface, and first sidewalls. The wavelength converting layer covers the light emitting surface and the first sidewalls. The wavelength converting layer converts emitted light to a desired range of wavelengths. The light reflecting layer reflects the converted light toward the second sidewalls, thus expanding the angle and brightness of light around the headlamp module and avoiding an unlit or dark area immediately around the headlamp module.
    Type: Grant
    Filed: February 15, 2017
    Date of Patent: December 4, 2018
    Assignee: HARVATEK CORPORATION
    Inventors: Zhi-Ting Ye, Shyi-Ming Pan, Chia-Hung Pan
  • Patent number: 10084123
    Abstract: An LED package structure without pre-stored power sources includes a substrate unit and a LED chip. The substrate unit includes a carrier substrate, a positive conductive pin, and a negative conductive pin. The positive conductive pin is made of a first predetermined material with positive oxidation-reduction potential. The negative conductive pin is made of a second predetermined material with negative oxidation-reduction potential. The LED chip is disposed on the carrier substrate and electrically connected between the positive conductive pin and the negative conductive pin. Both the positive conductive pin and the negative conductive pin concurrently contact a predetermined liquid for generating oxidation-reduction reaction so as to generate electric powers with a predetermined driving voltage, and the LED chip is driven by the electric powers with the predetermined driving voltage for generating an indicator light source.
    Type: Grant
    Filed: January 19, 2016
    Date of Patent: September 25, 2018
    Assignee: HARVATEK CORPORATION
    Inventors: Hsin I Lu, Yu Ping Wang, Chia Pin Chang, Hui Yen Huang
  • Patent number: 10060600
    Abstract: A light emitting device includes a light emitting chip, a reflecting cup arranged on a side of the light emitting chip, and a package encapsulating the light emitting chip and the reflecting cup. The light emitting chip includes a first light emitting surface and a second light emitting surface coupled to the first light emitting surface. The reflecting cup has an inner surface facing the second light emitting surface of the light emitting chip. The reflecting cup arranges around a periphery of the second light emitting surface. The inner surface of the reflecting cup is a multifocal paraboloid. The multifocal paraboloid includes multistage paraboloids. The corresponding focus points of the multistage paraboloids are symmetrically distributed on the first light emitting surface of the light emitting chip.
    Type: Grant
    Filed: March 30, 2017
    Date of Patent: August 28, 2018
    Assignee: HARVATEK CORPORATION
    Inventors: Zhi-Ting Ye, Shyi-Ming Pan
  • Patent number: 9978917
    Abstract: The present invention provides a light-emitting diode (LED) package structure and the method for manufacturing the same. First, a ceramic substrate is provided. Then, an ultraviolet (UV) LED chip, a light-guiding layer, and a metal reflective layer are disposed on the substrate sequentially. By means of the metal reflective layer, the emission light of the UV LED from the light-emitting side is reflected laterally and thus making the UV LED package structure output a plane light source.
    Type: Grant
    Filed: May 10, 2017
    Date of Patent: May 22, 2018
    Assignee: Harvatek Corporation
    Inventors: Zhi-Ting Ye, Shyi-Ming Pan
  • Patent number: 9921359
    Abstract: A light source module includes a light guide plate, a reflecting film, and a plurality of edge-type light emitting diode (LED) units. Grooves are defined in a lower surface of the light guide plate. The reflecting film is below the lower surface and covers the entire lower surface and the grooves. An air gap is defined between the reflecting film and the lower surface. The edge-type LED units are located in the grooves. Each edge-type LED unit includes an LED chip, a wavelength converting layer, and a light reflecting layer. Light emitted is converted by the wavelength converting layer, reflected towards sidewalls of the wavelength converting layer, and transmitted to the lower surface. The reflecting film reflects light that enters the air gap towards an upper surface of the light guide plate, enabling uniform emission of light from the upper surface.
    Type: Grant
    Filed: February 17, 2017
    Date of Patent: March 20, 2018
    Assignee: HARVATEK CORPORATION
    Inventors: Zhi-Ting Ye, Shyi-Ming Pan, Chia-Hung Pan
  • Patent number: 9887179
    Abstract: A light emitting diode device including a substrate, a plurality of light emitting elements, and an encapsulant. The substrate has a front surface and a back surface opposite to the front surface. The substrate includes a first portion and a second portion. The first portion has a plurality of light-penetrating holes. The second portion is separated from the first portion. The light emitting elements are disposed adjacent to the light-penetrating holes and on the front surface of the first portion. The encapsulant is disposed on the front surface of the substrate, and covers the light emitting elements.
    Type: Grant
    Filed: March 26, 2015
    Date of Patent: February 6, 2018
    Assignee: Harvatek Corporation
    Inventors: Hsin-I Lu, Hui-Yen Huang, Yu-Ching Kuo, Yu-Ping Wang, Jen-Hung Chang
  • Patent number: 9799810
    Abstract: A light emitting device includes a side-emitting assembly, a reflecting cup arranged on a side of the side-emitting assembly, and a package for accommodating the side-emitting assembly and the reflecting cup. The side-emitting assembly with a side surface includes a light emitting chip, a wavelength conversion layer coated on the light emitting chip, and a reflecting layer arranged above the wavelength conversion layer. The reflecting cup has an inner surface facing the side surface of the side-emitting assembly. The inner surface of the reflecting cup is a multifocal paraboloid. The multifocal paraboloid includes multistage paraboloids. The corresponding focal points of the multistage paraboloids are symmetrically distributed on the side surface of the side-emitting assembly.
    Type: Grant
    Filed: March 30, 2017
    Date of Patent: October 24, 2017
    Assignee: HARVATEK CORPORATION
    Inventors: Zhi-Ting Ye, Shyi-Ming Pan, Chia-Hung Pan, Ping-Lung Wang
  • Patent number: 9685428
    Abstract: A light-emitting array module includes a circuit substrate, a light-emitting unit, and an encapsulation body. The light-emitting unit includes a plurality of light-emitting groups arranged in matrix on the circuit substrate. The encapsulation body disposed on the circuit substrate for encapsulating the light-emitting groups. The encapsulation body includes a plurality of encapsulation portions and a plurality of thin connection portions. Therefore, light beams generated by the light-emitting group is transformed into an obvious single point light source without halation due to the design of “each thin connection portion connected between the two adjacent encapsulation portions to separate the two adjacent encapsulation portions from each other by a predetermined distance”, so that the color resolution of the light-emitting array module is increased. In addition, the present disclosure further provides a display device including the light-emitting array module.
    Type: Grant
    Filed: February 26, 2016
    Date of Patent: June 20, 2017
    Assignee: HARVATEK CORPORATION
    Inventor: Jen-Hung Chang
  • Patent number: 9563076
    Abstract: A display panel includes a substrate and a plurality of light emitting elements. The substrate has an inner edge and an outer edge opposite to each other. The inner edge is enclosed to form an enclosed opening. The light emitting elements are disposed on the substrate and enclose the enclosed opening to form an inner loop at the inner edge of the substrate and an outer loop at the outer edge of the substrate. The inner loop and the outer loop have similar shapes. A composite display panel is also disclosed.
    Type: Grant
    Filed: December 7, 2015
    Date of Patent: February 7, 2017
    Assignee: Harvatek Corporation
    Inventors: Ping-Lung Wang, Song-Yi Hsiao
  • Patent number: 9224718
    Abstract: A white light-emitting diode (LED) package containing plural blue LED chips is disclosed. The white LED package includes a transparent plate, plural blue LED chips bonded on a front surface of the transparent plate, a front fluorescent glue layer covering the plural blue LED chips, and a rear transparent glue layer covering a rear surface of the transparent plate and located at a position aligned with the front fluorescent glue layer. The edge of the rear transparent glue layer has an inclined lateral surface or a curved inclined lateral surface. Therefore, the light can be extracted from both front and rear surfaces, and the light extraction efficiency of the rear surface of the transparent plate is increased. The rear transparent glue layer can be replaced by a rear fluorescent glue layer to reduce the color temperature difference between the lights extracted from the front surface and the rear surface.
    Type: Grant
    Filed: November 11, 2013
    Date of Patent: December 29, 2015
    Assignee: Harvatek Corporation
    Inventors: Tsung-Kan Cheng, Chia-Chin Chen, Chia-Pin Chang
  • Patent number: 9074043
    Abstract: The present invention provides a compound of formula I wherein A, B and C are a repeating unit; each of A and B is an optionally substituted group for forming a conjugated polymer; C is a crosslinkable group; and n is an integer equal to or greater than 1. The present invention further provides an element and an electronic device using the compound of formula I, and more particularly, provides a light emitting diode (LED) device using the compound of formula I.
    Type: Grant
    Filed: August 17, 2012
    Date of Patent: July 7, 2015
    Assignees: HARVATEK CORPORATION
    Inventors: Feng-Chih Chang, Yu-Lin Chu, Chih-Chia Cheng
  • Publication number: 20140209934
    Abstract: A white light-emitting diode (LED) package containing plural blue LED chips is disclosed. The white LED package includes a transparent plate, plural blue LED chips bonded on a front surface of the transparent plate, a front fluorescent glue layer covering the plural blue LED chips, and a rear transparent glue layer covering a rear surface of the transparent plate and located at a position aligned with the front fluorescent glue layer. The edge of the rear transparent glue layer has an inclined lateral surface or a curved inclined lateral surface. Therefore, the light can be extracted from both front and rear surfaces, and the light extraction efficiency of the rear surface of the transparent plate is increased. The rear transparent glue layer can be replaced by a rear fluorescent glue layer to reduce the color temperature difference between the lights extracted from the front surface and the rear surface.
    Type: Application
    Filed: November 11, 2013
    Publication date: July 31, 2014
    Applicant: Harvatek Corporation
    Inventors: Tsung-Kan CHENG, Chia-Chin CHEN, Chia-Pin CHANG
  • Patent number: 8748209
    Abstract: A semiconductor chip package structure for achieving flip-chip electrical connection without using a wire-bonding process includes a package unit, a semiconductor chip, a first insulative layer, first conductive layers, a second insulative layer, and second conductive layers. The package unit has a receiving groove. The semiconductor chip is received in the receiving groove and has a plurality of conductive pads disposed on its top surface. The first insulative layer is formed between the conductive pads to insulate the conductive pads. The first conductive layers are formed on the first insulative layer and the package unit, and one side of each first conductive layer is electrically connected to the corresponding conductive pad. The second insulative layer is formed between the first conductive layers in order to insulate the first conductive layers from each other. The second conductive layers are respectively formed on the other opposite sides of the first conductive layers.
    Type: Grant
    Filed: June 1, 2011
    Date of Patent: June 10, 2014
    Assignee: Harvatek Corporation
    Inventors: Bily Wang, Hung-Chou Yang, Jeng-Ru Chang
  • Publication number: 20140051826
    Abstract: The present invention provides a compound of formula I wherein A, B and C are a repeating unit; each of A and B is an optionally substituted group for forming a conjugated polymer; C is a crosslinkable group; and n is an integer equal to or greater than 1. The present invention further provides an element and an electronic device using the compound of formula I, and more particularly, provides a light emitting diode (LED) device using the compound of formula I.
    Type: Application
    Filed: August 17, 2012
    Publication date: February 20, 2014
    Applicants: HARVATEK CORPORATION
    Inventors: Feng-Chih Chang, Yu-Lin Chu, Chih-Chia Cheng
  • Patent number: 8623680
    Abstract: An LED chip package structure using sedimentation includes a package body, at least two conductive substrates, at least one light-emitting element, and a package unit. The package body has a receiving space. The two conductive substrates are received in the receiving space. The light-emitting element is received in the receiving space and electrically connected to the two conductive substrates. The package unit has a package colloid layer and a powder mixed into the package colloid layer, and the package unit is filled into the receiving space. The powder is uniformly deposited in the receiving space by maintaining the package unit at room temperature firstly and the powder is solidified in the receiving space by heating to a predetermined temperature.
    Type: Grant
    Filed: September 14, 2011
    Date of Patent: January 7, 2014
    Assignee: Harvatek Corporation
    Inventors: Bily Wang, Shih-Yu Wu, Chao-Yuan Huang, Ping-Chou Yang, Cheng-Yen Chiang
  • Patent number: 8555492
    Abstract: A conductive substrate structure includes a substrate unit, a conductive pad unit, and a conductive layer unit. The substrate unit has a top surface, a bottom surface, two opposite lateral surfaces, and a front surface. The conductive pad unit has at least two first conductive pads separated from each other and disposed on the top surface, and at least two second conductive pads separated from each other and disposed on the bottom surface. The conductive layer unit has at least two first conductive layers formed on the front surface and respectively electrically connected to two front sides of the two first conductive pads, and at least two second conductive layers respectively formed on the two opposite lateral surfaces and respectively electrically connected to two opposite lateral sides of the two second conductive pads. The two first conductive layers are respectively electrically connected with the two second conductive layers.
    Type: Grant
    Filed: December 28, 2011
    Date of Patent: October 15, 2013
    Assignee: Harvatek Corporation
    Inventors: Bily Wang, Sung-Yi Hsiao, Jack Chen
  • Patent number: 8556463
    Abstract: A simple detachable illumination lamp tube includes a tube unit, a heat-dissipating unit, a light-emitting unit, a support unit and a lateral cover unit. The tube unit has a light-permitting hollow tube. The heat-dissipating unit has a heat-dissipating substrate received in the light-permitting hollow tube. The heat-dissipating substrate has two opposite lateral sides contacting the inner surface of the light-permitting hollow tube. The light-emitting unit has a plurality of strip light-emitting modules received in the light-permitting hollow tube. The strip light-emitting modules are disposed on the heat-dissipating substrate and electrically connected in sequence. The support unit has a plurality of support elements received in the light-permitting hollow tube and disposed between a bottom side of the heat-dissipating substrate and the inner surface of the light-permitting hollow tube. The lateral cover unit has two lateral covers installed on two ends of the light-permitting hollow tube.
    Type: Grant
    Filed: January 18, 2011
    Date of Patent: October 15, 2013
    Assignee: Harvatek Corporation
    Inventors: Bily Wang, Chi-Tseng Chang, Chi-Kang Lo, Zhen Hao Fan