Patents Assigned to Hirama Laboratories Co., Ltd.
  • Patent number: 7109037
    Abstract: The water-based resist stripping liquid management apparatus according to the present invention manages in an adjusting bath a water-based resist stripping liquid that is used in resist stripping equipment. In this apparatus, an absorptiometer that measures the water concentration in the water-based resist stripping liquid and an electrical conductivity meter that measures the degraded component concentration in the water-based resist stripping liquid are connected to a resist stripping treatment bath (adjusting bath) via pipelines, and at least one of a resist stripping stock liquid, a resist stripping reclaimed liquid, pure water, and a premixed resist stripping new liquid are fed into the resist stripping treatment bath in accordance with the measurement values obtained. As a result, the resist stripping performance of the water-based resist stripping liquid can be stably maintained, the amount of liquid used can be reduced, and the time for which operation is shut down can be reduced.
    Type: Grant
    Filed: June 25, 2002
    Date of Patent: September 19, 2006
    Assignees: Nagase & Co., Ltd., Hirama Laboratories Co., Ltd., Nagase CMS Technology Co., Ltd.
    Inventors: Toshimoto Nakagawa, Yuko Katagiri, Shu Ogawa, Satoru Morita, Makoto Kikukawa
  • Patent number: 7101517
    Abstract: A processing solution preparation and supply apparatus includes a dissolving preparation bath to which a material powder and ultrapure water are supplied. This dissolving preparation bath is connected to a substrate processing apparatus via a pipe, and a processing solution prepared from the material powder on-site is supplied to the processing apparatus. To reduce an increase in the microorganism concentration in the ultrapure water, this ultrapure water is circulated substantially constantly. This suppresses deterioration and concentration fluctuations of a processing solution for use in processing of a semiconductor substrate, when this processing solution is supplied to the use side. This also reduces particles and improves the economical efficiency.
    Type: Grant
    Filed: January 15, 2003
    Date of Patent: September 5, 2006
    Assignees: Nagase & Co., Ltd., Hirama Laboratories Co., Ltd., Nagase CMS Technology Co., Ltd.
    Inventors: Toshimoto Nakagawa, Yuko Katagiri, Shu Ogawa, Yasuyuki Kobayakawa, Makoto Kikukawa, Yutaka Saito, Yoshitaka Nishijima
  • Patent number: 6752545
    Abstract: A treating liquid adjusting equipment for adjusting an alkali-based treating liquid for use in treating an organic film applied onto a substrate, which includes an adjusting portion. The adjusting portion for adjusting an alkalinity of the alkali-based treating liquid is such that a concentration of a first component contained in the alkali-based treating liquid and constituting an organic film of a same type as or different type from the organic film is in a range of 0.0001 to 2.0 mass %, and a concentration of an alkali component contained in the alkali-based treating liquid is in a range of 0.05 to 2.5 mass %.
    Type: Grant
    Filed: August 9, 2002
    Date of Patent: June 22, 2004
    Assignees: Nagase & Co., Ltd., Hirama Laboratories Co., Ltd., Nagase CMS Technology Co., Ltd.
    Inventors: Toshimoto Nakagawa, Yuko Katagiri, Shu Ogawa, Satoru Morita, Makoto Kikukawa, Takahiro Hozan