Patents Assigned to Hirayama Manufacturing Corporation
  • Publication number: 20240210304
    Abstract: A highly accelerated stress test device includes: a first heater that heats a test space; a second heater that heats a steam generating space; a first sensor that measures a first temperature of the test space; a second sensor that measures a second temperature of the steam generating space; an item temperature sensor that is directly attached to a sample placed in the test space and that measures an item temperature of the sample; and a controller that prepares, as candidates for a test mode, a normal mode in which on-off control of each of the first and second heaters is carried out based on the first and second temperatures, and an item-temperature mode in which the on-off control is carried out based on the item and second temperatures, and carries out the on-off control according to the test mode that is set with a test condition of the sample.
    Type: Application
    Filed: December 14, 2023
    Publication date: June 27, 2024
    Applicant: HIRAYAMA MANUFACTURING CORPORATION
    Inventors: Akira SATO, Shinichi YUMOTO, Masahiro UCHITA
  • Publication number: 20220153609
    Abstract: A method for decomposing and removing a pollutant includes: confining, in a small sealable container, a waste containing the pollutant to be processed and liquid for dilution together with gas containing oxygen or air; disposing the small sealable container in a processing chamber of a high-temperature and high-pressure processing device and keeping the small sealable container at an elevated temperature after the confining; and lowering a temperature in the processing chamber after the disposing. The disposing and the lowering are performed under a state where the small sealable container is pressurized from outside by increasing a pressure in the processing chamber.
    Type: Application
    Filed: November 5, 2021
    Publication date: May 19, 2022
    Applicants: National Institute of Advanced Industrial Science and Technology, HIRAYAMA MANUFACTURING CORPORATION
    Inventors: Tetsushi SUYAMA, Mamoru KAWAHARASAKI, Takahisa YOSHIDA, Chikashi YOSHINAGA
  • Patent number: 5628423
    Abstract: There is provided a container/closure lock device that is safe, simple and down-sized with a reduced number of components and can be manufactured at reduced cost. A container is provided with brackets 14a through 14f for receiving the wall of a closure, each of said brackets 14a through 14f being provided with a through bore 17 bored through its arm 16. Pin holders 19a through 19f having respective channels 22 are fitted to the respective outer surfaces of the corresponding brackets 14a through 14f, the through bores 17 and the corresponding channels 22 being aligned respectively. Lock pins 26a through 26f are respectively inserted into and held to the corresponding channels 22. A rotary ring 29 provided with slots 30a through 30f is fitted to the outer peripheral surface of the container 11 in such a way that the slots 30a through 30f respectively intersect the corresponding lock pins 26a through 26f.
    Type: Grant
    Filed: October 11, 1995
    Date of Patent: May 13, 1997
    Assignee: Hirayama Manufacturing Corporation
    Inventor: Hidezo Yoshino