Patents Assigned to HISENSE BROADBAND MULTIMEDIA TECHNOLOGIES CO., LTD
  • Publication number: 20220107477
    Abstract: The present disclosure provides an optical module, including: an upper shell including an upper optical-port part, where a first fixing groove is disposed on top of the upper optical-port part; a lower shell including a lower optical-port part, where the lower optical-port part fits and is connected to the upper optical-port part, and a second fixing groove is disposed on top of the lower optical-port part; and an optical-fiber connector with one side clamped in the first fixing groove and the other side clamped in the second fixing groove; where a first shielding strip is disposed on a junction of the upper optical-port part and the lower optical-port part, and extends in multiple directions. In the optical module provided in the present disclosure, electromagnetic shielding is implemented at an optical port of the optical module in multiple directions, thereby improving an electromagnetic shielding effect of the optical module.
    Type: Application
    Filed: December 13, 2021
    Publication date: April 7, 2022
    Applicant: HISENSE BROADBAND MULTIMEDIA TECHNOLOGIES CO., LTD.
    Inventors: Yaxun Chi, Nan Xue, Xuzhen Tao, Peng Yang
  • Patent number: 11294128
    Abstract: An optical module includes a housing, at least one optical assembly and at least one sealing member. The housing includes a housing body, a cover and at least one vent hole therein. At least part of each optical assembly is located in the housing body. Each sealing member is located at a respective one of the at least one vent hole. The sealing member has a central axis and includes a first cylinder, a truncated cone, and a second cylinder, a diameter of the first cylinder is greater than a diameter of the second cylinder. Each vent hole is a stepped hole including a portion with a first aperture and a portion with a second aperture, the first aperture is greater than the second aperture. The first cylinder fits the portion with the first aperture, and the second cylinder fits the portion with the second aperture.
    Type: Grant
    Filed: January 29, 2021
    Date of Patent: April 5, 2022
    Assignee: HISENSE BROADBAND MULTIMEDIA TECHNOLOGIES CO., LTD.
    Inventors: Guangchao Du, Dan Li, Yongzheng Tang, Yunpeng Jiang
  • Publication number: 20220099902
    Abstract: An optical module includes a shell, a circuit board, at least one of a light-transmitting chip or a light-receiving chip, a lens assembly, an optical fiber ferrule assembly and a fixing plate. The circuit board is disposed in the shell. The light-transmitting chip and/or the light-receiving chip is disposed on the circuit board. The lens assembly is disposed on the circuit board, covers the light-transmitting chip and/or the light-receiving chip, and is configured to change a propagation direction of an optical signal incident into the lens assembly. The optical fiber ferrule assembly is connected to the lens assembly, and is configured to transmit an optical signal incident into the optical fiber ferrule assembly. The fixing plate is configured to fix the optical fiber ferrule assembly to the lens assembly.
    Type: Application
    Filed: December 10, 2021
    Publication date: March 31, 2022
    Applicant: Hisense Broadband Multimedia Technologies Co., Ltd.
    Inventors: Wei CUI, Xuxia LIU, Baofeng SI, Xiaolei MA, Sigeng YANG
  • Publication number: 20220019035
    Abstract: An optical module includes a shell, a circuit board, a light-receiving device and an optical fiber ribbon. The circuit board is located in the shell. The light-receiving device is disposed on the circuit board and is electrically connected to the circuit board. An end of the optical fiber ribbon is connected to the light-receiving device. The light-receiving device includes a light-receiving chip and a focusing lens. The light-receiving chip is disposed on a surface of the circuit board and has a photosensitive surface. The focusing lens is disposed opposite to the photosensitive surface of the light-receiving chip, and is configured to converge light transmitted by the optical fiber ribbon to the photosensitive surface of the light-receiving chip.
    Type: Application
    Filed: September 30, 2021
    Publication date: January 20, 2022
    Applicant: Hisense Broadband Multimedia Technologies Co., Ltd.
    Inventors: Dan LI, Mengbo FU, Yifan XIE, Qinhao FU
  • Publication number: 20220021461
    Abstract: An optical module includes a shell, a circuit board, a light source and a silicon optical chip. The light source is configured to emit light. The silicon optical chip includes a modulator, and the modulator is configured to receive the light emitted by the light source and modulate the light into an optical signal. The circuit board includes a first sampling circuit, a second sampling circuit and a processing circuit. The first sampling circuit is configured to generate a first sampling signal. The second sampling circuit is configured to generate a second sampling signal. The processing circuit is configured to receive the first sampling signal and the second sampling signal, and send a driving signal to the modulator according to a difference between an amplitude of the first sampling signal and an amplitude of the second sampling signal, so as to control an electric heating of the modulator.
    Type: Application
    Filed: September 30, 2021
    Publication date: January 20, 2022
    Applicant: Hisense Broadband Multimedia Technologies Co., Ltd.
    Inventors: Liu YANG, Qiang ZHANG, Shihai YANG
  • Publication number: 20220019031
    Abstract: An optical module includes a shell, a circuit board, a light-emitting chip, a lens assembly, an optical fiber ferrule assembly and a fastener. The fastener fixes the optical fiber ferrule assembly to the lens assembly. The fastener includes a fastening body, a first clamping portion and a second clamping portion. The first clamping portion is disposed at one end of the fastening body, and is clamped with the optical fiber ferrule assembly. The second clamping portion is disposed at the other end of the fastening body, and is clamped with the lens assembly.
    Type: Application
    Filed: September 30, 2021
    Publication date: January 20, 2022
    Applicant: Hisense Broadband Multimedia Technologies Co., Ltd.
    Inventors: Fenglai WANG, Wei CUI, Xuejian LI, Yan ZHONG, Hongchao PAN, Sigeng YANG, Xuxia LIU
  • Publication number: 20220011510
    Abstract: An optical module includes a circuit board and a silicon optical chip. The circuit board includes a plurality of circuit board bonding pads. The silicon optical chip includes a plurality of chip bonding pads corresponding to the plurality of circuit board bonding pads. The plurality of chip bonding pads are electrically connected to the corresponding circuit board bonding pads, so that the silicon optical chip is electrically connected to the circuit board. A chip bonding pad is electrically connected to at least one corresponding circuit board bonding pad through a plurality of bonding wires, or a circuit board bonding pad is electrically connected to at least one corresponding chip bonding pad through a plurality of bonding wires. A connecting line of two or more of bonding positions of the plurality of bonding wires on the circuit board bonding pads is inclined with respect to a connecting line of centers of the circuit board bonding pads.
    Type: Application
    Filed: September 22, 2021
    Publication date: January 13, 2022
    Applicant: Hisense Broadband Multimedia Technologies Co., Ltd.
    Inventors: Long ZHENG, Sigeng YANG
  • Publication number: 20220006253
    Abstract: An optical module includes a shell, a circuit board and an optical transmitter device. The circuit board is disposed in the shell. The optical transmitter device is disposed in the shell, and includes a plate-shaped substrate and a laser assembly. The laser assembly is disposed on a surface of the substrate, is electrically connected to the circuit board, and is configured to emit an optical signal. The substrate is fixedly connected to an end of the circuit board.
    Type: Application
    Filed: September 15, 2021
    Publication date: January 6, 2022
    Applicant: Hisense Broadband Multimedia Technologies Co., Ltd.
    Inventors: Dan LI, Mengbo FU, Qinhao FU, Yifan XIE, Tengfei WANG
  • Publication number: 20220003944
    Abstract: An optical module includes a lens assembly and an optical fiber holder. The lens assembly includes a lens base, a first positioning column and a second positioning column. The optical fiber holder includes a first positioning hole and a second positioning hole. The first positioning hole is disposed on a second assembly surface and corresponds to a position of the first positioning column; the first positioning hole has an opening on the second assembly surface and an opening on a first side surface connected with the second assembly surface, and the two openings are connected. The second positioning hole is disposed on the second assembly surface and corresponds to a position of the second positioning column; the second positioning hole has an opening on the second assembly surface and has an opening on a second side surface connected with the second assembly surface, and the two openings are connected.
    Type: Application
    Filed: September 16, 2021
    Publication date: January 6, 2022
    Applicant: Hisense Broadband Multimedia Technologies Co., Ltd.
    Inventors: Sigeng YANG, Shenzhen FU, Xuxia LIU
  • Patent number: 11209608
    Abstract: An optical module includes a circuit board, a lens assembly, a first lens array and a second lens array. The circuit board includes a first driving chip, a first photoelectric chip, a second photoelectric chip and a second driving chip. The lens assembly houses the first photoelectric chip and the second photoelectric chip and includes an upper surface having a first groove and a second groove. The first lens array and the second lens array are on a side surface of the second groove. A bottom surface of the first groove includes a reflecting surface. The first photoelectric chip and the second photoelectric chip are configured such that light coming from or to the first photoelectric chip, or from or to second photoelectric chip, is reflected by the reflecting surface and passes through the first lens array or the second lens array.
    Type: Grant
    Filed: March 15, 2019
    Date of Patent: December 28, 2021
    Assignee: Hisense Broadband Multimedia Technologies Co., Ltd.
    Inventors: Xuxia Liu, Yan Zhong
  • Publication number: 20210356683
    Abstract: An optical module includes a shell, a circuit board, a light source, and a silicon optical chip. The circuit board is located in the shell, a hollow portion is provided in the circuit board, and the hollow portion penetrates the circuit board. The light source includes at least one laser assembly, and the at least one laser assembly is mounted on the shell and is located in the hollow portion, and the at least one laser assembly is electrically connected to the circuit board. The silicon optical chip is mounted on the shell and is located in the hollow portion. The silicon optical chip is electrically connected to the circuit board and is connected to the light source.
    Type: Application
    Filed: June 30, 2021
    Publication date: November 18, 2021
    Applicant: Hisense Broadband Multimedia Technologies Co., Ltd.
    Inventors: Long ZHENG, Sigeng YANG
  • Publication number: 20210337662
    Abstract: An optical module, including: a first laser and a first laser chip for driving the first laser; a second laser and a second laser chip for driving the second laser; and a multi-layer circuit board, including a surface layer, a reference layer, and an intermediate layer provided between the surface layer and the reference layer, where a first row of edge connector pins and a second row of edge connector pins are disposed in at least one surface layer; the first row of edge connector pins are disposed to be closer than the second row of edge connector pins to a side edge, of the multi-layer circuit board, that is provided with an edge connector; and a region, of the intermediate layer, that corresponds to a data signal line pin in the second row of edge connector pins is a hollow region.
    Type: Application
    Filed: October 17, 2019
    Publication date: October 28, 2021
    Applicant: HISENSE BROADBAND MULTIMEDIA TECHNOLOGIES CO., LTD.
    Inventors: Xinnan WANG, Jianwei MU, Shiming WANG, Ting GAO, Jiaao ZHANG
  • Publication number: 20210325617
    Abstract: An optical module has an optical port and an electrical port, and includes a shell, a circuit board, a circuit adapter board, a silicon optical chip, a light source and an optical fiber socket. The circuit board is disposed in the shell. One end of the circuit board is provided with a connecting finger located in the electrical port. The circuit adapter board is disposed on and electrically connected to the circuit board. A thermal expansion coefficient of the circuit adapter board is lower than that of the circuit board. The silicon optical chip is disposed on and electrically connected to the circuit adapter board. The light source is disposed on the circuit board, is electrically connected to the circuit board, and is optically connected to the silicon optical chip. The optical fiber socket is optically connected to the silicon optical chip, and is configured to form the optical port.
    Type: Application
    Filed: June 30, 2021
    Publication date: October 21, 2021
    Applicant: Hisense Broadband Multimedia Technologies Co., Ltd.
    Inventors: Long ZHENG, Sigeng YANG
  • Publication number: 20210239922
    Abstract: An optical module includes an upper shell, a lower shell, a circuit board, a base, a laser assembly and a silicon optical chip. The upper shell and the lower shell form a wrapping cavity. The circuit board is located in the wrapping cavity. The base is located on the circuit board or in a through hole of the circuit board. The laser assembly is located on the base, and is configured to provide light. The silicon optical chip is located on the base, and is configured to receive the light, and modulate the light to convert an electrical signal into an optical signal, and is configured to receive an optical signal from an outside of the optical module and convert the optical signal into an electrical signal.
    Type: Application
    Filed: April 20, 2021
    Publication date: August 5, 2021
    Applicant: Hisense Broadband Multimedia Technologies Co., Ltd.
    Inventors: Guangchao DU, Yongzheng TANG, Tao WU, Jianwei MU, Shaoshuai SUI, Jihong HAN, Sitao CHEN, Qian SHAO, Bangyu YU, Benzheng DONG, Xiangxun SUN, Fabu XU
  • Publication number: 20210218217
    Abstract: An optical transmission module includes a housing having a cavity therein and an optical transmission device encapsulated in the cavity. The optical transmission device includes an optical waveguide substrate, laser assemblies, an optical multiplexing assembly and main waveguides. The optical waveguide substrate includes a surface and a first reflection inclined surface having an acute angle therebetween. The laser assemblies are disposed on the surface of the optical waveguide substrate, and are configured to emit laser beams towards the surface of the optical waveguide substrate. The optical multiplexing assembly is disposed in the optical waveguide substrate, and is configured to combine the laser beams into a laser beam. The main waveguides are disposed inside the optical waveguide substrate, light inlet ends of the main waveguides face the first inclined surface, and light outlet ends of the main waveguides are communicated with the optical multiplexing assembly.
    Type: Application
    Filed: March 31, 2021
    Publication date: July 15, 2021
    Applicant: Hisense Broadband Multimedia Technologies Co., Ltd.
    Inventors: Yi TANG, Jinlei CHEN, Feng CUI, Yifan XIE, Qinhao FU, Lin YU
  • Patent number: 11054594
    Abstract: The present disclosure provides an optical module comprising: a photoelectric conversion unit, a first demodulation circuit, and a second demodulation circuit; the first demodulation circuit and the second demodulation circuit are respectively connected to the photoelectric conversion unit; the photoelectric conversion unit is configured to convert the received optical signal into an electrical signal; the first demodulation circuit is configured to demodulate an electrical signal converted by the photoelectric conversion unit and generate a high-frequency electrical signal; the second demodulation circuit is configured to demodulate an electrical signal converted by the photoelectric conversion unit and generate a low-frequency electrical signal.
    Type: Grant
    Filed: February 18, 2020
    Date of Patent: July 6, 2021
    Assignees: Hisense Broadband Multimedia Technologies Co., Ltd., Hisense Broadband Multimedia Technologies, Ltd.
    Inventors: Qiang Zhang, Qisheng Zhao
  • Patent number: 11025030
    Abstract: An optical module includes a circuit board, an optical fiber, an optical fiber monitoring chip, a laser chip, a laser driving chip and a lens assembly. A bottom surface of the lens assembly is covered above the laser chip and the optical monitoring chip. A groove is on a top surface of the lens assembly. A bottom of the groove protrudes to form a first interface and a second interface. The laser chip is configured to emit light. The first interface is configured to reflect the emitted light to obtain first reflected light. The second interface is configured to reflect a portion of the first reflected light to obtain a second reflected light and refract another portion of the first reflected light to obtain a first refracted light. The second reflected light is transmitted to the optical monitoring chip. The first refracted light is transmitted to the optical fiber.
    Type: Grant
    Filed: August 13, 2019
    Date of Patent: June 1, 2021
    Assignee: HISENSE BROADBAND MULTIMEDIA TECHNOLOGIES CO., LTD.
    Inventors: Xuxia Liu, Yan Zhong
  • Publication number: 20210157073
    Abstract: An optical sub-module includes a first casing, a second casing, an adhesive layer and an optical device. The first casing has a top wall and a first sidewall. The second casing has a bottom wall and a second sidewall. A height of the second sidewall in a thickness direction of the bottom wall is greater than a height of the first sidewall in a thickness direction of the top wall, and the second casing and the first casing is connected to form a chamber. The adhesive layer is disposed between a surface of the first sidewall and a surface of the second sidewall, and a coefficient of thermal expansion of the adhesive layer is greater than a coefficient of thermal expansion of the first casing and a coefficient of thermal expansion of the second casing. The optical device is disposed in the chamber and fixedly connected to the second casing.
    Type: Application
    Filed: January 29, 2021
    Publication date: May 27, 2021
    Applicant: HISENSE BROADBAND MULTIMEDIA TECHNOLOGIES CO., LTD.
    Inventors: Mengbo FU, Yifan XIE, Qinhao FU
  • Publication number: 20210149131
    Abstract: An optical module includes a housing, at least one optical assembly and at least one sealing member. The housing includes a housing body, a cover and at least one vent hole therein. At least part of each optical assembly is located in the housing body. Each sealing member is located at a respective one of the at least one vent hole. The sealing member has a central axis and includes a first cylinder, a truncated cone, and a second cylinder, a diameter of the first cylinder is greater than a diameter of the second cylinder. Each vent hole is a stepped hole including a portion with a first aperture and a portion with a second aperture, the first aperture is greater than the second aperture. The first cylinder fits the portion with the first aperture, and the second cylinder fits the portion with the second aperture.
    Type: Application
    Filed: January 29, 2021
    Publication date: May 20, 2021
    Applicant: HISENSE BROADBAND MULTIMEDIA TECHNOLOGIES CO., LTD.
    Inventors: Guangchao DU, Dan LI, Yongzheng TANG, Yunpeng JIANG
  • Patent number: 10942319
    Abstract: The present application provides an optical module, including a laser, a laser driving chip, and a lens component disposed above the laser and the laser driving chip, where an inner cavity wall of the lens component that faces towards the laser and the laser driving chip is provided with a transmitting lens; a surface of the transmitting lens and the inner cavity wall around the transmitting lens are coated with a reflective film; and there is no reflective film coated on a part or entire of a region, of the inner cavity wall of the lens unit, which is irradiated by a secondarily reflected laser light.
    Type: Grant
    Filed: August 19, 2019
    Date of Patent: March 9, 2021
    Assignee: HISENSE BROADBAND MULTIMEDIA TECHNOLOGIES CO., LTD.
    Inventors: Xuxia Liu, Shijian Ben