Patents Assigned to Hitachi Chemical Company, Ltd.
  • Patent number: 10854871
    Abstract: An anode material for a lithium ion secondary battery that includes a carbon material having an average interlayer spacing d002 as determined by X-ray diffraction of from 0.335 nm to 0.340 nm, a volume average particle diameter (50% D) of from 1 ?m to 40 ?m, a maximum particle diameter Dmax of 74 ?m or less, and at least two exothermic peaks within a temperature range of from 300° C. to 1000° C. in a differential thermal analysis in an air stream.
    Type: Grant
    Filed: July 29, 2011
    Date of Patent: December 1, 2020
    Assignee: HITACHI CHEMICAL COMPANY, LTD.
    Inventors: Nobushige Nakamura, Yoshito Ishii, Hidetoshi Honbou, Keiji Okabe, Yuriko Ida
  • Patent number: 10840452
    Abstract: One embodiment relates to an organic electronic material containing a charge transport polymer or oligomer, wherein the charge transport polymer or oligomer has a structural unit containing an aromatic amine structure substituted with a fluorine atom.
    Type: Grant
    Filed: January 6, 2017
    Date of Patent: November 17, 2020
    Assignee: HITACHI CHEMICAL COMPANY, LTD.
    Inventors: Shigeaki Funyuu, Tomotsugu Sugioka, Kenichi Ishitsuka, Naoki Asano
  • Patent number: 10840451
    Abstract: Provided are: an organic electronic material which can be easily multilayered and that can be used in substrates, such as resin, that cannot be processed at high temperatures; an ink composition containing the same; an organic thin film formed using said organic electronic material or said ink composition; and an organic electronic element and an organic EL element that are formed using said organic thin film and that have a superior luminous efficacy and emission lifespan than conventional elements. Specifically, provided are: an organic electronic material that is characterized by containing an oligomer or a polymer having a structure that branches into three or more directions and has at least one polymerizable substituent; an ink composition containing said organic electronic material; and an organic thin film prepared using the aforementioned organic electronic material. Further, provided are an organic electronic element and an organic electroluminescent element containing said organic thin film.
    Type: Grant
    Filed: January 18, 2018
    Date of Patent: November 17, 2020
    Assignee: HITACHI CHEMICAL COMPANY, LTD.
    Inventors: Shigeaki Funyuu, Kenichi Ishitsuka, Yousuke Hoshi
  • Patent number: 10825687
    Abstract: The polishing liquid according to the embodiment comprises abrasive grains, an additive and water, wherein the abrasive grains include a tetravalent metal element hydroxide, and produce a liquid phase with a nonvolatile content of 500 ppm or greater when an aqueous dispersion with a content of the abrasive grains adjusted to 1.0 mass % has been centrifuged for 50 minutes at a centrifugal acceleration of 1.59×105 G.
    Type: Grant
    Filed: December 14, 2017
    Date of Patent: November 3, 2020
    Assignee: HITACHI CHEMICAL COMPANY, LTD.
    Inventor: Tomohiro Iwano
  • Patent number: 10821705
    Abstract: The present invention relates to an aerogel laminated composite having a structure in which a porous spacer layer, an aerogel layer and a support having a heat ray reflective function or a heat ray absorbing function are laminated in this order.
    Type: Grant
    Filed: August 29, 2016
    Date of Patent: November 3, 2020
    Assignee: HITACHI CHEMICAL COMPANY, LTD.
    Inventors: Tomohiko Kotake, Satoshi Takayasu, Yuta Akasu, Hiroyuki Izumi, Chisato Kikkawa, Tatsuya Makino, Masato Miyatake
  • Patent number: 10825694
    Abstract: The present invention relates to a method for manufacturing an electronic component having an electromagnetic shield, comprising: a bonding step of bonding a temporary protective material on a workpiece with unevenness on the surface thereof; a photocuring step of curing the temporary protective material by light irradiation; a icing step of singulating the workpiece and the temporary protective material; a shielding step of forming a metal film on the portion of the singulated workpiece, the portion having no temporary protective material bonded thereon; and a peeling step of peeling the temporary protective material from the workpiece having the metal film formed, wherein the temporary protective material is formed from a resin composition for temporary protection with an elastic modulus at 25° C. of 3 MPa or less and an elastic modulus at 25° C. of 40 MPa or more after light irradiation with an exposure dose of 500 mJ/cm2 or more.
    Type: Grant
    Filed: January 23, 2018
    Date of Patent: November 3, 2020
    Assignee: HITACHI CHEMICAL COMPANY, LTD.
    Inventors: Yushi Yamaguchi, Ryoji Furutani, Takuji Ikeya, Shogo Sobue, Yasuyuki Ooyama
  • Publication number: 20200332851
    Abstract: There are provided a friction member in which both shear strength at normal temperature and high temperature and crack resistance can be satisfied, the disk rotor-attacking properties are low, and the vibration damping properties are high, and brake squeal is less likely to occur, and a friction material composition for an underlay material with which the friction member is obtained, and a friction material. The friction member is more specifically a friction member comprising an overlay material, an underlay material, and a back metal in this order, wherein the underlay material comprises fibrous wollastonite, an average fiber length of the fibrous wollastonite is 100 to 850 ?m, and an aspect ratio (average fiber length/average fiber diameter) of the fibrous wollastonite is 8 or more.
    Type: Application
    Filed: October 26, 2017
    Publication date: October 22, 2020
    Applicant: HITACHI CHEMICAL COMPANY, LTD.
    Inventors: Yoshihisa TAKAHASHI, Kazuya BABA
  • Patent number: 10807830
    Abstract: Provided is a winding core which has a cylindrical shape and on which an adhesive tape, formed by an adhesive layer formed on an elongated base film in the longitudinal direction of the base film, is wound as multiple layers, wherein the outer diameter of the winding core is a dimension in which a deviation amount of the adhesive layer in the circumferential direction of the winding core between adjacent inner and outer tape portions of the adhesive tape in the radial direction of the winding core becomes 55 mm or less when the adhesive tape is wound on the winding core.
    Type: Grant
    Filed: May 24, 2013
    Date of Patent: October 20, 2020
    Assignee: HITACHI CHEMICAL COMPANY, LTD.
    Inventors: Megumi Kodama, Takahiro Tokuyasu, Shouta Sugai
  • Patent number: 10808150
    Abstract: A resin composition comprising (a) an acrylic polymer, (b) a compound having at least one (meth)acryloyl group and (c) a polymerization initiator, in which the absolute value of refractive index difference between the component (a) an acrylic polymer and the component (b) having at least one (meth)acryloyl group at 100° C. is 0.031 or less.
    Type: Grant
    Filed: March 20, 2018
    Date of Patent: October 20, 2020
    Assignee: HITACHI CHEMICAL COMPANY, LTD.
    Inventors: Sadaaki Kato, Mika Kimura, Aya Ikeda, Shinjiro Fujii
  • Publication number: 20200325398
    Abstract: An epoxy resin, comprising an epoxy compound having a mesogenic structure, and having a value of ??2/??1 equal to 3 or less, wherein is an initial dynamic shear viscosity (Pa·s) and ??2 is a maximum value of dynamic shear viscosity (Pa·s), in a measurement of dynamic shear viscosity.
    Type: Application
    Filed: April 9, 2019
    Publication date: October 15, 2020
    Applicant: Hitachi Chemical Company, Ltd.
    Inventors: Tomoko HIGASHIUCHI, Naoki MARUYAMA, Kazumasa FUKUDA, Yoshitaka TAKEZAWA, Hideyuki KATAGI, Yuki NAKAMURA
  • Patent number: 10800872
    Abstract: An epoxy resin, comprising an epoxy compound having a mesogen structure, wherein, when performing a process of decreasing a temperature of the epoxy resin from 150° C. to 30° C. at a rate of 2° C./min, and a process of increasing the temperature of the epoxy resin from 30° C. to 150° C. at a rate of 2° C./min, in this order, the epoxy resin has a maximum value of ??2/??1 of 20 or less within a temperature range of from 30° C. to 150° C., wherein ??1 is a dynamic shear viscosity (Pa·s) measured in the process of decreasing the temperature, and ??2 is a dynamic shear viscosity (Pa·s) measured in the process of increasing the temperature, ??1 and ??2 being measured at the same temperature, and a value ??2 measured at 100° C. is 1000 Pa·s or less.
    Type: Grant
    Filed: October 13, 2017
    Date of Patent: October 13, 2020
    Assignee: HITACHI CHEMICAL COMPANY, LTD.
    Inventors: Naoki Maruyama, Tomoko Higashiuchi, Kazumasa Fukuda, Yuka Yoshida, Yoshitaka Takezawa
  • Patent number: 10795469
    Abstract: A laminate which includes a substrate 230, conductive fibers 221 and a resin layer, wherein, in said laminate, a ratio of increase in resistance after irradiation with light emitted from a xenon lamp at an intensity of 60 W/m2 (integrated value of spectral irradiance at a wavelength of 300 nm to 400 nm) for 300 hours is 20% or less.
    Type: Grant
    Filed: October 15, 2014
    Date of Patent: October 6, 2020
    Assignee: HITACHI CHEMICAL COMPANY, LTD.
    Inventors: Masahiko Ebihara, Emiko Oota, Yasuharu Murakami
  • Patent number: 10796921
    Abstract: The CMP polishing liquid for polishing palladium of this invention comprises an organic solvent, 1,2,4-triazole, a phosphorus acid compound, an oxidizing agent and an abrasive. The substrate polishing method is a method for polishing a substrate with a polishing cloth while supplying a CMP polishing liquid between the substrate and the polishing cloth, wherein the substrate is a substrate with a palladium layer on the side facing the polishing cloth, and the CMP polishing liquid is a CMP polishing liquid comprising an organic solvent, 1,2,4-triazole, a phosphorus acid compound, an oxidizing agent and an abrasive.
    Type: Grant
    Filed: February 5, 2010
    Date of Patent: October 6, 2020
    Assignee: HITACHI CHEMICAL COMPANY, LTD.
    Inventors: Hisataka Minami, Ryouta Saisyo, Jin Amanokura, Yuuhei Okada, Hiroshi Ono
  • Patent number: 10774194
    Abstract: A method of separating an inorganic material, the method comprising in the following order: a contact process of contacting a processing solution with a composite material, the composite material including a first organic substance that is decomposable by the processing solution, a second organic substance that is not decomposable by the processing solution, and an inorganic material; a separation process of separating the processing solution including a decomposition product of the first organic substance, from a recovered product including the inorganic material and the second organic substance; and a thermal treatment process of subjecting the recovered product to a thermal treatment at a temperature that is equal to or greater than a temperature at which the second organic substance is eliminated.
    Type: Grant
    Filed: March 8, 2016
    Date of Patent: September 15, 2020
    Assignee: HITACHI CHEMICAL COMPANY, LTD.
    Inventors: Akira Shimizu, Kazuhito Kobayashi, Kouichi Aoyagi
  • Patent number: 10773422
    Abstract: A method of separating an inorganic material, the method comprising in the following order: a contact process of contacting a processing solution with a composite material, the composite material including a first organic substance that is decomposable by the processing solution, a second organic substance that is not decomposable by the processing solution, and an inorganic material; and a separation process of separating the inorganic material from the processing solution including a decomposition product of the first organic substance and the second organic substance, the contact process and the separation process including adjusting the processing solution to have a temperature that is equal to or greater than a softening point of the second organic substance.
    Type: Grant
    Filed: March 8, 2016
    Date of Patent: September 15, 2020
    Assignee: HITACHI CHEMICAL COMPANY, LTD.
    Inventors: Akira Shimizu, Kazuhito Kobayashi, Kouichi Aoyagi
  • Patent number: 10766999
    Abstract: A polyamideimide resin composition containing: (A) a polyamideimide resin which has isocyanate groups at the terminals and in which at least a portion of the isocyanate groups are blocked with a blocking agent selected from the group consisting of alcohols, oximes and lactams, (B) N-formylmorpholine, and (C) water.
    Type: Grant
    Filed: December 5, 2016
    Date of Patent: September 8, 2020
    Assignee: HITACHI CHEMICAL COMPANY, LTD.
    Inventor: Atsushi Takahashi
  • Patent number: 10759968
    Abstract: A polishing agent comprises: a fluid medium; an abrasive grain containing a hydroxide of a tetravalent metal element; a first additive; a second additive; and a third additive, wherein: the first additive is at least one selected from the group consisting of a compound having a polyoxyalkylene chain and a vinyl alcohol polymer; the second additive is a cationic polymer; and the third additive is an amino group-containing sulfonic acid compound.
    Type: Grant
    Filed: June 26, 2018
    Date of Patent: September 1, 2020
    Assignee: HITACHI CHEMICAL COMPANY, LTD.
    Inventors: Hisataka Minami, Tomohiro Iwano, Toshiaki Akutsu
  • Patent number: 10763509
    Abstract: Provided are a positive electrode for a lithium ion secondary battery, the positive electrode including a positive electrode active material layer, the positive electrode active material layer including insulating polyolefin particles and an electroconductive material; an electrode for a lithium ion secondary battery, the electrode including an electrode active material layer, the electrode active material layer including polyolefin particles and a resin including a structural unit derived from a nitrile group-containing monomer; and a lithium ion secondary battery using the same.
    Type: Grant
    Filed: February 2, 2016
    Date of Patent: September 1, 2020
    Assignee: HITACHI CHEMICAL COMPANY, LTD.
    Inventors: Hiroki Kuzuoka, Eisuke Haba, Shunsuke Nagai, Kenji Takaoka
  • Patent number: 10759937
    Abstract: A polyketone composition includes: (A) a polyketone having, in a main chain, a structural unit represented by the following Formula (I); and (B) an epoxy compound. In Formula (I), X represents a bivalent group that has from 1 to 50 carbon atoms and that may have a substituent group, Y represents a bivalent hydrocarbon group that has from 1 to 30 carbon atoms and that may have a substituent group, and n represents an integer from 1 to 1500.
    Type: Grant
    Filed: March 1, 2017
    Date of Patent: September 1, 2020
    Assignee: HITACHI CHEMICAL COMPANY, LTD.
    Inventors: Hiroshi Matsutani, Nanako Mizuguchi, Satoshi Asaka, Misao Inaba, Yohei Ishikawa, Keiko Kudoh, Katsuya Maeyama
  • Publication number: 20200270447
    Abstract: An epoxy resin, comprising an epoxy compound A that has at least two mesogenic structures and at least one phenylene group, and an epoxy compound B that has at least two mesogenic structures and at least one divalent biphenyl group.
    Type: Application
    Filed: September 29, 2017
    Publication date: August 27, 2020
    Applicant: Hitachi Chemical Company, Ltd.
    Inventors: Naoki MARUYAMA, Yuka YOSHIDA, Tomoko HIGASHIUCHI, Kazumasa FUKUDA, Keiichiro NISHIMURA, Yoshitaka TAKEZAWA