Abstract: An inspection apparatus capable of accurately detecting a defect regardless of the difference between peripheral parts formed around cell parts is realized. Dies 201 to 2N1 arrayed on a wafer are produced with identical specifications to each other, and a plurality of cell parts 202 to 20n produced by repetition of identical patterns is formed. A peripheral part is formed between a cell part and another cell part. Since the peripheral part is provided in a plurality of types such as patterns A, B, C, even cell parts having the same shape as each other may have different cross-sectional images due to the influence of the difference between the surrounding peripheral parts. Thus, in order to prevent occurrence of false information in a cell part area near the peripheral part, cell parts having the same surrounding peripheral parts are aligned with each other, then the difference is detected, and whether there is a defect or not is determined. Thus, occurrence of false information is prevented.

Abstract: There is provided a method for controlling a plasma processing apparatus that eliminates a preliminary study on a resonance point while maintaining a low contamination and a high uniformity even in multi-step etching. In a method for controlling a plasma processing apparatus including the step of adjusting a radio frequency bias current carried to a counter antenna electrode, the method includes the steps of: setting a reactance of a variable element to an initial value; detecting a bias current carried to the counter antenna electrode; searching for a maximum value of the detected electric current; and adjusting a value of the reactance of the variable element from the maximum value to the set value and then fixing the value.

Abstract: It is an object of the present invention to provide an electron microscope for properly applying a retarding voltage to a sample which is brought into electrical conduction.

Abstract: An object of the present invention is to provide a deterioration detection method of a head and a magnetic disk inspection apparatus in which the number of times of exchanging the head due to deterioration is decreased to improve the throughput of an inspection. In the present invention, a resistance value detecting circuit that is directly coupled to both terminals of an MR head is provided to measure the resistance value of the MR head, and the measured value is compared with the initial value of the exchanged head, so that it is possible to recognize a deterioration state of each head irrespective of a magnetic disk as a measurement target.