Patents Assigned to Honda Engineering North America
  • Patent number: 6328920
    Abstract: A plastic part having a complex structure as a first layer and a simple structure as a second layer, is formed using a method for molding. Initially, a single mold is provided, the mold having an interior cavity and a runner reaching from an exterior of the mold to the cavity. The mold is kept closed while a quantity of a first plastic material is injected via the runner into the interior cavity to form a first layer of the plastic part. The mold is then partially opened, creating an increased interior cavity section, into which a quantity of a second plastic material is injected, via the runner, to form a second layer of the plastic part. The solidified plastic part can then be ejected from the mold.
    Type: Grant
    Filed: July 17, 1998
    Date of Patent: December 11, 2001
    Assignee: Honda Engineering North America, Inc.
    Inventors: Yuichi Uchiyama, Lam B. Sam
  • Patent number: 5823518
    Abstract: A spring guide retainer is provided for preventing buckling of a spring during spring compression as an upper die moves toward a lower die in a stamping operation. The spring guide retainer comprises a spring guide housing to hold the spring location, a spring guide holder fixed to the upper die to promote spring alignment, and a spring guide pin to maintain alignment of the spring. A screw associated with the spring guide pin is receivable through a pocket of the spring guide housing to secure the spring guide pin and the spring guide housing to the pad.
    Type: Grant
    Filed: February 14, 1997
    Date of Patent: October 20, 1998
    Assignee: Honda Engineering North America
    Inventors: Tatsuo Nagamitsu, Robert Duane Dye