Patents Assigned to Honshu Paper Co., Ltd.
  • Patent number: 5562227
    Abstract: To provide a packaging container with anti-bulging function comprising a bag inside a box in which an inner bag is set in an octangular inner cylinder integrated with a quadrangular outer casing. The bag inside the box provides an anti-bulging function to prevent the outer casing from bulging, by developing a counter bulge in the inner bag acting on an oblique surface of the octangular inner cylinder to pull a side wall of the quadrangular outer casing inward.
    Type: Grant
    Filed: July 31, 1995
    Date of Patent: October 8, 1996
    Assignees: Honshu Paper Co., Ltd., Kikkoman Corporation
    Inventors: Taihei Takezawa, Hyozaemon Takanashi, Nobuo Sugimaru, Shoichi Kawase, Yutaka Watanabe, Mitsuo Takayanagi, Kinzaburo Akita
  • Patent number: 5328566
    Abstract: A process for producing an inorganic fiber-based prepreg sheet, which comprises preparing a slurry containing 35-80% by weight of a phenolic resin powder of 0.01-100 .mu.m in average particle diameter, 65-20% by weight of an inorganic fiber (the amounts are based on the total amount of the two) and a nonionic high-molecular fixing agent, making the slurry into a sheet in the same manner as in the paper making, and allowing the sheet to contain a silane coupling agent; and a process for producing an insulating laminate, which comprises laminating a prepreg sheet produced by the above process.
    Type: Grant
    Filed: January 22, 1992
    Date of Patent: July 12, 1994
    Assignee: Honshu Paper Co., Ltd.
    Inventors: Hidekuni Yokoyama, Setuo Toyoshima, Takamasa Ibaraki
  • Patent number: 5286704
    Abstract: The present invention relates to a heat-sensitive recording medium which is excellent in dot-reproducibility and in adhesion between a support and a heat-sensitive recording layer provided thereon. The present recording medium comprises a synthetic-resin support, an ionomer-resin layer on the support, and a heat-sensitive recording layer provided on the ionomer-resin layer.
    Type: Grant
    Filed: September 28, 1992
    Date of Patent: February 15, 1994
    Assignee: Honshu Paper Co., Ltd.
    Inventors: Motonao Yoshikawa, Katsumi Moronuki
  • Patent number: 5181959
    Abstract: The present invention relates to a high-concentration starch adhesive prepared by treating a starch slurry at a temperature of 100.degree. C. or above to form a gelatinized solution and suspending an ungelatinized starch in the gelatinized solution. According to the present invention, the viscosity of the starch adhesive can be kept stable over a long period of time; the problems such as warp due to the expansion and contraction, by the absorption of water, of the material to be adhered, can be solved; and the quantity of heat necessitated in the adhesion step can be much reduced.
    Type: Grant
    Filed: December 28, 1989
    Date of Patent: January 26, 1993
    Assignee: Honshu Paper Co., Ltd.
    Inventors: Shigeki Nagai, Haruo Sato, Nagahisa Karube
  • Patent number: 5173359
    Abstract: A composite material for electrical applications reinforced by a para-oriented aramide fibrous substance made of a para-oriented aramide fibrous substance selected from the group consisting of poly(p-phenylene terephthalamide) fiber and poly(p-phenylene-3,4'-diphenyl ether terephthalamide) fiber, a thermosetting resin matrix and a polymer having at least one specific reactive cross-linking group selected from the group consisting of carboxyl group, epoxy group, hydroxyl group and methylol group. The polymer resides at the interface between the para-oriented aramide fibers and the thermosetting resin matrix.
    Type: Grant
    Filed: September 6, 1990
    Date of Patent: December 22, 1992
    Assignee: Honshu Paper Co., Ltd.
    Inventors: Setuo Toyoshima, Megumi Kimura
  • Patent number: 5096491
    Abstract: The present invention relates to a high concentration aqueous starch slurry adhesive comprising 20 to 60% of starch and the following components in the specified amount based on the weight of starch:(1) 0.01 to 1.0% of rhamsan gum or xanthan gum,(2) 1.0 to 3.0% of sodium hydroxide, and(3) if necessary, up to 3% of sodium tetraborate.According to the present invention, a high concentration aqueous starch slurry adhesive can be easily obtained at a single step by merely dispersing starch into cold water while stirring.
    Type: Grant
    Filed: July 16, 1990
    Date of Patent: March 17, 1992
    Assignee: Honshu Paper Co., Ltd.
    Inventors: Shigeki Nagai, Kohei Hamazaki, Nagahisa Karube
  • Patent number: 5067612
    Abstract: Packaging with heat-shrinkable film wherein an article has on its surface a heat-shrinkable film in the longitudinal or traversing direction, a tape-shaped overlapping portion is formed on said film, the tape-shaped overlapping portion is partially welded, and tear-off perforations are made in lines along the longitudinal direction thereof so that tearing off the tape-shaped overlapping portion along the perforations opens the package to allow the article to be taken out.
    Type: Grant
    Filed: January 2, 1991
    Date of Patent: November 26, 1991
    Assignees: Honshu Sangyou Kabushiki Kaisha, Honshu Paper Co., Ltd.
    Inventors: Mikio Tsuchiya, Shoichi Kawase, Hirofumi Watanabe
  • Patent number: 5002637
    Abstract: A composite material comprising a para-oriented aramide fiber sheet and a thermosetting resin matrix. The composite material is characterized in that the reinforcing para-oiented aramide fiber sheet is pre-treated with a reactive siloxane oligomer prior to impregnation with the thermosetting resin. The reactive siloxane oligomer is represented by the following general formula (1) of: ##STR1## wherein Z is ##STR2## CH.sub.2 --O--, HS, NH.sub.2 -- or CH.sub.2 .dbd.CH--; m is an integer of from zero to 4; n is an integer of from 1 to 9; and R.sub.1 is the same or different groups selected from methyl, ethyl and phenyl.The composite material is improved in electric resistance properties, particularly after being dipped in boiling water, and also improved in thermal resistance to soldering.
    Type: Grant
    Filed: November 28, 1988
    Date of Patent: March 26, 1991
    Assignee: Honshu Paper Co. Ltd.
    Inventors: Setuo Toyoshima, Shinichiro Kouguchi, Takamasa Ibaraki
  • Patent number: 4933316
    Abstract: The present invention relates to an ink image receiving sheet usable in thermal ink-transfer recording. The sheet has a surface roughness index determined by Bristow method (Vr) (using linseed oil under pressure of 0.1 MPa) being 5 to 10 ml/m.sup.2. According to the present invention, the image resolution of the sheet having a transferred ink image is excellent and the ink transfer efficiency during the transfer recording is improved.
    Type: Grant
    Filed: June 28, 1989
    Date of Patent: June 12, 1990
    Assignee: Honshu Paper Co., Ltd.
    Inventors: Keiji Sasaki, Katsumi Moronuki
  • Patent number: 4338765
    Abstract: A method for sealing a cylindrical or truncated cone shaped container body the lower end of which is sealed with a base, comprising the steps of pouring a liquid into said container body through its upper open end to a predetermined level, slightly deforming upwards said base, and thereafter sealing the upper open end of said container body.
    Type: Grant
    Filed: June 8, 1979
    Date of Patent: July 13, 1982
    Assignee: Honshu Paper Co., Ltd.
    Inventors: Koichiro Ohmori, Yasuo Tashiro, Heihachiro Nakayama