Patents Assigned to Hutchinson Technology Incorporated
  • Patent number: 12007618
    Abstract: Autofocus assembly and related methods are described. One example of an autofocus assembly includes a housing element. The housing element including a hall housing wall configured to secure a hall sensor. The autofocus assembly includes a lens carriage configured to secure a hall magnet and configured to be received within the housing element and configured to define a receiving space between the lens carriage and the housing element to receive one or more bearing elements. The autofocus assembly includes a magnetic element disposed at the hall housing wall and configured to magnetically attract the hall magnet and to secure the hall housing wall to the housing element and secure the one or more bearing elements between the hall housing wall and the lens carriage.
    Type: Grant
    Filed: December 6, 2021
    Date of Patent: June 11, 2024
    Assignee: Hutchinson Technology Incorporated
    Inventor: Mark A. Miller
  • Patent number: 11982263
    Abstract: The present embodiments relate to a shape memory alloy (SMA) actuator with a joint between an SMA wire the SMA actuator being disposed at a bottom surface of the SMA actuator. The SMA actuator can include at least one fixed end configured to be fixed to a carriage, at least one free end, at least one beam connecting the fixed end and the free end, and at least one SMA wire. The at least one SMA wire can be electrically connected to the at least one fixed end and the at least one free end via electrical contact portions. The position of the at least one SMA wire being affixed to the bottom surface can allow for reduced stress and a wire exit angle at the weld joint between each SMA wire and the actuator, improving resiliency of the SMA actuator.
    Type: Grant
    Filed: May 2, 2023
    Date of Patent: May 14, 2024
    Assignee: Hutchinson Technology Incorporated
    Inventor: Ryan N. Ruzicka
  • Patent number: 11977241
    Abstract: A suspension assembly for a camera lens element includes a support member with a wire attach structure and a moving member coupled to the support member. The moving member includes a plate, flexure arms extending from the plate and coupled to the support member, and a wire attach structure. A bearing supports the plate of the moving member for movement with respect to the support member. A shape memory alloy wire is coupled to and extends between the wire attach structures of the support member and the moving member. The limiter limits a range of movement of the moving member with respect to the support member, and in embodiments includes an opening in one of the moving member plate and the support member, and a stop that includes an engagement portion extending into the opening in the other of the moving member plate and the support member.
    Type: Grant
    Filed: July 26, 2021
    Date of Patent: May 7, 2024
    Assignee: Hutchinson Technology Incorporated
    Inventor: Mark A. Miller
  • Patent number: 11940340
    Abstract: An apparatus is described. The apparatus may include a substrate and one or more sensors mounted to the substrate. The one or more sensors may be mounted to the substrate using adhesive material and one or more spot welds.
    Type: Grant
    Filed: September 22, 2020
    Date of Patent: March 26, 2024
    Assignee: Hutchinson Technology Incorporated
    Inventors: Clark T. Olsen, Duane M. Jelkin
  • Patent number: 11932948
    Abstract: Etchant solutions, pretreatment and methods for etching electroless nickel on metallic materials are provided herein. More specifically, etchant solutions for selectively removing electroless nickel from the surface of metallic materials containing copper, and optionally as containing stainless steel, methods of etching and pretreatment are provided.
    Type: Grant
    Filed: October 27, 2021
    Date of Patent: March 19, 2024
    Assignee: Hutchinson Technology Incorporated
    Inventors: Matthew J. Horner, Gowtham V. Vangara, Douglas P. Riemer
  • Patent number: 11907790
    Abstract: An identification device includes a first metal layer patterned into a planar coil winding and a second metal layer electrically connected to the first metal layer. The first metal layer is operable to provide a circuit inductance. The second metal layer is patterned to provide one or more overlapping areas with the first metal layer. The second metal layer is operable to provide a circuit capacitance. The identification device includes a dielectric layer separating the first metal layer and the second metal layer.
    Type: Grant
    Filed: September 22, 2020
    Date of Patent: February 20, 2024
    Assignee: Hutchinson Technology Incorporated
    Inventors: Dean E. Myers, Michael W. Davis, Clark T. Olsen, Beauregard J. Gagnon
  • Patent number: 11898264
    Abstract: Treatment solutions and methods for improving adhesion of gold electroplating onto metal surfaces are provided herein. More specifically, the disclosure relates to micro-etching stainless steel surfaces using to remove any organic contamination and chromium oxide formed on the surface, neutralize and strip the surface of any iron content, and repassivate the surface with a thin chromium oxide layer, prior to gold electroplating of the stainless steel surfaces.
    Type: Grant
    Filed: September 20, 2021
    Date of Patent: February 13, 2024
    Assignee: Hutchinson Technology Incorporated
    Inventors: Paul V. Pesavento, Collin M. Grove, Douglas P. Riemer
  • Patent number: 11892759
    Abstract: SMA actuators and related methods are described. One embodiment of an actuator includes a base; a plurality of buckle arms; and at least a first shape memory alloy wire coupled with a pair of buckle arms of the plurality of buckle arms. Another embodiment of an actuator includes a base and at least one bimorph actuator including a shape memory alloy material. The bimorph actuator attached to the base.
    Type: Grant
    Filed: January 31, 2023
    Date of Patent: February 6, 2024
    Assignee: Hutchinson Technology Incorporated
    Inventors: Ryan N. Ruzicka, Yasushi Sakamoto, Mark A. Miller
  • Patent number: 11873564
    Abstract: An etch chemistry solution for treating metallic surfaces in which the etch chemistry solution includes an oxidizing agent and gluconic acid. The etch chemistry solution may also include an oxidizing agent and a short-chained polyethylene polymer glycol or a short-chained polyethylene copolymer glycol. The metallic surfaces are usually used in circuits such as flexible circuits.
    Type: Grant
    Filed: October 2, 2019
    Date of Patent: January 16, 2024
    Assignee: Hutchinson Technology Incorporated
    Inventors: Douglas P. Riemer, Peter F. Ladwig
  • Patent number: 11867160
    Abstract: SMA actuators and related methods are described. One embodiment of an actuator includes a base; a plurality of buckle arms; and at least a first shape memory alloy wire coupled with a pair of buckle arms of the plurality of buckle arms. Another embodiment of an actuator includes a base and at least one bimorph actuator including a shape memory alloy material. The bimorph actuator attached to the base.
    Type: Grant
    Filed: December 13, 2021
    Date of Patent: January 9, 2024
    Assignee: Hutchinson Technology Incorporated
    Inventors: Mark A. Miller, Nathaniel K. Behning, Dean E. Myers, Michael W. Davis
  • Patent number: 11867575
    Abstract: A pressure/force sensor comprises a diaphragm structure including a sensing element and a lead structure extending from the diaphragm structure and including first and second traces electrically coupled to the sensing element. The diaphragm structure and the lead structure include a circuit assembly comprising a common insulating layer and a common conductor layer on the insulating layer. The conductor layer includes at least a portion of the sensing element and at least the first trace.
    Type: Grant
    Filed: January 28, 2022
    Date of Patent: January 9, 2024
    Assignee: Hutchinson Technology Incorporated
    Inventors: Michael W. Davis, Peter F. Ladwig, Matthew S. Lang, Dean E. Myers, Clark T. Olsen, Douglas P. Riemer
  • Patent number: 11859598
    Abstract: SMA actuators and related methods are described. One embodiment of an actuator includes a base; a plurality of buckle arms; and at least a first shape memory alloy wire coupled with a pair of buckle arms of the plurality of buckle arms. Another embodiment of an actuator includes a base and at least one bimorph actuator including a shape memory alloy material. The bimorph actuator attached to the base.
    Type: Grant
    Filed: June 2, 2022
    Date of Patent: January 2, 2024
    Assignee: Hutchinson Technology Incorporated
    Inventors: Duane M. Jelkin, Raymond R. Wolter
  • Patent number: 11815794
    Abstract: SMA actuators and related methods are described. One embodiment of an actuator includes a base; a plurality of buckle arms; and at least a first shape memory alloy wire coupled with a pair of buckle arms of the plurality of buckle arms. Another embodiment of an actuator includes a base and at least one bimorph actuator including a shape memory alloy material. The bimorph actuator attached to the base.
    Type: Grant
    Filed: January 5, 2022
    Date of Patent: November 14, 2023
    Assignee: Hutchinson Technology Incorporated
    Inventors: Ryan N. Ruzicka, Yasushi Sakamoto, Mark A. Miller
  • Patent number: 11791521
    Abstract: Electric tabs and methods for manufacturing are described. A method includes disposing a dielectric layer on a second side of a base material, the base material having a first side and the second side. The method including developing the dielectric layer on the second side of the base material. And, the method including etching the first side of the base material to form an electrode tab.
    Type: Grant
    Filed: September 10, 2020
    Date of Patent: October 17, 2023
    Assignee: Hutchinson Technology Incorporated
    Inventors: Douglas P. Riemer, Peter F. Ladwig, Joseph D. Starkey, Michael W. Davis, Duane M. Jelkin
  • Patent number: 11782286
    Abstract: Embodiments of the disclosure include a suspension assembly having a support member, a moving member movably coupled to the support member, and shape metal alloy wires coupled between the support and moving members by attachment structures. In embodiments, the attachment structures include a first portion and a second portion configured to be crimped together. In embodiments, at least one of the first and second portions include an etched recess.
    Type: Grant
    Filed: March 7, 2016
    Date of Patent: October 10, 2023
    Assignee: Hutchinson Technology Incorporated
    Inventors: Peter F. Ladwig, Mark A. Miller, Michael W. Davis, Bryan J. Scheele, Douglas P. Riemer, Donald M. Anderson, John A. Theget
  • Patent number: 11769977
    Abstract: A wire feeding and bonding tool and method for attaching wires to a component having first and second spaced-apart wire attach structures. Wire from a supply is fed through a capillary having at least a linear end portion with a feed opening. The capillary is positioned with respect to the component to locate a first portion of the wire extending from the feed opening adjacent to the first wire attach structure, and the wire is attached to the first attach structure. The capillary is moved with respect to the component along a wire feed path to feed the wire from the first wire attach structure to the second wire attach structure and to locate a second portion of the wire extending from the feed opening adjacent to the second attach structure. The wire is attached to the second wire attach structure, and cut from the supply.
    Type: Grant
    Filed: November 16, 2020
    Date of Patent: September 26, 2023
    Assignee: Hutchinson Technology Incorporated
    Inventors: Michael W. Davis, Bryan J. Scheele, Daniel W. Scheele, Andrew H. Ashwill, Matthew D. Crane
  • Patent number: 11713514
    Abstract: A system for electroplating a web of conductive material with a source material comprises a transport mechanism, an electrical contact, a plating bath, and at least one nozzle. The transport mechanism transports the web through the system. The electrical contact electrically engages the web to cause current to flow into the web. The plating bath contains a volume of an electrically conductive liquid contain ions of the source material. The nozzle is configured to flow a low electrical conductivity fluid onto the web. A portion of the web is immersed in the electrically conductive liquid. The current flowing in the web causes the ions of the source material in the electrically conductive liquid to attach to a surface of the portion of the web.
    Type: Grant
    Filed: August 6, 2020
    Date of Patent: August 1, 2023
    Assignee: Hutchinson Technology Incorporated
    Inventors: Douglas P. Riemer, Stephen P. Toperzer, Donovan D. Turvold, Christopher R. Rosenau, Dylan S. Johnson
  • Patent number: 11686294
    Abstract: SMA actuators and related methods are described. One embodiment of an actuator includes a base; a plurality of buckle arms; and at least a first shape memory alloy wire coupled with a pair of buckle arms of the plurality of buckle arms. Another embodiment of an actuator includes a base and at least one bimorph actuator including a shape memory alloy material. The bimorph actuator attached to the base.
    Type: Grant
    Filed: April 26, 2022
    Date of Patent: June 27, 2023
    Assignee: Hutchinson Technology Incorporated
    Inventors: Mark A. Miller, Nathaniel K. Behning, Dean E. Myers, Michael W. Davis, Ryan N. Ruzicka, Zachary A. Pokornowski, Yasushi Sakamoto
  • Patent number: 11682876
    Abstract: A wire feeding and bonding tool and method for attaching wires to a component having first and second spaced-apart wire attach structures. Wire from a supply is fed through a capillary having at least a linear end portion with a feed opening. The capillary is positioned with respect to the component to locate a first portion of the wire extending from the feed opening adjacent to the first wire attach structure, and the wire is attached to the first attach structure. The capillary is moved with respect to the component along a wire feed path to feed the wire from the first wire attach structure to the second wire attach structure and to locate a second portion of the wire extending from the feed opening adjacent to the second attach structure. The wire is attached to the second wire attach structure, and cut from the supply.
    Type: Grant
    Filed: November 16, 2020
    Date of Patent: June 20, 2023
    Assignee: Hutchinson Technology Incorporated
    Inventors: Michael W. Davis, Bryan J. Scheele, Daniel W. Scheele, Andrew H. Ashwill, Matthew D. Crane
  • Patent number: 11674235
    Abstract: A method of plating a copper substrate with gold that reduces or eliminates the presence of microvoids at the interface of the gold/copper substrate is described. Suitably, live entry of the substrate into the plating bath is performed with application of external current to the bath such that no portion of the substrate is exposed to the bath for more than one second without the application of the external current. Increase of the applied current for gold strike to the mass-transfer-limit for gold reduction accomplishes the full measure of improvement in eliminating microvoids.
    Type: Grant
    Filed: March 27, 2019
    Date of Patent: June 13, 2023
    Assignee: Hutchinson Technology Incorporated
    Inventors: Douglas P. Riemer, Peter F. Ladwig