Patents Assigned to Incep Technologies
  • Apparatus for providing power to a microprocessor with integrated thermal and EMI management
    Patent number: 6452113
    Abstract: A microprocessor packaging architecture using a modular circuit board assembly that provides power to a microprocessor while also providing for integrated thermal and electromagnetic interference (EMI) is disclosed. The modular circuit board assembly comprises a substrate, having a component mounted thereon, a circuit board, including a circuit for supplying power to the component, and at least one conductive interconnect device disposed between the substrate and the circuit board, the conductive interconnect device configured to electrically couple the circuit to the component.
    Type: Grant
    Filed: February 16, 2001
    Date of Patent: September 17, 2002
    Assignee: INCEP Technologies, Inc.
    Inventors: Joseph Ted Dibene, II, David H. Hartke, James Hjerpe Kaskade, Carl E. Hoge
  • Method and apparatus for thermal and mechanical management of a power regulator module and microprocessor in contact with a thermally conducting plate
    Patent number: 6452804
    Abstract: A stack up assembly for supplying power and removing heat from a microprocessor while controlling electromagnetic emissions is disclosed. The stack up assembly comprises a VRM circuit board or power regulation module, having a first side and a second side; a thermally conductive plate such as a vapor plate having a first side and a second side, wherein the thermally conductive plate first side is thermally coupled to the second side of the VRM circuit board; and a microprocessor having a first side and a second side, the microprocessor first side thermally coupled to the vapor plate second side.
    Type: Grant
    Filed: March 8, 2001
    Date of Patent: September 17, 2002
    Assignee: INCEP Technologies, Inc.
    Inventors: Joseph T. Dibene, II, David H. Hartke
  • Inter-circuit encapsulated packaging
    Publication number: 20010038527
    Abstract: An encapsulated circuit assembly and a method for making an encapsulated circuit assembly are disclosed. The assembly comprises a first printed circuit board, a second printed circuit board, and a heat transfer device. The second printed circuit board comprises a heatsink, and the heat transfer device couples between a device mounted on the first printed circuit board and the second printed circuit board for transferring heat from the device to the heatsink of the second printed circuit board.
    Type: Application
    Filed: June 19, 2001
    Publication date: November 8, 2001
    Applicant: INCEP Technologies, Inc.
    Inventors: Joseph Ted DiBene, David Hartke
  • Inter-circuit encapsulated packaging
    Patent number: 6304450
    Abstract: An encapsulated circuit assembly and a method for making an encapsulated circuit assembly are disclosed. The assembly comprises a first printed circuit board, a second printed circuit board, and a heat transfer device. The second printed circuit board comprises a heatsink, and the heat transfer device couples between a device mounted on the first printed circuit board and the second printed circuit board for transferring heat from the device to the heatsink of the second printed circuit board.
    Type: Grant
    Filed: July 15, 1999
    Date of Patent: October 16, 2001
    Assignee: INCEP Technologies, Inc.
    Inventors: Joseph Ted Dibene, II, David Hartke