Patents Assigned to Intel Corporation
  • Publication number: 20240128181
    Abstract: Embodiments of a microelectronic assembly that includes: a package substrate comprising a plurality of layers of organic dielectric material and conductive traces alternating with conductive vias in alternate layers of the organic dielectric material; and a plurality of integrated circuit dies coupled to a first side of the package substrate by interconnects, in which: the plurality of layers of the organic dielectric material comprises at least a first layer having a conductive via and a second layer having a conductive trace in contact with the conductive via, the second layer is not coplanar with the first layer, sidewalls of the conductive via are orthogonal to the conductive trace, and two opposing sidewalls of the conductive via separated by a width of the conductive via protrude from respectively proximate edges of the conductive trace by a protrusion that is at least ten times less than the width of the conductive via.
    Type: Application
    Filed: October 17, 2022
    Publication date: April 18, 2024
    Applicant: Intel Corporation
    Inventors: Jeremy Ecton, Brandon C. Marin, Srinivas V. Pietambaram, Hiroki Tanaka, Haobo Chen
  • Publication number: 20240129804
    Abstract: For example, an Access Point (AP) may be configured to process network slicing information including slice identification information and Service Level Agreement (SLA) information, wherein the slice identification information is to identify one or more Quality of Service (QoS) network slices. For example, the AP may be configured to determine a configuration of one or more radio resource allocations to be assigned to the one or more QoS network slices, and to transmit a network slicing advertisement including network slicing assignment information to indicate an assignment of the one or more radio resource allocations to the one or more QoS network slices.
    Type: Application
    Filed: December 28, 2023
    Publication date: April 18, 2024
    Applicant: Intel Corporation
    Inventors: Roya Doostnejad, Ehud Reshef, Laurent Cariou
  • Publication number: 20240129058
    Abstract: For example, an apparatus may include a segment parser to parse scrambled data bits of a PPDU into a first plurality of data bits and a second plurality of data bits, the PPDU to be transmitted in an OFDM transmission over an aggregated bandwidth comprising a first channel in a first frequency band and a second channel in a second frequency band; a first baseband processing block to encode and modulate the first plurality of data bits according to a first OFDM MCS for transmission over the first channel in the first frequency band; and a second baseband block to encode and modulate the second plurality of data bits according to a second OFDM MCS for transmission over the second channel in the second frequency band.
    Type: Application
    Filed: October 17, 2023
    Publication date: April 18, 2024
    Applicant: INTEL CORPORATION
    Inventors: Alexander W. Min, Thomas J. Kenney, Laurent Cariou, Shahrnaz Azizi, Xiaogang Chen, Robert J. Stacey, Qinghua Li
  • Publication number: 20240129496
    Abstract: Methods, systems, and articles are described herein related to video coding. The method comprises receiving compressed image data of video frames including a block of image data of at least one of the frames. The method also comprises receiving first partition data to be used to decode the compressed image data and indicating a partition in the block. This method comprises detecting whether or not the block has an illegal block partition. Also, the method comprises generating second partition data to indicate the illegal block partition of the block is to be ignored. Further, the method includes decoding the block at least according to the second partition data.
    Type: Application
    Filed: December 28, 2023
    Publication date: April 18, 2024
    Applicant: Intel Corporation
    Inventor: Tsung-Han Yang
  • Publication number: 20240129503
    Abstract: Described herein is a data processing system having a multisample antialiasing compressor coupled to a texture unit and shader execution array. In one embodiment, the data processing system includes a memory device to store a multisample render target, the multisample render target to store color data for a set of sample locations of each pixel in a set of pixels; and general-purpose graphics processor comprising a multisample antialiasing compressor to apply multisample antialiasing compression to color data generated for the set of sample locations of a first pixel in the set of pixels and a multisample render cache to store color data generated for the set of sample locations of the first pixel in the set of pixels, wherein color data evicted from the multisample render cache is to be stored to the multisample render target.
    Type: Application
    Filed: October 23, 2023
    Publication date: April 18, 2024
    Applicant: Intel Corporation
    Inventors: Prasoonkumar Surti, Abhishek R. Appu, Michael J. Norris, Eric G. Liskay
  • Publication number: 20240129944
    Abstract: For example, a wireless communication device may be configured to determine an expected interference-based value corresponding to an Uplink (UL) transmission from a wireless communication station (STA) in a Trigger-Based (TB) Multi-User (MU) UL transmission to be communicated from a plurality of STAs to the wireless communication device; to determine one or more transmit (Tx) configuration parameters for the STA based on the expected interference-based value corresponding to the UL transmission from the STA; and to transmit a trigger frame to trigger the TB MU UL transmission, the trigger frame including the one or more Tx configuration parameters to configure the UL transmission from the STA.
    Type: Application
    Filed: December 28, 2023
    Publication date: April 18, 2024
    Applicant: INTEL CORPORATION
    Inventors: Alexander W. Min, Arik Klein, Rath Vannithamby, Ziv Avital
  • Patent number: 11960887
    Abstract: Techniques related to packing pieces of data having variable bit lengths to serial packed data using a graphics processing unit and a central processing unit are discussed. Such techniques include executing bit shift operations for the pieces of data in parallel via execution units of the graphics processing unit and packing the bit shifted pieces of data via the central processing unit.
    Type: Grant
    Filed: March 3, 2020
    Date of Patent: April 16, 2024
    Assignee: Intel Corporation
    Inventors: Bin Wang, Bo Peng
  • Patent number: 11962320
    Abstract: A semiconductor chip providing on-chip self-testing of an Analog-to-Digital Converter, ADC, implemented in the semiconductor chip is provided. The semiconductor chip comprises the ADC and a Digital-to-Analog Converter, DAC, configured to generate and supply a radio frequency test signal to the ADC via a supply path. The ADC is configured to generate digital output data based on the radio frequency test signal. The semiconductor chip further comprises a reference data generation circuit configured to generate digital reference data. Additionally, the semiconductor chip comprises a comparator circuit configured to compare the digital output data to the digital reference in order to determine error data.
    Type: Grant
    Filed: December 23, 2019
    Date of Patent: April 16, 2024
    Assignee: Intel Corporation
    Inventors: Kameran Azadet, Martin Clara, Daniel Gruber, Albert Molina, Hundo Shin
  • Patent number: 11962644
    Abstract: In one embodiment, an apparatus comprises circuitry, wherein the circuitry is configured to: receive, via a communications network, context information for a first set of one or more edge devices, wherein the context information identifies an operating environment of the first set of edge devices based on information from one or more sensors; receive, via the communications network, workload information for a second set of one or more edge devices; determine workload assignments for the first set of edge devices based on the context information for the first set of edge devices and based on the workload information for the second set of edge devices; and transmit, via the communications network, the workload assignments to the first set of edge devices.
    Type: Grant
    Filed: July 2, 2016
    Date of Patent: April 16, 2024
    Assignee: Intel Corporation
    Inventors: Katalin Klara Bartfai-Walcott, Hassnaa Moustafa
  • Patent number: 11957974
    Abstract: Described herein is a cloud-based gaming system in which graphics processing operations of a cloud-based game can be performed on a client device. Client-based graphics processing can be enabled in response to a determination that the client includes a graphics processor having a performance that exceeds a minimum threshold. When a game is remotely executed and streamed to a client, the client is configurable to provide network feedback that can be used to adjust execution and/or encoding for the game.
    Type: Grant
    Filed: February 5, 2021
    Date of Patent: April 16, 2024
    Assignee: Intel Corporation
    Inventors: Makarand Dharmapurikar, Rajabali Koduri, Vijay Bahirji, Toby Opferman, Scott G. Christian, Rajeev Penmatsa, Selvakumar Panneer
  • Patent number: 11963041
    Abstract: Various embodiments generally may relate to Load Balancing Optimization (LBO) and Mobility Robustness Optimization (MRO). Some embodiments of this disclosure are directed to the following 5G SON solutions: use cases and requirements for the management of distributed LBO and centralized LBO; procedures for the management of distributed LBO and centralized LBO; and management services and information needed to support the management of distributed LBO and centralized LBO.
    Type: Grant
    Filed: November 6, 2020
    Date of Patent: April 16, 2024
    Assignee: Intel Corporation
    Inventors: Joey Chou, Yizhi Yao
  • Patent number: 11960900
    Abstract: Technologies for fast boot-up of a compute device with error-correcting code (ECC) memory are disclosed. A basic input/output system (BIOS) of a compute device may assign memory addresses of the ECC memory to different processors on the compute device. The processors may then initialize the ECC memory in parallel by writing to the ECC memory. The processors may write to the ECC memory with direct-store operations that are immediately written to the ECC memory instead of being cached. The BIOS may continue to operation on one processor while the rest of the processors initialize the ECC memory.
    Type: Grant
    Filed: December 28, 2019
    Date of Patent: April 16, 2024
    Assignee: Intel Corporation
    Inventors: Murugasamy K. Nachimuthu, Rajat Agarwal, Mohan J. Kumar
  • Patent number: 11960429
    Abstract: Methods, apparatus, and computer platforms and architectures employing many-to-many and many-to-one peripheral switches. The methods and apparatus may be implemented on computer platforms having multiple nodes, such as those employing a Non-uniform Memory Access (NUMA) architecture, wherein each node comprises a plurality of components including a processor having at least one level of memory cache and being operatively coupled to system memory and operatively coupled to a many-to-many peripheral switch that includes a plurality of downstream ports to which NICs and/or peripheral expansion slots are operatively coupled, or a many-to-one switch that enables a peripheral device to be shared by multiple nodes. During operation, packets are received at the NICs and DMA memory writes are initiated using memory write transactions identifying a destination memory address.
    Type: Grant
    Filed: December 15, 2022
    Date of Patent: April 16, 2024
    Assignee: Intel Corporation
    Inventors: Patrick Connor, Matthew A. Jared, Duke C. Hong, Elizabeth M. Kappler, Chris Pavlas, Scott P. Dubal
  • Patent number: 11961804
    Abstract: An integrated circuit package is disclosed. The integrated circuit package includes a first integrated circuit die, a second integrated circuit die, an organic substrate, wherein both the first integrated circuit die and the second integrated circuit die are connected to the organic substrate, a multi-die interconnect bridge (EMIB) embedded within the organic substrate, and a termination resistor associated with a circuit in the first integrated circuit die, wherein the termination resistor is located within the multi-die interconnect bridge embedded within the organic substrate.
    Type: Grant
    Filed: October 28, 2020
    Date of Patent: April 16, 2024
    Assignee: Intel Corporation
    Inventors: Mathew J. Manusharow, Jonathan Rosenfeld
  • Patent number: 11960375
    Abstract: Processor trace systems and methods are described. For example, one embodiment comprises executing instrumented code by a compiler, the instrumented code including at least one call to un-instrumented code. The compiler can determine the at least one call to un-instrumented code is a next call to be executed. A resume tracing instruction can be inserted into the instrumented code prior to the at least one call to the un-instrumented code. The resume tracing instruction can be executed to selectively add processor tracing to the at least one call to the un-instrumented code, and the at least one call to the un-instrumented code can be executed.
    Type: Grant
    Filed: June 7, 2022
    Date of Patent: April 16, 2024
    Assignee: Intel Corporation
    Inventors: Michael Lemay, Beeman Strong
  • Patent number: 11961838
    Abstract: Embodiments of the disclosure are in the field of advanced integrated circuit structure fabrication and, in particular, 10 nanometer node and smaller integrated circuit structure fabrication and the resulting structures. In an example, an integrated circuit structure includes a first isolation structure over a first end of a fin. A gate structure is over the fin and is spaced apart from the first isolation structure along the direction. A second isolation structure is over a second end of the fin, the second end opposite the first end. The second isolation structure is spaced apart from the gate structure. The first isolation structure and the second isolation structure both comprise a first dielectric material laterally surrounding a recessed second dielectric material distinct from the first dielectric material. The recessed second dielectric material laterally surrounds at least a portion of a third dielectric material different from the first and second dielectric materials.
    Type: Grant
    Filed: May 3, 2022
    Date of Patent: April 16, 2024
    Assignee: Intel Corporation
    Inventors: Byron Ho, Chun-Kuo Huang, Erica Thompson, Jeanne Luce, Michael L. Hattendorf, Christopher P. Auth, Ebony L. Mays
  • Patent number: 11961836
    Abstract: An integrated circuit structure comprises one or more fins extending above a surface of a substrate over an N-type well. A gate is over and in contact with the one or more fins. A second shallow N-type doping is below the gate and above the N-type well.
    Type: Grant
    Filed: September 28, 2018
    Date of Patent: April 16, 2024
    Assignee: Intel Corporation
    Inventors: Hyung-Jin Lee, Mark Armstrong, Saurabh Morarka, Carlos Nieva-Lozano, Ayan Kar
  • Patent number: 11960896
    Abstract: Methods, systems and apparatuses may provide for technology that triggers an idle state in a first command streamer in response to a request to reset a second command streamer that shares graphics hardware with the first command streamer. The technology may also determine an event type associated with the request and conduct the request based on the event type.
    Type: Grant
    Filed: November 18, 2021
    Date of Patent: April 16, 2024
    Assignee: Intel Corporation
    Inventors: Harsh Chheda, Nishanth Reddy Pendluru, Joseph Koston, Eric R. Crawford
  • Patent number: 11960922
    Abstract: In an embodiment, a processor comprises: an execution circuit to execute instructions; at least one cache memory coupled to the execution circuit; and a table storage element coupled to the at least one cache memory, the table storage element to store a plurality of entries each to store object metadata of an object used in a code sequence. The processor is to use the object metadata to provide user space multi-object transactional atomic operation of the code sequence. Other embodiments are described and claimed.
    Type: Grant
    Filed: September 24, 2020
    Date of Patent: April 16, 2024
    Assignee: Intel Corporation
    Inventors: Joshua B. Fryman, Jason M. Howard, Ibrahim Hur, Robert Pawlowski
  • Patent number: 11963051
    Abstract: Disclosed embodiments provide a handover prediction scheme that is based on contextual awareness of a compute node, such as a mobile device. The contextual information is used to predict network availability in a predicted target location, which is an area that a compute node is likely to travel. The use of sensors embedded in or accessible by the compute node may be used to carry out aspects of the embodiments. A reinforcement learning recommendation model is used to determine an optimal network, radio access technology, and/or network access node to connect with ahead of arriving at the predicted target location at a predicted arrival time. Other embodiments are described and/or claimed.
    Type: Grant
    Filed: September 17, 2020
    Date of Patent: April 16, 2024
    Assignee: Intel Corporation
    Inventors: Ashwin Umapathy, Akshaya Ravishankar, Sanket Vinod Shingte