Patents Assigned to Intel Corporation
  • Patent number: 10707346
    Abstract: A high-voltage transistor structure is provided that includes a self-aligned isolation feature between the gate and drain. Normally, the isolation feature is not self-aligned. The self-aligned isolation process can be integrated into standard CMOS process technology. In one example embodiment, the drain of the transistor structure is positioned one pitch away from the active gate, with an intervening dummy gate structure formed between the drain and active gate structure. The dummy gate structure is sacrificial in nature and can be utilized to create a self-aligned isolation recess, wherein the gate spacer effectively provides a template for etching the isolation recess. This self-aligned isolation forming process eliminates a number of the variation and dimensional constraints attendant non-aligned isolation forming techniques, which in turn allows for smaller footprint and tighter alignment so as to reduce device variation.
    Type: Grant
    Filed: September 25, 2015
    Date of Patent: July 7, 2020
    Assignee: Intel Corporation
    Inventors: Walid M. Hafez, Chia-Hong Jan
  • Patent number: 10705846
    Abstract: Embodiments are disclosed for inserting profiling instructions into graphics processing unit (GPU) kernels. An example apparatus includes an entry point detector to detect a first entry point address and a second entry point address of an original GPU kernel. An instruction inserter is to create a corresponding instrumented GPU kernel from the original GPU kernel by adding instructions of the original GPU kernel and one or more profiling instructions to the instrumented GPU kernel. The instruction inserter is to insert, at the first entry point address of the instrumented GPU kernel, a first jump instruction to jump to first profiling initialization instructions, the instruction inserter to insert, at the second entry point address of the instrumented GPU kernel, a second jump instruction to jump to second profiling initialization instructions. The instruction inserter is to insert profiling measurement instructions of the profiling instructions into the instrumented GPU kernel.
    Type: Grant
    Filed: August 15, 2018
    Date of Patent: July 7, 2020
    Assignee: Intel Corporation
    Inventors: Konstantin Levit-Gurevich, Orr Goldman
  • Patent number: 10706496
    Abstract: Generally, this disclosure provides systems, devices, methods and computer readable media for implementing function callback requests between a first processor (e.g., a GPU) and a second processor (e.g., a CPU). The system may include a shared virtual memory (SVM) coupled to the first and second processors, the SVM configured to store at least one double-ended queue (Deque). An execution unit (EU) of the first processor may be associated with a first of the Deques and configured to push the callback requests to that first Deque. A request handler thread executing on the second processor may be configured to: pop one of the callback requests from the first Deque; execute a function specified by the popped callback request; and generate a completion signal to the EU in response to completion of the function.
    Type: Grant
    Filed: February 22, 2019
    Date of Patent: July 7, 2020
    Assignee: Intel Corporation
    Inventors: Brian T. Lewis, Rajkishore Barik, Tatiana Shpeisman
  • Patent number: 10707409
    Abstract: Techniques are disclosed for fabricating a self-aligned spin-transfer torque memory (STTM) device with a dot-contacted free magnetic layer. In some embodiments, the disclosed STTM device includes a first dielectric spacer covering sidewalls of an electrically conductive hardmask layer that is patterned to provide an electronic contact for the STTM's free magnetic layer. The hardmask contact can be narrower than the free magnetic layer. The first dielectric spacer can be utilized in patterning the STTM's fixed magnetic layer. In some embodiments, the STTM further includes an optional second dielectric spacer covering sidewalls of its free magnetic layer. The second dielectric spacer can be utilized in patterning the STTM's fixed magnetic layer and may serve, at least in part, to protect the sidewalls of the free magnetic layer from redepositing of etch byproducts during such patterning, thereby preventing electrical shorting between the fixed magnetic layer and the free magnetic layer.
    Type: Grant
    Filed: January 29, 2018
    Date of Patent: July 7, 2020
    Assignee: Intel Corporation
    Inventors: Charles C. Kuo, Kaan Oguz, Brian S. Doyle, Mark L. Doczy, David L. Kencke, Satyarth Suri, Robert S. Chau
  • Patent number: 10707168
    Abstract: An embedded multi-die interconnect bridge apparatus and method includes photolithographically formed interconnects coupled to laser-drilled interconnects. Several structures in the embedded multi-die interconnect bridge apparatus exhibit characteristic planarization during fabrication and assembly.
    Type: Grant
    Filed: November 6, 2018
    Date of Patent: July 7, 2020
    Assignee: Intel Corporation
    Inventors: Amruthavalli Pallavi Alur, Sri Ranga Sai Boyapati, Robert Alan May, Islam A. Salama, Robert L. Sankman
  • Patent number: 10705673
    Abstract: Systems, apparatuses and methods for technology that provides smart work spaces in ubiquitous computing environments. The technology may determine a task to be performed in a smart work space and perform task modeling, wherein the task modeling includes determining one or more user interfaces involved with the task. One or more placements may be determined for the one or more user interfaces based on one or more ergonomic conditions, an incidence of an interaction, and a length of time of interaction. The technology may position the one or more user interfaces into the smart work space in accordance with the determined one or more placements.
    Type: Grant
    Filed: September 30, 2017
    Date of Patent: July 7, 2020
    Assignee: Intel Corporation
    Inventors: Glen J. Anderson, Giuseppe Raffa, Sangita Sharma, Carl S. Marshall, Meng Shi, Selvakumar Panneer
  • Patent number: 10706242
    Abstract: In various embodiments, an RFID Antenna/Tag Location Configuration device (RLC) may facilitate placement of one or more RFID antennas in a physical space. The RLC may collect RFID data from tags determine which of the RFID antennas need to be relocated. The RLC may determine, based on collected RFID data, whether each antenna is a dominant antenna and/or has a substantial read rate. If an antenna is not dominant and/or does not exhibit a substantial read-rate, the RLC ma indicate that the antenna should be relocated. The RLC may also be configured to filter collected RFID data prior to using the data for determination of antennas. The RLC may also determine, using the RFID antennas, a physical location of RFID tags in the physical space using detected signal strength for RFID tags. Additional embodiments may be described and/or claimed.
    Type: Grant
    Filed: June 30, 2016
    Date of Patent: July 7, 2020
    Assignee: Intel Corporation
    Inventors: Michael Wu, Addicam V. Sanjay, Daniel Gutwein, Hoang Tran Van, Kalpana Algotar
  • Patent number: 10707997
    Abstract: Methods and devices are provided to recover a robust management channel (RMC) in a first communication direction using a robust management channel recovery message (RMCR) sent via the RMC in a second communication direction.
    Type: Grant
    Filed: May 2, 2017
    Date of Patent: July 7, 2020
    Assignee: Intel Corporation
    Inventors: Dietmar Schoppmeier, Vladimir Oksman
  • Patent number: 10707846
    Abstract: Described is an apparatus which comprises: a first p-type Tunneling Field-Effect Transistor (TFET); a first n-type TFET coupled in series with the first p-type TFET; a first node coupled to gate terminals of the first p-type and n-type TFETs; a first clock node coupled to a source terminal of the first TFET, the first clock node is to provide a first clock; and a second clock node coupled to a source terminal of the second TFET, the second clock node is to provide a second clock.
    Type: Grant
    Filed: May 29, 2018
    Date of Patent: July 7, 2020
    Assignee: Intel Corporation
    Inventors: Daniel H. Morris, Uygar E. Avci, Ian A. Young
  • Patent number: 10706162
    Abstract: A device and method for provided access to distributed data sources includes a cloud security server configured to associate any number of data sources and client devices with a cloud security server account. The cloud security server assigns trust levels to the data sources and the client devices. A client device requests data from the cloud security server. The cloud security server authenticates the client device and verifies the trust levels of the client device and the requested data. If verified, the cloud security server brokers a connection between the client device and the data source, and the client device accesses the requested data. Data sources may include cloud service providers and local storage devices. The cloud security server may assign a trust level to a client device for a limited time or revoke a trust level assigned to a client device. Other embodiments are described and claimed.
    Type: Grant
    Filed: November 29, 2016
    Date of Patent: July 7, 2020
    Assignee: Intel Corporation
    Inventors: Manish Dave, Vishwa Hassan, Bhaskar D. Gowda, Mrigank Shekhar
  • Patent number: 10706004
    Abstract: In one embodiment, a processor includes a plurality of cores each including a first storage to store a physical identifier for the core and a second storage to store a logical identifier associated with the core; a plurality of thermal sensors to measure a temperature at a corresponding location of the processor; and a power controller including a dynamic core identifier logic to dynamically remap a first logical identifier associated with a first core to associate the first logical identifier with a second core, based at least in part on a temperature associated with the first core, the dynamic remapping to cause a first thread to be migrated from the first core to the second core transparently to an operating system. Other embodiments are described and claimed.
    Type: Grant
    Filed: November 14, 2017
    Date of Patent: July 7, 2020
    Assignee: Intel Corporation
    Inventors: Ankush Varma, Krishnakanth V. Sistla, Guy G. Sotomayor, Andrew D. Henroid, Robert E. Gough, Tod F. Schiff
  • Patent number: 10706164
    Abstract: Apparatuses for computing are disclosed herein. In embodiments, an apparatus may include one or more processors, a memory, and a compiler to be operated by the one or more processors to compile a computer program. The compiler may include one or more analyzers to parse and analyze source code of the computer program that generates pointers or de-references pointers. The compiler may also include a code generator coupled to the one or more analyzers to generate executable instructions for the source code of the computer program including insertion of additional encryption or decryption executable instructions into the computer program, based at least in part on a result of the analysis, to authenticate memory access operations of the source code.
    Type: Grant
    Filed: September 29, 2017
    Date of Patent: July 7, 2020
    Assignee: Intel Corporation
    Inventors: Michael LeMay, David D. Durham, Mingwei Zhang, Vedvyas Shanbhogue
  • Patent number: 10707319
    Abstract: A method of manufacturing a semiconductor device and a novel semiconductor device are disclosed herein. An exemplary method includes sputtering a capping layer in-situ on a gate dielectric layer, before any high temperature processing steps are performed. The method includes depositing a dielectric layer on a substrate, followed by deposition of a capping layer in-situ over the dielectric layer prior to any high temperature processing.
    Type: Grant
    Filed: March 10, 2016
    Date of Patent: July 7, 2020
    Assignee: Intel Corporation
    Inventors: Gilbert Dewey, Mark L. Doczy, Suman Datta, Justin K. Brask, Matthew V. Metz
  • Patent number: 10708187
    Abstract: Methods, apparatus and software for implementing enhanced data center congestion management for non-TCP traffic. Non-congested transit latencies are determined for transmission of packets or Ethernet frames along paths between source and destination end-end-nodes when congestion along the paths is not present or minimal. Transit latencies are similarly measured along the same source-destination paths during ongoing operations during which traffic congestion may vary. Based on whether a difference between the transit latency for a packet or frame and the non-congested transit latency for the path exceeds a threshold, the path is marked as congested or not congested. A rate at which the non-TCP packets are transmitted along the path is then managed as function of a rate at which the path is marked as congested.
    Type: Grant
    Filed: May 22, 2014
    Date of Patent: July 7, 2020
    Assignee: Intel Corporation
    Inventors: Ygdal Naouri, Robert O. Sharp, Kenneth G. Keels, Eric W. Multanen
  • Patent number: 10707901
    Abstract: Examples include techniques for improving low-density parity check decoder performance for a binary asymmetric channel in a multi-die scenario. Examples include logic for execution by circuitry to decode an encoded codeword of data received from a memory having a plurality of dies, bits of the encoded codeword stored across the plurality of dies, using predetermined log-likelihood ratios (LLRs) to produce a decoded codeword, return the decoded codeword when the decoded codeword is correct, and repeat the decoding using the predetermined LLRs when the decoded codeword is not correct, up to a first number of times when the decoded codeword is not correct.
    Type: Grant
    Filed: January 8, 2019
    Date of Patent: July 7, 2020
    Assignee: Intel Corporation
    Inventors: Poovaiah M Palangappa, Ravi H. Motwani, Santhosh K. Vanaparthy
  • Patent number: 10705964
    Abstract: In one embodiment, a processor includes a control logic to determine whether to enable an incoming data block associated with a first priority to displace, in a cache memory coupled to the processor, a candidate victim data block associated with a second priority and stored in the cache memory, based at least in part on the first and second priorities, a first access history associated with the incoming data block and a second access history associated with the candidate victim data block. Other embodiments are described and claimed.
    Type: Grant
    Filed: April 28, 2015
    Date of Patent: July 7, 2020
    Assignee: Intel Corporation
    Inventors: Kshitij A. Doshi, Christopher J. Hughes
  • Patent number: 10707171
    Abstract: Embodiments of the invention include molded modules and methods for forming molded modules. According to an embodiment the molded modules may be integrated into an electrical package. Electrical packages according to embodiments of the invention may include a die with a redistribution layer formed on at least one surface. The molded module may be mounted to the die. According to an embodiment, the molded module may include a mold layer and a plurality of components encapsulated within the mold layer. Terminals from each of the components may be substantially coplanar with a surface of the mold layer in order to allow the terminals to be electrically coupled to the redistribution layer on the die. Additional embodiments of the invention may include one or more through mold vias formed in the mold layer to provide power delivery and/or one or more faraday cages around components.
    Type: Grant
    Filed: December 22, 2015
    Date of Patent: July 7, 2020
    Assignee: Intel Corporation
    Inventors: Tomita Yoshihiro, Eric J. Li, Shawna M. Liff, Javier A. Falcon, Joshua D. Heppner
  • Patent number: 10706318
    Abstract: Methods, apparatus, systems, and articles of manufacture are disclosed to improve robot object recognition. An example apparatus includes a visual object recognizer to obtain a visual identifier associated with a target object, and a recognizable object model generator to generate a model of the target object based on mapping an image of the target object to classifier information corresponding to the visual identifier.
    Type: Grant
    Filed: December 12, 2017
    Date of Patent: July 7, 2020
    Assignee: INTEL CORPORATION
    Inventor: Oleg Pogorelik
  • Patent number: 10708093
    Abstract: Some embodiments include apparatus and methods using a first latch in a decision feedback equalizer (DFE), a second latch in the DFE, and circuitry coupled to the first and second latches. The second latch includes a first input node coupled to an output node of the first latch. The circuitry includes a first input node coupled to the first output node, a second input node coupled to a second output node of the second latch, and an output node to provide information having a first output value based on first values of information at the first and second output nodes and a second output value based on second values of information at the first and second output nodes.
    Type: Grant
    Filed: August 24, 2018
    Date of Patent: July 7, 2020
    Assignee: Intel Corporation
    Inventors: Shenggao Li, Ji Chen
  • Patent number: 10708247
    Abstract: Technologies for providing secure utilization of tenant keys include a compute device. The compute device includes circuitry configured to obtain a tenant key. The circuitry is also configured to receive encrypted data associated with a tenant. The encrypted data defines an encrypted image that is executable by the compute device to perform a workload on behalf of the tenant in a virtualized environment. Further, the circuitry is configured to utilize the tenant key to decrypt the encrypted data and execute the workload without exposing the tenant key to a memory that is accessible to another workload associated with another tenant.
    Type: Grant
    Filed: September 27, 2018
    Date of Patent: July 7, 2020
    Assignee: Intel Corporation
    Inventors: Kapil Sood, Seosamh O'Riordain, Ned M. Smith, Tarun Viswanathan