Patents Assigned to Invensense Inc.
  • Patent number: 11686804
    Abstract: A method, system and computer readable medium for Ultrasound contact tracing comprising receiving one or more advertise messages determining a base station from the one or more advertise messages wherein the base station generates a broadcast order from at least the one or more advertise messages. A broadcast order is determined and an ultrasound message is sent according to the broadcast order. A detection period for ultrasound messages is initiated according to the broadcast order and a user may be notified of a detected ultrasound message.
    Type: Grant
    Filed: March 29, 2021
    Date of Patent: June 27, 2023
    Assignee: InvenSense, Inc.
    Inventors: Richard J. Przybyla, Sebastien Riccardi, Benoît Lachal
  • Patent number: 11682228
    Abstract: An ultrasonic sensor includes a two-dimensional array of ultrasonic transducers, wherein the two-dimensional array of ultrasonic transducers is substantially flat, a contact layer having a non-uniform thickness overlying the two-dimensional array of ultrasonic transducers, and an array controller configured to control activation of ultrasonic transducers during an imaging operation. During the imaging operation, the array controller is configured to control a transmission frequency of activated ultrasonic transducers during the imaging operation, wherein a plurality of transmission frequencies are used during the imaging operation to account for an impact of an interference pattern caused by the non-uniform thickness of the contact layer, and is configured to capture at least one fingerprint image using the plurality of transmission frequencies.
    Type: Grant
    Filed: November 12, 2021
    Date of Patent: June 20, 2023
    Assignee: InvenSense, Inc.
    Inventors: Quy Chau, Mei-Lin Chan
  • Patent number: 11680798
    Abstract: A micro electro-mechanical system (MEMS) gyroscope may include a suspended spring-mass system, and processing circuitry configured to receive a drive sense signal and a proof mass sense signal generated by the spring-mass system. The processing circuitry may be configured to derive a drive velocity in-phase signal from a drive displacement in-phase signal and to derive a drive velocity quadrature signal from a drive displacement quadrature signal. A compensated in-phase signal and a compensated quadrature signal may be determined based upon at least the drive displacement in-phase signal, the drive displacement quadrature signal, the drive velocity in-phase signal, the drive velocity quadrature signal, the sense displacement in-phase signal, and the sense displacement quadrature signal.
    Type: Grant
    Filed: July 27, 2021
    Date of Patent: June 20, 2023
    Assignee: InvenSense, Inc.
    Inventor: Vito Avantaggiati
  • Patent number: 11673165
    Abstract: A Piezoelectric Micromachined Ultrasonic Transducer (PMUT) device is provided. The PMUT includes a substrate and an edge support structure connected to the substrate. A membrane is connected to the edge support structure such that a cavity is defined between the membrane and the substrate, where the membrane is configured to allow movement at ultrasonic frequencies. The membrane includes a piezoelectric layer and first and second electrodes coupled to opposing sides of the piezoelectric layer. The PMUT is also configured to operate in a Surface Acoustic Wave (SAW) mode. Also provided are an integrated MEMS array, a method for operating an array of PMUT/SAW dual-mode devices, and a PMUT/SAW dual-mode device.
    Type: Grant
    Filed: February 3, 2017
    Date of Patent: June 13, 2023
    Assignee: InvenSense, Inc.
    Inventor: Michael Daneman
  • Patent number: 11661332
    Abstract: Methods and systems for reducing stiction through roughening the surface and reducing the contact area in MEMS devices are disclosed. A method includes fabricating bumpstops on a surface of a MEMS device substrate to reduce stiction. Another method is directed to applying roughening etchant to a surface of a silicon substrate to enhance roughness after cavity etch and before removal of hardmask. Another embodiment described herein is directed to a method to reduce contact area between proof mass and UCAV (“upper cavity”) substrate surface with minimal impact on the cavity volume by introducing a shallow etch process step and maintaining high pressure in accelerometer cavity. Another method is described as to increasing the surface roughness of a UCAV substrate surface by depositing a rough layer (e.g. polysilicon) on the surface of the substrate and etching back the rough layer to transfer the roughness.
    Type: Grant
    Filed: February 19, 2020
    Date of Patent: May 30, 2023
    Assignee: InvenSense, Inc.
    Inventors: Daesung Lee, Ian Flader, Alan Cuthbertson, Emad Mehdizadeh
  • Patent number: 11655139
    Abstract: A device includes a micro-electromechanical system (MEMS) device layer comprising a proof mass. The proof mass includes a first proof mass portion and a second proof mass portion. The first proof mass portion is configured to move in response to a stimuli. The second proof mass portion has a spring attached thereto. The device further includes a substrate disposed parallel to the MEMS device layer. The substrate comprises a bumpstop configured to limit motion of the first proof mass portion. The device includes a first electrode disposed on the substrate facing the second proof mass portion. The first electrode is configured to apply a pulling force onto the second proof mass portion and to move the second proof mass portion towards the first electrode.
    Type: Grant
    Filed: July 10, 2020
    Date of Patent: May 23, 2023
    Assignee: InvenSense, Inc.
    Inventor: Ian Flader
  • Publication number: 20230152433
    Abstract: A robotic cleaning appliance includes a housing to which is coupled a surface treatment item and a sensor assembly with first and second transducers and an acoustic interface. The first sonic transducer transmits sonic signals through an acoustic interface and out of a first acoustic opening toward a surface beneath the robotic cleaning appliance. The sonic signals reflect from the surface as corresponding returned signals received by the second sonic transducer via a second acoustic opening port of the acoustic interface. A first plurality of annular rings is defined in the external surface around the first acoustic opening port and a second plurality of annular rings is defined in the external surface around the second acoustic opening port. The pluralities of annular rings attenuate direct path echoes from a subset of the transmitted sonic signals which attempt to travel across the external surface to the second acoustic opening port.
    Type: Application
    Filed: November 15, 2022
    Publication date: May 18, 2023
    Applicant: InvenSense, Inc.
    Inventors: Tony LEI, Joe Youssef, Daniela Hall, Ben Eovino, Stefon Shelton
  • Publication number: 20230152434
    Abstract: A robotic cleaning appliance includes a housing to which is coupled a surface treatment item and a sensor assembly with first and second transducers and an acoustic interface. The first sonic transducer transmits sonic signals through an acoustic interface and out of a first acoustic opening toward a surface beneath the robotic cleaning appliance. The sonic signals reflect from the surface as corresponding returned signals received by the second sonic transducer via a second acoustic opening port of the acoustic interface. A first annular ring is defined around the first acoustic opening port and a second annular rings is defined around the second acoustic opening port. The annular ring attenuate direct path echoes between the acoustic opening ports. The first and second acoustic opening ports are coupled the first and sonic transducers, respectively, via first and second horns; and the horns are tilted from orthogonal with the surface.
    Type: Application
    Filed: November 15, 2022
    Publication date: May 18, 2023
    Applicant: InvenSense, Inc.
    Inventors: Daniela HALL, Tony LEI, Zhongyang LI, Joe YOUSSEF
  • Patent number: 11650078
    Abstract: A MEMS device may output a signal during operation that may include an in-phase component and a quadrature component. An external signal having a phase that corresponds to the quadrature component may be applied to the MEMS device, such that the MEMS device outputs a signal having a modified in-phase component and a modified quadrature component. A phase error for the MEMS device may be determined based on the modified in-phase component and the modified quadrature component.
    Type: Grant
    Filed: May 26, 2022
    Date of Patent: May 16, 2023
    Assignee: InvenSense, Inc.
    Inventors: Doruk Senkal, Houri Johari-Galle, Joseph Seeger
  • Patent number: 11651611
    Abstract: A mobile device including a processor, a memory unit, a display device disposed on a first surface of the mobile device, and a fingerprint sensor disposed on a second surface of the mobile device, wherein the second surface is a curved surface having a curvature such that the fingerprint sensor is curved to match the curvature of the curved surface.
    Type: Grant
    Filed: October 2, 2019
    Date of Patent: May 16, 2023
    Assignee: InvenSense, Inc.
    Inventor: Julius Ming-Lin Tsai
  • Patent number: 11635840
    Abstract: In a method for determining touch applied to an electronic device, ultrasonic signals are emitted from an ultrasonic sensor. A plurality of reflected ultrasonic signals from a finger interacting with the ultrasonic sensor is captured. A first data based at least in part on a first reflected ultrasonic signal of the plurality of reflected ultrasonic signals is compared with a second data based at least in part on a second reflected ultrasonic signal of the plurality of reflected ultrasonic signals. A signal change due to a change in a feature of the finger during a touch interaction with the ultrasonic sensor is determined based on differences between the first data and the second data. A touch applied by the finger to the electronic device is determined based at least in part on the signal change due to the change in the feature of the finger.
    Type: Grant
    Filed: June 28, 2021
    Date of Patent: April 25, 2023
    Assignee: InvenSense, Inc.
    Inventors: Eitan Medina, Behrooz Abdi, Sam Massih, Romain Fayolle, Hao-Yen Tang
  • Patent number: 11637537
    Abstract: Exemplary multipath digital microphones described herein can comprise exemplary embodiments of automatic gain control and multipath digital audio signal digital signal processing chains, which allow low power and die size to be achieved as described herein, while still providing a high DR digital microphone systems. Further non-limiting embodiments can facilitate switching between multipath digital audio signal digital signal processing chains while minimizing audible artifacts associated with either the change in the gain automatic gain control amplifiers switching between multipath digital audio signal digital signal processing chains.
    Type: Grant
    Filed: July 24, 2020
    Date of Patent: April 25, 2023
    Assignee: INVENSENSE, INC.
    Inventors: Igor Mucha, Michael Perrott
  • Patent number: 11632639
    Abstract: A device includes a micro-electromechanical system (MEMS) element configured to sense acoustic signals. The device also includes a circuitry configured to enable the microphone element to sense the acoustic signals. The circuitry is further configured to disable the microphone element to prevent the microphone element to sense the acoustic signals. It is appreciated that the circuitry is further configured to apply a test signal to the MEMS element when the microphone element is disabled. The microphone element outputs a signal in response to the test signal to the circuitry. The circuitry in response to the output signal with a first value determines that a diaphragm of the MEMS element is nonoperational and the circuitry in response to the output signal with a second value determines that the diaphragm of the MEMS element is operational.
    Type: Grant
    Filed: February 25, 2022
    Date of Patent: April 18, 2023
    Assignee: InvenSense, Inc.
    Inventors: Marek Matej, Stefano Riva
  • Patent number: 11623246
    Abstract: A piezoelectric micromachined ultrasound transducer (PMUT) device may include a plurality of layers including a structural layer, a piezoelectric layer, and electrode layers located on opposite sides of the piezoelectric layer. Conductive barrier layers may be located between the piezoelectric layer and the electrodes to the prevent diffusion of the piezoelectric layer into the electrode layers.
    Type: Grant
    Filed: February 7, 2019
    Date of Patent: April 11, 2023
    Assignee: INVENSENSE, INC.
    Inventors: Emad Mehdizadeh, Bongsang Kim, Chienliu Chang, Leonardo Baldasarre, Nikhil Apte, Xiaoyue Jiang, Mei-Lin Chan
  • Patent number: 11626099
    Abstract: In a method for transmit beamforming of a two-dimensional array of ultrasonic transducers, a beamforming pattern to apply to a beamforming space of the two-dimensional array of ultrasonic transducers is defined. The beamforming space includes a plurality of elements, where each element of the beamforming space corresponds to an ultrasonic transducer of the two-dimensional array of ultrasonic transducers, where the beamforming pattern identifies which ultrasonic transducers within the beamforming space are activated during a transmit operation of the two-dimensional array of ultrasonic transducers, such that a generated ultrasonic beam is focused for reflecting from an object in contact with a contact surface of a platen overlying the two-dimensional array of ultrasonic transducers. The beamforming pattern is applied to the two-dimensional array of ultrasonic transducers. A transmit operation is performed by activating the ultrasonic transducers of the beamforming space according to the beamforming pattern.
    Type: Grant
    Filed: July 6, 2020
    Date of Patent: April 11, 2023
    Assignee: InvenSense, Inc.
    Inventors: Bruno W. Garlepp, James Christian Salvia, Yang Pan, Michael H. Perrott
  • Publication number: 20230104773
    Abstract: A hearable comprises a wearable structure including a speaker, a sensor, and a temperature compensating circuit which measures temperature in an environment of the sensor. A portion of the wearable structure, which includes the sensor and temperature compensating circuit, is disposed within a user’s ear when in use. A sensor processing unit which is communicatively coupled with the temperature compensating circuit: acquires temperature data from the temperature compensating circuit while the portion of the wearable structure is disposed within the ear of the user; builds a baseline model of normal temperature for the user; and compares a temperature measurement acquired from the temperature compensating circuit to the baseline model. In response to the comparison showing a deviation beyond a preset threshold from the baseline model, the sensor processing unit generates a health indicator for the user which is used to monitor an aspect of health of the user.
    Type: Application
    Filed: December 2, 2022
    Publication date: April 6, 2023
    Applicant: InvenSense, Inc.
    Inventors: Ilya GURIN, Karthik Katingari, Nicolas Sauvage, Jibran Ahmed
  • Patent number: 11619492
    Abstract: Methods and systems for compensation of a microelectromechanical system (MEMS) sensor may include associating test temperature values with input test signal values, identifying temperature-input signal pairs, and applying one of the test temperature values and one of the test signal values to the MEMS sensor. Desired output signal values may be determined, with each of the desired output signal values corresponding to one of the applied temperature-input signal pairs. Measured output signal values from the MEMS sensor may be measured, with each of the measured output signal values corresponding to one of the applied temperature-input signal pairs. Compensation terms may be determined based on the plurality of temperature-input signal pairs, the corresponding plurality of measured output signal values, and the corresponding plurality of desired output signal values. Compensation terms may be used to modify a sense signal of the MEMS sensor.
    Type: Grant
    Filed: June 10, 2021
    Date of Patent: April 4, 2023
    Assignee: InvenSense, Inc.
    Inventor: Vito Avantaggiati
  • Patent number: 11618674
    Abstract: A method including fusion bonding a handle wafer to a first side of a device wafer. The method further includes depositing a hardmask on a second side of the device wafer, wherein the second side is planar. An etch stop layer is deposited over the hardmask and an exposed portion of the second side of the device wafer. A dielectric layer is formed over the etch stop layer. A via is formed within the dielectric layer. The via is filled with conductive material. A eutectic bond layer is formed over the conductive material. Portions of the dielectric layer uncovered by the eutectic bond layer is etched to expose the etch stop layer. The exposed portions of the etch stop layer is etched. A micro-electro-mechanical system (MEMS) device pattern is etched into the device wafer.
    Type: Grant
    Filed: March 8, 2021
    Date of Patent: April 4, 2023
    Assignee: InvenSense, Inc.
    Inventors: Daesung Lee, Alan Cuthbertson
  • Publication number: 20230068608
    Abstract: A retinal projection display system includes at least one visible light source for projecting a visible light image, an infrared light source for projecting infrared light, a scanning mirror having a field of view larger than the visible light image, a reflective surface on which the visible light image is projected and on which the infrared light is reflected at least partially towards an eye of a user, wherein the reflective surface is larger than the visible light image, at least one infrared photodetector for receiving reflected infrared light that reflects off of the eye of the user, and a hardware computation module comprising a processor and a memory, the hardware computation module configured to determine a gaze direction of the user based at least in part on the reflected infrared light.
    Type: Application
    Filed: August 26, 2022
    Publication date: March 2, 2023
    Applicant: InvenSense, Inc.
    Inventors: Ardalan HESHMATI, Hideaki FUKUZAWA
  • Publication number: 20230067383
    Abstract: An ultrasonic transducer array including a substrate, a membrane overlying the substrate, the membrane configured to allow movement at ultrasonic frequencies, and a plurality of anchors connected to the substrate and connected to the membrane. The membrane includes a piezoelectric layer, a plurality of first electrodes, and a plurality of second electrodes, wherein each ultrasonic transducer of a plurality of ultrasonic transducers includes at least a first electrode and at least a second electrode. The plurality of anchors includes a first anchor including a first electrical connection for electrically coupling at least one first electrode to control circuitry and a second anchor including a second electrical connection for electrically coupling at least one second electrode. The ultrasonic transducer array could be either a two-dimensional array or a one-dimensional array of ultrasonic transducers.
    Type: Application
    Filed: August 24, 2022
    Publication date: March 2, 2023
    Applicant: InvenSense, Inc.
    Inventors: Leonardo BALDASARRE, Alessandro COLOMBO, Federica CONFALONIERI, Marco TRAVAGLIATI