Abstract: Disclosed is a probe card ease for accommodating a probe card. The probe card case includes: a first case member configured to mount the probe card at a predetermined position therein; a second case member configured to be fitted to a top side of the first case member, and including a card fixing mechanism for fixing the probe card; and a case fixing mechanism configured to fix the first case member and the second case member. The probe card is capable of being transferred in a state where the probe card is accommodated in the probe card case and the first case member and the second case member are fixed, and the probe card is capable of being transferred only with the second case member in a state where the probe card is fixed to the second case member.

Abstract: Disclosed is a probe card case for accommodating a probe card. The probe card case includes: a first case member configured to mount the probe card at a predetermined position therein; a second case member configured to be fitted to a top side of the first case member, and including a card fixing mechanism for fixing the probe card; and a case fixing mechanism configured to fix the first case member and the second case member. The probe card is capable of being transferred in a state where the probe card is accommodated in the probe card case and the first case member and the second case member are fixed, and the probe card is capable of being transferred only with the second case member in a state where the probe card is fixed to the second case member.

Abstract: It is aimed to provide a probe card test system and a relay driving test method for probe cards which can automatically and continuously perform tests without bringing needle tips into contact with a number of relays mounted on a probe card and by using a device. In a probe card test system for testing a probe card using a tester, the probe card includes a substrate having a first probe and a first relay connected to the first probe, a relay controller for the first relay and a first measurement channel for connecting the first relay and the first probe to the tester are further provided on the substrate. The tester includes a DC power supply, a control board for controlling the relay controller for the first relay, and a first measurement circuit connected to the first measurement channel, the DC power supply and a voltmeter. The first measurement circuit includes a first resistor having a predetermined time constant and a first changeover switch to be connected to the first measurement channel.

Abstract: A multilayer insulating substrate with excellent electrical characteristics and a method for manufacturing the multilayer insulating substrate.

Abstract: [PROBLEMS] To provide an optical device inspecting apparatus which can be set to take many objects at one time more freely compared with conventional apparatuses, and furthermore, can accurately inspect even an optical device wherein an optical sensor is offset from a microlens. [MEANS FOR SOLVING PROBLEMS] Provided is an optical device inspecting apparatus having a probe card unit and a lens unit. The probe card unit is provided with a main substrate, a guide plate and a probe. Openings are made on the main substrate and the guide plate. The guide plate is fixed at a prescribed position from the main substrate, and is provided with a plurality of probe inserting holes. The probe is inserted into the probe inserting hole on the guide plate and fixed. The leading end portion of the probe protruding from the inserting hole has a shape of a cantilever.

Abstract: It is aimed to provide a semiconductor test system and a relay driving test method therefor which can automatically and continuously perform tests without bringing needle tips into contact with a number of relays mounted on a probe card and by using a device. In a semiconductor test system with a probe card and a tester, the probe card includes a substrate having a probe and a relay connected to the probe, a relay controller for the relay and a first measurement channel for connecting the relay and the probe to the tester are further provided on the substrate. The tester includes a DC power supply, a control board for controlling the relay controller, and a first circuit connected to the first measurement channel, the DC power supply and a voltmeter. The first measurement circuit includes a first resistor having a predetermined time constant and a first changeover switch to be connected to measurement channel.

Abstract: Probe card for examining semiconductor devices on semiconductor wafers that allows the members configuring the probe card to be easily separated and assembled, prevents the occurrence of electrical conduction failure between electrodes and achieves high electrical contact and high reliability. The probe card is used for measuring electrical properties of a measuring object and includes a space transformer including a plurality of contacts contacting an electrode pad of the measuring object on one surface and a plurality of connecting pins on a surface opposite the surface with the contact, a main substrate including a plurality of first connecting electrodes contacting an electrode pad of measuring equipment, and a sub-substrate including a plurality of through-holes, through which the connecting pin is inserted between the main substrate and the space transformer, for electrically conducting with the first connecting electrode, where the sub-substrate and the main substrate are coupled together.

Abstract: To enable a probe to be applied to a probe card for use in inspecting the IC chip having a fine pitch such as 100 &mgr;m, for example, as a pitch size between the electrodes by improving the probe for the probe card having a bare wire structure made of palladium alloy and the probe for the probe card having a bare wire structure made of beryllium copper alloy. There is provided a probe for the probe card characterized in that the same is comprised of a structure where either nickel plating or nickel alloy plating is applied to the surface of the core material made of either palladium alloy or beryllium copper alloy. In addition, there is provided a probe for the probe card having a structure where either nickel plating or nickel alloy plating is applied to the surface of the core material made of either palladium alloy or beryllium copper alloy and further the wire drawing with the wire drawing dies is applied to it.

Abstract: A method of reforming a tungsten probe tip includes forming a non-oxidizing metallic film on the surface of the tungsten probe tip, heating the film in a non-oxidizing atmosphere or vacuum, and diffusing the film into the tungsten probe tip. The non-oxidizing metallic film can be formed from a metal such as gold, platinum, rhodium, palladium, and iridium. The reformed tungsten probe tip can be used in low voltage and low current testing, and has excellent abrasion resistance, conductivity and oxidation resistance.

Abstract: The invention provides a novel antibacterial compound and a process for producing it. Futhermore, the invention provides a novel antibacterial polymer composite comprising a polymer and the antimicrobial compositon.

Abstract: A probe card includes a printed circuit plate having an aperture at the center thereof and a ring fixed around said aperture on either side of the plate. The ring is adapted to support probe needles in radial arrays with respect to the aperture. Each of the arrays has a multilayer of probe needles which have their terminal tips aligned on a plane in parallel with the plate and their opposite terminal ends connected to the printed circuit for external connection.