Abstract: A bonding method involving detection of non-bonding of a bonding wire to a first bonding point, the method including an electrical non-bonding detection step and an optical non-bonding detection step, wherein data on whether the respective first bonding points are predetermined bonding points where an electrical non-bonding detection is not applicable are acquired from a memory unit; and when it is determined that a first bonding point is the predetermined bonding point, a non-bonding verification on the first bonding point is executed in the optical non-bonding detection step, and when the first bonding point is not the predetermined bonding point, then non-bonding detection on the first bonding point is executed in the electrical non-bonding detection step.

Abstract: A wire bonding apparatus including a bonding control section provided with an electrical non-bonding detector, an optical non-bonding detector, and an optical shape detector, which are for detecting non-bonding between a first bonding point and a bonding wire; and when non-bonding is detected by the electrical non-bonding detector and non-bonding is also detected by the optical non-bonding detector, then the tip end of the bonding wire is reformed by, based on the shape of the tip end of the bonding wire detected by the optical shape detector, a ball formation device into a ball of a prescribed shape, and rebonding is performed at the first bonding point.

Abstract: A wire bonding method that connects a first bonding point and a second bonding point by a wire, the method including a step that press-bonds a ball formed on a tip end of a wire to a first bonding point, thus forming a press-bonded ball; a step that slightly raises a capillary, moves the capillary toward a second bonding point and then lowers the capillary by an amount that is smaller than an amount in which the capillary was raised, and a step that raises the capillary to allow the wire to be paid out of the capillary and moves the capillary toward a second bonding point, thus connecting the wire to the second bonding point.

Abstract: A tail wire cutting method and bonding apparatus executing the same, in which a capillary raised to a predetermined height and a clamper disposed above the capillary and gripping a wire are caused to make reciprocating oscillation movement on, for instance, a circular arc that has an apex at the above-described predetermined height, thus forming (minute) cracks in a portion between the tail wire and a bonding end of a bonding point, and then cutting of a tail wire sticking out of the tip end of the capillary is executed by way of raising the capillary and clamper.

Abstract: A ball forming device and method used in a bonding apparatus, including a bonding arm, a capillary attached to the bonding arm, an electronic flame off prove for forming a ball at the tip of a wire passing through the capillary, and a gas atmosphere forming unit for bringing the vicinity of the tip end of the wire into a gas atmosphere. The gas atmosphere forming unit is made of an inner wall element and an outer wall element with a hollow space section in between. The bonding arm side of the inner wall element has an inside open space which is wider than the portion of the bonding arm where the capillary is attached, and gas ejection ports are formed in the inner wall element. A gas supply pipe is connected to the outer wall element to supply, for instance, a reducing gas into the hollow space section.

Abstract: A ball forming device and method used in a bonding apparatus, including a bonding arm, a capillary attached to the bonding arm, an electronic flame off probe for forming a ball at the tip of a wire passing through the capillary, and a gas atmosphere forming unit for bringing the vicinity of the tip end of the wire into a gas atmosphere. The gas atmosphere forming unit is made of an inner wall element and an outer wall element with a hollow space section in between. The bonding arm side of the inner wall element has an inside open space which is wider than the portion of the bonding arm where the capillary is attached, and gas ejection ports are formed in the inner wall element. A gas supply pipe is connected to the outer wall element to supply, for instance, a reducing gas into the hollow space section.

Abstract: A wire bonding method including the steps of: descending a capillary 5 from above an external lead 1 to press a wire 10 to such an extent that the wire is not completely connected to the external lead 1, thus forming a thin part 16 in the wire; next ascending the capillary 5 and the thin part 16 to substantially the same height as a first bonding point A, then moving the capillary 5 in a direction away from the first bonding point A, thus making a linear wire portion 18 and then cutting the wire at the thin part 16; then connecting the end 19 (thin part) of the linear wire portion 18 and the wire tip end 20 at the lower end of the capillary 5 are connected to the external lead 1; and then separating the wire tip end 20 from the external lead 1.

Abstract: A wire bonding method that connects a first bonding point and a second bonding point by a wire, the method including a step that press-bonds a ball formed on a tip end of a wire to a first bonding point, thus forming a press-bonded ball; a step that slightly raises a capillary, moves the capillary toward a second bonding point and then lowers the capillary by an amount that is smaller than an amount in which the capillary was raised, and a step that raises the capillary to allow the wire to be paid out of the capillary and moves the capillary toward a second bonding point, thus connecting the wire to the second bonding point.

Abstract: A horn-holder pivot type bonding apparatus including a horn holder for holding an ultrasonic horn, and a motor for driving the horn holder to pivot, with an imaginary pivot point of the horn holder being positionally fixed on a bonding surface. The motor is provided substantially in the center of the upper portion of the horn holder. The horn holder is formed with circular arc sections in the forward and rearward portions with respect to the imaginary pivot point; and a bonding head has, at portions corresponding to the circular arc sections of the horn holder, forward and rearward cams so that the cams are pivotable by supporting shafts. The forward and rearward cams have circular arc sections that contact the circular arc sections of the horn holder, the circular arc shape of the circular arc sections of the forward and rearward cams being centered on the supporting shafts.

Abstract: A bonding apparatus including a capillary 40 having a high-frequency coil 50 on its tip end portion and allowing a bonding wire 2 to pass therethrough, a position changing unit for changing the position of the tip of the bonding wire, a gas supply unit for supplying gas into the capillary, and a high-frequency power supply unit for supplying high-frequency power to the high-frequency coil. When the bonding wire is outside a plasma region 52 in the capillary, a microplasma generated in the plasma region is ejected out of the capillary and removes foreign matter or contaminants on the surface of a bonding subject. When the bonding wire is inside the plasma region, the material of the bonding wire is turned into fine particles, and a microplasma 303 containing sputtered fine particles is ejected from the capillary, allowing the material the same as the bonding wire to be deposited on the bonding subject.

Abstract: In an bonding apparatus, a piezoelectric element 4 being built into the vicinity of the capillary attachment portion of a bonding arm 1 so that the capillary 3 can be caused to vibrate in the axial direction of the bonding arm 1. The preparatory pressure application device that applies a preparatory pressure to the piezoelectric element 4 includes two wedge-form attachment bases 5 and 6 which are disposed to the rear of or behind the piezoelectric element 4, and a preparatory pressure bolt 7 which is screwed into the wedge-form attachment base 6 from the outside of the bonding arm 1; and a preparatory pressure is applied to the piezoelectric element 4 by the movement of the wedge-form attachment base 5 in the axial direction of the bonding arm 1 caused by the rotation of the preparatory pressure bolt 7.

Abstract: A wire bonding method that connects a first bonding point and a second bonding point by a wire, the method including a step that press-bonds a ball formed on a tip end of a wire to a first bonding point, thus forming a press-bonded ball; a step that slightly raises a capillary, moves the capillary toward a second bonding point and then lowers the capillary by an amount that is smaller than an amount in which the capillary was raised, and a step that raises the capillary to allow the wire to be paid out of the capillary and moves the capillary toward a second bonding point, thus connecting the wire to the second bonding point.

Abstract: A wire bonding apparatus 10 including an X table 18 guided to move in the X direction on an XY table base 14 and a driving motor 20 mounted on a motor base 16 with the movable element 22 of the driving motor 20 connected to the X table 18. The motor main body 24 is guided by a pair of motor guides 26 so as to be movable in the X direction via the laminated bodies 40. In each laminated body 40, viscoelastic flat rubber plates that have a spring element and a damping element, and flat rigid plates, are alternately disposed and laminated, so that the rigidity is large in the direction perpendicular to the laminated surfaces, and the rigidity is small in the direction parallel to the laminated surfaces, and the laminated bodies have a recovery force and a damping force due to the viscoelasticity.

Abstract: A bonding arm swinging type bonding apparatus that has a rotational center 13 of the bonding arm 1 beneath the bonding arm. The rotating shaft parts 11 of circular arc form rotary motors 10 that rotate about the rotational center 13 of the bonding arm 1 are attached to the bonding arm 1, and the rotating shaft parts 21 of circular arc form air bearings 20 that rotate about this rotational center 13 are provided so that the rotating shaft parts of the circular arc form air bearings 20 are rotatable as a unit with the rotating shaft parts 11 of the rotary motors 10.

Abstract: A wire bonding apparatus and method involving a computer 41 that has a height position counter 44 that produces height position signals for a capillary 5 by processing signals from a position sensor 29 that detects the position of the bonding arm 20 in the vertical direction. This computer 41 includes a memory 60, which stores the detected position of the capillary 5 at the time that secondary bonding is performed on a bump that is formed in a normal manner on the second conductor, and a comparator circuit 61, which outputs a “bump not-adhered” signal in cases where the output value of the height position counter 44 is outside the permissible error range of the detected position that is stored in the memory 60.

Abstract: Guide rails for guiding a band-form member such as a film carrier tape in a semiconductor manufacturing apparatus. The guide rails include a pair of rail main bodies with a plurality of guide assemblies provided on the upper surfaces of the rail main bodies so that the guide assemblies partially guide the upper surface of the band-form member.

Abstract: With an assumption that the three data of the position (X1, Y1) of the first positioning pattern 202 and position (X2, Y2) of the second positioning pattern 212 of the reference chip 200, and the position (X3, Y3) of the first positioning pattern 232 of the bonding object chip 230, as well as the length L of a line segment connecting (X1, Y1) and (X2, Y2), and the angle ?2 of this line segment with respect to the X axis, are known, the coordinates (X4, Y4) of the center position of the imaging range 250 that is to be imaged next is determined by detecting the inclination-angle ?? of the first positioning pattern 232 of the bonding object chip 230. Furthermore, the imaging range can be narrowed and the second positioning pattern 252 can be captured by increasing the precision of ??.

Abstract: Determination of inclination of positioning patterns used in bonding being made by: imaging a positioning pattern of reference chip and taking such image as reference-image; specifying a polar coordinate conversion origin for the reference-image; imaging an object (chip) of bonding to use it as an object-image, thus obtaining a relative positional-relationship with the reference-image; specifying the polar coordinate conversion origin of the object-image, so that the object-image is subjected to a polar coordinate conversion; and calculating inclination-angle from both images that have been subjected to a polar coordinate conversion; thus using a point, in which an error in position of the object of comparison detected by pattern matching between an image, which is the object of comparison obtained by imaging the object of comparison disposed in an attitude that includes positional deviation, and the reference-image, shows a minimal value, as an origin of the polar coordinate conversion.

Abstract: With an assumption that the three data of the position (X1, Y1) of the first positioning pattern 202 and position (X2, Y2) of the second positioning pattern 212 of the reference chip 200, and the position (X3, Y3) of the first positioning pattern 232 of the bonding object chip 230, as well as the length L of a line segment connecting (X1, Y1) and (X2, Y2), and the angle ?2 of this line segment with respect to the X axis, are known, the coordinates (X4, Y4) of the center position of the imaging range 250 that is to be imaged next is determined by detecting the inclination-angle ?? of the first positioning pattern 232 of the bonding object chip 230. Furthermore, the imaging range can be narrowed and the second positioning pattern 252 can be captured by increasing the precision of ??.

Abstract: Determination of inclination of positioning patterns used in bonding being made by: imaging a positioning pattern of reference chip and taking such image as reference-image; specifying a polar coordinate conversion origin for the reference-image; imaging an object (chip) of bonding to use it as an object-image, thus obtaining a relative positional-relationship with the reference-image; specifying the polar coordinate conversion origin of the object-image, so that the object-image is subjected to a polar coordinate conversion; and calculating inclination-angle from both images that have been subjected to a polar coordinate conversion; thus using a point, in which an error in position of the object of comparison detected by pattern matching between an image, which is the object of comparison obtained by imaging the object of comparison disposed in an attitude that includes positional deviation, and the reference-image, shows a minimal value, as an origin of the polar coordinate conversion.