Abstract: In an actuator of a bonding apparatus, a rotating body 16 that has a bonding head is rotatably supported on a supporting carrier having the same shape as magnetic path members 32L and 32R, and coil portions 40 and 42 are disposed on both outer sides of this supporting carrier. Rectilinear magnetic fields created by the coil portions 40 and 42 and a circumferential magnetic field created by permanent magnets of the rotating body 16 act cooperatively via magnetic path members 32L and 32R in which a plurality of magnetic paths are formed, so that the rotating body 16 makes a movement combining rotation and a linear movement along the Y axis in accordance with the respective driving of the coil portions 40 and 42. The rotating body 16 is movable along the X and Y axes by the shape of the magnetic paths of the magnetic path members.

Abstract: A bonding apparatus including a front link whose lower end is rotatably connected to a bonding arm and upper portion is rotatably connected to bonding head, and a rear link whose lower end is rotatably connected to the rear end of the bonding arm and upper portion is rotatably connected to the bonding head; and a hypothetical rotational center of capillary of the bonding arm is on a bonding surface and set to be the intersection of a line that connects upper and lower rotational centers of the front link and a line that connects upper and lower rotational centers of the rear link, wherein the immovable element of motor is fastened to the bonding head, and the rotational element of the motor is attached to the upper end of the rear link so that the rotational element rotates about the upper rotational center of the rear link.

Abstract: An initial ball forming method for wire bonding wire and wire bonding apparatus that uses: a capillary through which a wire is passed; a torch electrode made of a low-melting-point material that contains, for instance, tin; and a direct-current high voltage power supply. When the direct-current high voltage power supply is turned ON, a space discharge occurs between the tip end of the wire and the torch electrode, resulting in that the wire tip end melts and is formed into a ball and that the tin of the torch electrode is also heated to a high temperature and diffused into space, so that ionized plus tin ions are attracted to the tip end of the melted wire, thus causing tin to adhere to the surface of the ball-shaped tip end of the wire, and forming an initial ball that has a low-melting-point coating material adhered to its surface.

Abstract: A wire bonder including two link driving mechanisms and a head supporting stage provided with a bonding head via fluid pressure so that the bonding head is movable in the horizontal plane. Each link driving mechanism is formed by a motor, a driving arm, and a movable arm. The movable arm that extends from the driving arm of the first link driving mechanism is fastened to the bonding head, and the movable arm that extends from the driving arm of the second link driving mechanism is rotatably connected at its one end to the bonding head. A thrust aiming at the center of gravity of the bonding head is applied to the bonding head by the movable arms, thus moving the bonding head around.

Abstract: In an actuator of a bonding apparatus, a rotating body 16 that has a bonding head is rotatably supported on a supporting carrier having the same shape as magnetic path members 32L and 32R, and coil portions 40 and 42 are disposed on both outer sides of this supporting carrier. Rectilinear magnetic fields created by the coil portions 40 and 42 and a circumferential magnetic field created by permanent magnets of the rotating body 16 act cooperatively via magnetic path members 32L and 32R in which a plurality of magnetic paths are formed, so that the rotating body 16 makes a movement combining rotation and a linear movement along the Y axis in accordance with the respective driving of the coil portions 40 and 42. The rotating body 16 is movable along the X and Y axes by the shape of the magnetic paths of the magnetic path members.

Abstract: Determination of inclination of positioning patterns used in bonding being made by: imaging a positioning pattern of reference chip and taking such image as reference-image; specifying a polar coordinate conversion origin for the reference-image; imaging an object (chip) of bonding to use it as an object-image, thus obtaining a relative positional-relationship with the reference-image; specifying the polar coordinate conversion origin of the object-image, so that the object-image is subjected to a polar coordinate conversion; and calculating inclination-angle from both images that have been subjected to a polar coordinate conversion; thus using a point, in which an error in position of the object of comparison detected by pattern matching between an image, which is the object of comparison obtained by imaging the object of comparison disposed in an attitude that includes positional deviation, and the reference-image, shows a minimal value, as an origin of the polar coordinate conversion.

Abstract: With an assumption that the three data of the position (X1, Y1) of the first positioning pattern 202 and position (X2, Y2) of the second positioning pattern 212 of the reference chip 200, and the position (X3, Y3) of the first positioning pattern 232 of the bonding object chip 230, as well as the length L of a line segment connecting (X1, Y1) and (X2, Y2), and the angle ?2 of this line segment with respect to the X axis, are known, the coordinates (X4, Y4) of the center position of the imaging range 250 that is to be imaged next is determined by detecting the inclination-angle ?? of the first positioning pattern 232 of the bonding object chip 230. Furthermore, the imaging range can be narrowed and the second positioning pattern 252 can be captured by increasing the precision of ??.

Abstract: A wire bonding apparatus that include a piezoelectric element 4 provided near the capillary attachment portion of a bonding arm 1 so that a capillary 3 vibrates in the axial direction of the bonding arm 1, the piezoelectric element 4 being driven by a piezoelectric element driving power source 11. The wire bonding apparatus further includes a detector 15 and a bonding arm control circuit 16, wherein the detector 15 detects the voltage or current generated by the piezoelectric element 4 when the capillary 3 is lowered and contacts the object of bonding, and the bonding arm control circuit 16 controls the lowering motion of the bonding arm 1 in accordance with the changes in the voltage or current detected by this detector 15.

Abstract: A bonding apparatus including, on a supporting stand 12, two linear motors 130 and 140 and a bonding head supporting stage 114 which supports the bonding head 120 by means of fluid pressure so that the bonding head 120 is movable in the horizontal plane. The linear motors 130 and 140 respectively include driving sections 132 and 142 and movable coil assemblies 134 and 144. An arm 136 extending from the movable coil assembly 134 of the first linear motor 130 is fastened to the bonding head 120, and an arm 146 extending from the movable coil assembly 144 of the second linear motor 140 is engaged with the bonding head 120. A driving force aimed at the center of gravity of the bonding head 120 is applied to the bonding head 120 via the arms 136 and 146, so that the bonding head 120 is moved.

Abstract: A die bonding method and apparatus that performs bonding position detection and bonding inspection without lowering the productivity, in which after a bonding head has bonded a semiconductor chip to an island, the bonding head is moved to a wafer to pick up a semiconductor chip and is returned to the island; and during this period, an island used for bonding inspection (that is the island on which bonding has just been performed) and an island used for position detection (that is the island on which bonding is to be done next) are imaged by a camera in the same visual field, and inspection of the bonding conditions of the island used for inspection and detection of the position of the island used for position detection are performed based on the acquired image data.

Abstract: A wire bonder 50 in which light rays 66 that leave an object on a carrying stand 60 pass through a light path 80 that passes through a parallel flat plate and reach an imaging camera 70 as light rays 68. The light path 80 that passes through a parallel flat plate includes a half-mirror 82 disposed in the light path, a parallel flat plate 86, and a reflective mirror 88 which is disposed perpendicular to the optical axis of the light rays 96 that have passed through the parallel flat plate 86 and which performs a mirror reflection operation, in a plane perpendicular to the optical axis, on the light rays 96, so that the light rays again return to the parallel flat plate 86 as reflected light 98.

Abstract: A bonding apparatus that makes correction ?X=(Xn?Xc) in positioning of bonding tool and substrate where the imaging center of first camera shows deviation +Xc with respect to the imaging center of second camera, and deviation +Xn occurs when bonding tool moves from height Z1 to height Z2. A target is disposed at height Z1 in a correcting position, and a correction camera is disposed beneath the target. The correction amount ?X=(Xn?Xc)=X3?(X2+X1) is determined based upon first positional deviation X1 which is the position of a chip 10d at height Z1 seen from the target, second positional deviation X2 which is the position of the target seen from the imaging center of the second camera, and third positional deviation X3 which is the position of the chip 10u at height Z2 seen from the imaging center of the first camera.

Abstract: Bump formation method and wire bonding method including a step of forming a ball on the tip end of a wire that passes through a capillary and joining this ball to an electrode pad so as to make a press-bonded ball. In the next step, the capillary is raised and moved horizontally so that the bottom flat portion of the capillary faces the press-bonded ball. Then, the capillary is lowered and the press-bonded ball is pressed, thus forming a first bump. Next, the capillary is raised and moved horizontally in a direction that is opposite from the previous horizontal-direction, thus positioning the flat portion of the capillary to face the first bump. Then, the capillary is lowered, and the wire is bent and pressed against the surface of the first bump so as to form a second bump. The wire is then cut from the second bump.

Abstract: A wire bonding method including the steps of forming a bump by performing ball bonding of a ball by wire on a second conductor, raising a capillary to a height that is equal to or lower than the height of a ball portion that rises into a through-hole of the capillary during formation of the bump, moving the capillary in a direction that is opposite from the first conductor, lowering the capillary so as to form an inclined wedge on the bump, cutting the wire, performing the primary bonding on the first conductor, and making a loop with the wire with respect to the bump from the first conductor, thus performing the secondary bonding on the inclined wedge on the bump.

Abstract: Wire bonding being performed by, following the formation of a neck portion on a wire at a first bonding point, raising the capillary from the neck portion while paying out a first specified length of wire, causing the capillary to move toward a second bonding point so that a first kink is formed on the wire, then lowering the capillary so that a second specified length of wire is taken into the capillary, and moving the capillary in the opposite direction from the second bonding point so as to form a second kink, and then raising the capillary, while paying out the wire, until the first kink is positioned at the lower end of the capillary, and finally, with the wire being is held in this state, moving the capillary to the second bonding point, thus completing a wire loop between the first and second bonding points.

Abstract: An image processing of an object to be detected in bonding system for manufacturing, for instance, semiconductor devices including a step of calculation of a difference value between a reference image inputted beforehand and a rotated image obtained by rotating the reference image for a plurality of reference points within the reference image, a step of mask pattern production based upon the difference values for the plurality of reference points, and a step of position detection for a position of an object of detection by pattern matching by way of using an image of the object of detection obtained by imaging the object of detection, the reference image and the mask pattern.

Abstract: In an apparatus and method for obtaining offset amount between a reference pattern on, for instance, a semiconductor device and a bonding tool in order to specify bonding points on the semiconductor device, a reduction process is performed on the high-magnification image acquired by a first camera, and this processed image is compared with a low-magnification image acquired by a second camera, thus obtaining an amount of deviation between an image center mark that constitutes the reference point of the high-magnification image and an image center mark that constitutes the reference point of the low-magnification image. Then, the offset amount between the second camera and the bonding tool is calculated by adding the calculated amount of deviation to the offset amount between the first camera and the bonding tool.

Abstract: A bonding method and apparatus that uses a position detection camera which takes images of a workpiece and a light path conversion device which directs the image of an area near the lower end of a capillary to the position detection camera. The image acquired by the position detection camera is processed, and an execution is made so as, for instance, to measure the diameter of a ball formed on a wire extending from the lower end of the capillary, to measure the tail length extending from the lower end of the capillary, to measure the ball position from the undersurface of the capillary, to observe the bending of the tail of the wire, to inspect the external appearance of the capillary, and to measure the amplitude of vibration of the capillary when an ultrasonic vibration is applied to the capillary.

Abstract: A bonding apparatus including: a horn holder pivotably connected at a first connecting portion to a bonding head, an ultrasonic horn having a capillary and held in the horn holder, a linking arm pivotably connected at a second connecting portion to the horn holder and pivotably connected at a third connecting portion to the bonding head, and a driving motor that moves the first connecting portion horizontally or causes the third connecting portion to pivot; and a relationship L1=L2=L3 being established, in which L1 is a distance between the third connecting portion and the second connecting portion, L2 is a distance between the second connecting portion and the tip end of the capillary, and L3 is a distance between the second connecting portion and the first connecting portion.

Abstract: So as to perform high-precision position detection without performing pattern matching in the direction of rotation even when the object of detection involves a positional deviation in the direction of rotation, pattern matching between a reference image and a rotated image obtained by rotating this reference image is performed during registration, and then the difference between the measured value of the position obtained following rotation and the theoretical value of the position of the rotated image is retained as a calibration amount corresponding to the known angle of rotation. Upon detection, the measured value is detected by pattern matching between an image of the object of detection, which is detected by imaging the object of detection disposed in an attitude that includes a positional deviation in the direction of rotation, and a reference image; and this measured value is corrected by the calibration amount.