Patents Assigned to Kamaya Electric Co., Ltd.
  • Patent number: 10553385
    Abstract: Provided is a chip fuse and a method for producing the same, which is improved to facilitate balanced release of impact and vapor generated upon fusion. The chip fuse includes a fuse body having a pair of facing upper and lower ceramic substrates, a fuse wire support having a vertical through hole in its center and held between the ceramic substrates, and a fuse wire mounted between the two ends of the fuse wire support across the through hole, and a pair of metal caps fitted on the two ends of the fuse body, wherein the upper ceramic substrate and the fuse wire support, and the lower ceramic substrate and the fuse wire support, are respectively adhered together on their mutually facing surfaces to hermetically close the through hole, partially leaving a non-adhered region on the adhered surfaces.
    Type: Grant
    Filed: April 28, 2015
    Date of Patent: February 4, 2020
    Assignee: Kamaya Electric Co., Ltd.
    Inventors: Koji Nakanishi, Satoshi Nishimura
  • Patent number: 10242776
    Abstract: The chip resistor includes insulating substrate 10, first and second top electrodes (11x, 11b) on the top surface of the insulating substrate each on either longitudinal end thereof, and resistive element 12 electrically in contact with the top electrodes, wherein each of the top electrodes has, on its inner side facing to the other, cutout part 11a and protruding part 11b, with the cutout part in the first top electrode extending from at least one longitudinal side of the insulating substrate, transversely inwards thereof, and with the cutout part in the second top electrode arranged substantially point-symmetrically to the cutout part in the first top electrode with respect to the center of the insulating substrate, wherein the resistive element has contacting regions 12b, and non-contacting regions 12c, and trimming slot (53a, 53b) including a linear part.
    Type: Grant
    Filed: April 22, 2016
    Date of Patent: March 26, 2019
    Assignee: Kamaya Electric Co., Ltd.
    Inventors: Tomiharu Morita, Yuusuke Nojiri
  • Patent number: 9852868
    Abstract: In a chip fuse, a heat-storing layer is formed on an insulated substrate, a fuse film is formed on the heat-storing layer, and a protective film is formed on the fuse element section. The chip fuse includes surface electrode sections on both ends in the length direction of the chip fuse and a fuse element section between the surface electrode sections. In this chip fuse, a rectangular bank section is formed over the heat-storing layer and the surface electrode sections to surround the fuse element section, and a first protective layer is formed on the inner side of the bank section. In addition, during the bank formation process, a sheet-like photosensitive-group-containing material is laminated on the fuse element section, surface electrode sections, and heat-storing layer, and the sheet-like photosensitive-group-containing material is exposed to ultraviolet light and developed to form the rectangular bank section.
    Type: Grant
    Filed: September 28, 2012
    Date of Patent: December 26, 2017
    Assignee: KAMAYA ELECTRIC CO., LTD.
    Inventors: Katsuya Yamagishi, Hideki Seino
  • Publication number: 20150270085
    Abstract: In a chip fuse, a heat-storing layer is formed on an insulated substrate, a fuse film is formed on the heat-storing layer, and a protective film is formed on the fuse element section. The chip fuse includes surface electrode sections on both ends in the length direction of the chip fuse and a fuse element section between the surface electrode sections. In this chip fuse, a rectangular bank section is formed over the heat-storing layer and the surface electrode sections to surround the fuse element section, and a first protective layer is formed on the inner side of the bank section. In addition, during the bank formation process, a sheet-like photosensitive-group-containing material is laminated on the fuse element section, surface electrode sections, and heat-storing layer, and the sheet-like photosensitive-group-containing material is exposed to ultraviolet light and developed to form the rectangular bank section.
    Type: Application
    Filed: September 28, 2012
    Publication date: September 24, 2015
    Applicant: KAMAYA ELECTRIC CO., LTD.
    Inventors: Katsuya Yamagishi, Hideki Seino
  • Patent number: 8973253
    Abstract: The object of the invention is to provide a method and an apparatus that allow production of metal plate chip resistors having a relatively low resistance with high accuracy and yield through simple process. The object is achieved by apparatus for manufacturing metal plate chip resistors including cutting mold for cutting intermediate product strip transversely to obtain worked product chip, ohm meter for measuring the resistance of the worked product chip, control device having a calculating part for performing a calculation using the resistance measured by the ohm meter to work out a width in which the strip is to be cut transversely so as to obtain a worked product chip of a desired resistance, and cutting width adjustor for making an adjustment so that the strip is to be cut transversely in the width obtained from the calculating part.
    Type: Grant
    Filed: November 8, 2013
    Date of Patent: March 10, 2015
    Assignee: Kamaya Electric Co., Ltd.
    Inventors: Tatsuki Hirano, Kazuo Tanaka
  • Publication number: 20140059838
    Abstract: The object of the invention is to provide a method and an apparatus that allow production of metal plate chip resistors having a relatively low resistance with high accuracy and yield through simple process. The object is achieved by apparatus for manufacturing metal plate chip resistors including cutting mold for cutting intermediate product strip transversely to obtain worked product chip, ohm meter for measuring the resistance of the worked product chip, control device having a calculating part for performing a calculation using the resistance measured by the ohm meter to work out a width in which the strip is to be cut transversely so as to obtain a worked product chip of a desired resistance, and cutting width adjustor for making an adjustment so that the strip is to be cut transversely in the width obtained from the calculating part.
    Type: Application
    Filed: November 8, 2013
    Publication date: March 6, 2014
    Applicant: KAMAYA ELECTRIC CO., LTD.
    Inventors: Tatsuki Hirano, Kazuo Tanaka
  • Patent number: 8590141
    Abstract: The object of the invention is to provide a method and an apparatus that allow production of metal plate chip resistors having a relatively low resistance with high accuracy and yield through simple process. The object is achieved by apparatus 10 for manufacturing metal plate chip resistors including cutting mold 21 for cutting intermediate product strip 14 transversely to obtain worked product chip 16a, ohm meter 22 for measuring the resistance of the worked product chip 16a, control device 23 having a calculating part for performing a calculation using the resistance measured by the ohm meter 22 to work out a width in which the strip 14 is to be cut transversely so as to obtain a worked product chip of a desired resistance, and cutting width adjusting means 26, 27 for making an adjustment so that the strip 14 is to be cut transversely in the width obtained from the calculating part.
    Type: Grant
    Filed: August 2, 2011
    Date of Patent: November 26, 2013
    Assignee: Kamaya Electric Co., Ltd.
    Inventors: Tatsuki Hirano, Kazuo Tanaka
  • Publication number: 20110283522
    Abstract: The object of the invention is to provide a method and an apparatus that allow production of metal plate chip resistors having a relatively low resistance with high accuracy and yield through simple process. The object is achieved by apparatus 10 for manufacturing metal plate chip resistors including cutting mold 21 for cutting intermediate product strip 14 transversely to obtain worked product chip 16a, ohm meter 22 for measuring the resistance of the worked product chip 16a, control device 23 having a calculating part for performing a calculation using the resistance measured by the ohm meter 22 to work out a width in which the strip 14 is to be cut transversely so as to obtain a worked product chip of a desired resistance, and cutting width adjusting means 26, 27 for making an adjustment so that the strip 14 is to be cut transversely in the width obtained from the calculating part.
    Type: Application
    Filed: August 2, 2011
    Publication date: November 24, 2011
    Applicant: Kamaya Electric Co., Ltd.
    Inventors: Tatsuki Hirano, Kazuo Tanaka
  • Patent number: 8058968
    Abstract: A method for manufacturing rectangular plate type chip resistors and a rectangular plate type chip resistor obtained by this method. The method includes the steps of (A) providing a resistive alloy plate strip of predetermined width and thickness, (B) forming an insulating protective film of a predetermined width longitudinally along the middle of upper and lower faces of the alloy plate strip, (C) forming an electrode layer composed of integrated surface, back, and end electrodes, along both sides of the protective film by electroplating, and (D) cutting the alloy plate strip coated with the protective films and the electrode layers in step (C) transversely in predetermined lengths, wherein resistance is controlled to be within a predetermined range by adjusting the thickness of the alloy plate strip in step (A), the width of the protective film formed in step (B), and the cutting length in step (D).
    Type: Grant
    Filed: May 18, 2007
    Date of Patent: November 15, 2011
    Assignee: Kamaya Electric Co., Ltd.
    Inventors: Tatsuki Hirano, Osamu Matsukawa
  • Publication number: 20100236054
    Abstract: The object of the invention is to provide a method and an apparatus that allow production of metal plate chip resistors having a relatively low resistance with high accuracy and yield through simple process. The object is achieved by apparatus 10 for manufacturing metal plate chip resistors including cutting mold 21 for cutting intermediate product strip 14 transversely to obtain worked product chip 16a, ohm meter 22 for measuring the resistance of the worked product chip 16a, control device 23 having a calculating part for performing a calculation using the resistance measured by the ohm meter 22 to work out a width in which the strip 14 is to be cut transversely so as to obtain a worked product chip of a desired resistance, and cutting width adjusting means 26, 27 for making an adjustment so that the strip 14 is to be cut transversely in the width obtained from the calculating part.
    Type: Application
    Filed: January 10, 2008
    Publication date: September 23, 2010
    Applicant: KAMAYA ELECTRIC CO., LTD.
    Inventors: Tatsuki Hirano, Kazuo Tanaka
  • Patent number: 5828123
    Abstract: A chip resistor comprising an insulated substrate, a pair of top electrodes disposed on top of said insulated substrate, a resistor film bridging said pair of top electrodes, a protective film coating said resistor film, and an end electrode and a plated electrode film which are formed on each of said pair of top electrodes, wherein each of said top electrodes includes:a first electrode section connected to said resistor film; anda second electrode section not in direct contact with said resistor film and arranged in connection to and along said first electrode section so as to extend in parallel with a portion of said first electrode section between said resistor film and said end electrode, said second electrode section having a sheet resistivity lower than that of said first electrode section.
    Type: Grant
    Filed: December 18, 1996
    Date of Patent: October 27, 1998
    Assignee: Kamaya Electric Co., Ltd.
    Inventor: Tatsuki Hirano