Patents Assigned to LG Innotek Co., LTD
  • Publication number: 20240030750
    Abstract: A wireless power transmitter including a reception unit configured to receive a foreign object detection (FOD) status packet from a wireless power receiver; and a transmission unit configured to transmit a response indicating whether a foreign object is present in a charging area of the wireless power transmitter to the wireless power receiver, wherein the FOD status packet includes a mode bit field, wherein the mode bit field indicates whether the FOD status packet includes a reference peak frequency of the wireless power receiver, wherein the reference peak frequency is pre-allocated to the wireless power receiver, and wherein the response is determined using a measured peak frequency of a transmitted power signal and an adaptive threshold frequency based on the reference peak frequency included in the FOD status packet.
    Type: Application
    Filed: July 20, 2023
    Publication date: January 25, 2024
    Applicant: LG INNOTEK CO., LTD.
    Inventors: Jae Hee PARK, Yong Il KWON
  • Patent number: 11882350
    Abstract: One embodiment of a camera module may comprise: a lens barrel provided with at least one lens; a holder to which the lens barrel is coupled; a printed circuit board coupled on the bottom of the holder to face the lens; an adhering portion coupling the holder and the printed circuit board; an opening portion opening a portion of a first space formed through the coupling of the printed circuit board and the holder; and a housing coupled with the holder, wherein a second space separated from the first space may be formed through the coupling of the holder and the housing, and the opening portion may communicate the first space with the second space.
    Type: Grant
    Filed: September 6, 2022
    Date of Patent: January 23, 2024
    Assignee: LG INNOTEK CO., LTD.
    Inventor: Myoung Jin An
  • Patent number: 11880126
    Abstract: An embodiment comprises: a housing; a bobbin, accommodated inside the housing, for mounting a lens; a first coil arranged on an outer peripheral surface of the bobbin; magnets arranged in the housing; a coil board that comprises second coils arranged below the housing and arranged so as to be spaced from each other, and connection parts connected to the second coils; a circuit board, which is arranged below the coil board and comprises first pad parts arranged at locations corresponding to the connection parts; and a conductive adhesive member for bonding the connection part and the first pad part, which correspond to each other, wherein each of the connection parts comprises a groove part depressed from the outer surface of the coil board, and exposing any one corresponding upper surface among the first pad parts, and a bonding part prepared around the groove part, and the conductive adhesive member is arranged on the upper surface of the bonding part and on the upper surface of the first pad part exposed by
    Type: Grant
    Filed: September 14, 2022
    Date of Patent: January 23, 2024
    Assignee: LG INNOTEK CO., LTD.
    Inventors: Tae Bong Park, Jun Taek Lee
  • Patent number: 11882370
    Abstract: A camera module according to the present embodiment includes a light emitting part configured to output a light signal to an object, a filter configured to allow the light signal to pass therethrough, at least one lens disposed on the filter and configured to collect the light signal from the object, a sensor configured to generate an electric signal from the light signal collected by the lens, the sensor including a plurality of pixels arranged in an array form, and a tilting part configured to tilt the filter to repeatedly move an optical path of the light signal having passed through the filter according to a predetermined rule. The optical path of the light signal passing through the filter is moved in one direction among diagonal directions of the sensor with respect to an optical path corresponding to the filter being disposed parallel to the sensor.
    Type: Grant
    Filed: January 6, 2020
    Date of Patent: January 23, 2024
    Assignee: LG INNOTEK CO., LTD.
    Inventors: Chang Hyuck Lee, Young Kil Song
  • Patent number: 11882261
    Abstract: The present embodiment relates to a camera device comprising a first camera device, a second camera device, and a third camera device disposed between the first camera device and the second camera device, wherein: the first camera device includes a first bobbin, a first coil disposed on the first bobbin, a first magnet facing the first coil, and a second coil disposed under the first magnet; the second camera device includes a second bobbin, a third coil disposed on the second bobbin, and a second magnet facing the third coil; the third camera device includes a third bobbin, a fourth coil disposed on the third bobbin, a third magnet facing the fourth coil, a fourth magnet disposed on the third bobbin, and a Hall sensor for sensing the fourth magnet; and the Hall sensor of the third camera device is disposed between the fourth magnet of the third camera device and the second camera device.
    Type: Grant
    Filed: May 31, 2022
    Date of Patent: January 23, 2024
    Assignee: LG INNOTEK CO., LTD.
    Inventors: Sung Guk Lee, Kyoung Ho Yoo
  • Patent number: 11880089
    Abstract: An embodiment includes a housing including a guide protrusion projecting from an upper surface thereof and a guide groove formed adjacent to the guide protrusion, a first magnet disposed at the housing, a bobbin on which a lens is mounted, a first coil disposed on an outer circumferential surface of the bobbin to move the bobbin by interaction with the first magnet, an upper elastic member coupled to the bobbin and the housing and having an end disposed in the guide groove, a damping member disposed between a side surface of the guide protrusion and a first end of the upper elastic member disposed in the guide groove, and a second coil for moving the housing by interaction with the first magnet.
    Type: Grant
    Filed: September 1, 2022
    Date of Patent: January 23, 2024
    Assignee: LG INNOTEK CO., LTD.
    Inventors: Jung Cheol Kim, Jin Suk Han
  • Patent number: 11882263
    Abstract: A time of flight (ToF) camera according to embodiments of the present invention includes a light source unit including an infrared light-emitting device array and configured to generate a light signal; a lens unit disposed on the light source unit and including a plurality of lenses; and an adjustment unit configured to adjust the lens unit such that a light pattern of the light signal, which has passed through the lens unit, becomes a surface lighting or a spot lighting including a plurality of spot patterns, wherein the lens unit has a distortion aberration in the form of barrel distortion in which irradiance of the light pattern decreases in a direction away from a central portion.
    Type: Grant
    Filed: August 28, 2020
    Date of Patent: January 23, 2024
    Assignee: LG INNOTEK CO., LTD.
    Inventor: Kang Yeol Park
  • Publication number: 20240022119
    Abstract: A wireless power receiver for receiving power from a wireless power transmitter, including a receiving part configured to receive wireless power from the wireless power transmitter; and a main controller in which a foreign object detection status packet including at least one of a reference quality factor and a reference peak frequency is stored, wherein the main controller transmits the foreign object detection status packet to the wireless power transmitter; wherein the main controller receives a NAK response from the wireless power transmitter indicating that the foreign object is present, or receives an ACK response from the wireless power transmitter indicating that the foreign object is not present; and wherein the receiving part receives a first power from the wireless power transmitter according to the received NAK response, or receives a second power greater than the first power from the wireless power transmitter according to the received ACK response.
    Type: Application
    Filed: July 20, 2023
    Publication date: January 18, 2024
    Applicant: LG INNOTEK CO., LTD.
    Inventors: Yu Ri PARK, Yong Il KWON
  • Publication number: 20240021524
    Abstract: A semiconductor package according to an embodiment includes a first substrate layer; and a second substrate layer disposed on the first substrate layer, wherein the first substrate layer includes at least one first insulating layer; a first circuit pattern disposed on the first insulating layer; and a first via passing through the first insulating layer and connected to the first circuit pattern, wherein the second substrate layer includes a second insulating layer disposed on the first insulating layer; a second circuit pattern disposed on the second insulating layer; and a second via passing through the second insulating layer and connected to the second circuit pattern, wherein the first insulating layer and the second insulating layer include different insulating materials and wherein a width of the first via is different from a width of the second via.
    Type: Application
    Filed: March 25, 2022
    Publication date: January 18, 2024
    Applicant: LG INNOTEK CO., LTD.
    Inventors: Tae Gyu KANG, Dong Keon LEE, Won Suk JUNG
  • Patent number: 11877466
    Abstract: A substrate for a display, according to one embodiment, comprises: one surface; another surface which is the reverse of the one surface; a first area; and second areas, wherein the one surface is folded so as to face itself, the first area is defined as a folding area, and the second areas are defined as unfolding areas. The substrate for a display comprises a first layer, and a second layer which is disposed on the first layer, wherein the first area of the first layer comprises a plurality of first holes or first grooves, the first layer is an etch layer, and the second layer is an etch stopper layer.
    Type: Grant
    Filed: November 10, 2020
    Date of Patent: January 16, 2024
    Assignee: LG INNOTEK CO., LTD.
    Inventors: Sung Won Kang, Jae Seok Park
  • Patent number: 11876004
    Abstract: A printed circuit board according to an embodiment includes: an insulating layer; a first pad disposed on a first surface of the insulating layer; a first conductive layer disposed on the first pad and including gold (Au); a second pad disposed on a second surface of the insulating layer; and a second conductive layer disposed on the second pad and including gold (Au), wherein the first conductive layer is a conductive layer connected to a wire, the second conductive layer is a conductive layer connected to a solder, and the first conductive layer is thicker than the second conductive layer.
    Type: Grant
    Filed: April 21, 2022
    Date of Patent: January 16, 2024
    Assignee: LG INNOTEK CO., LTD.
    Inventors: Sung Oh Cho, Yoon Tai Kim
  • Patent number: 11874491
    Abstract: A lighting device disclosed in an embodiment of the invention includes a substrate; a light source including a plurality of light emitting devices disposed on the substrate; a resin layer disposed on the substrate; and a first diffusion layer disposed on the resin layer, wherein the resin layer includes a first resin portion disposed on the light source, and a second resin portion adjacent to the first resin portion and disposed on the substrate. The upper surface of the first resin portion has an inclination and is spaced apart from the first diffusion layer, the second resin portion includes a material different from that of the first resin portion, and the second resin portion based on the upper surface of the substrate. The height of the upper surface may be greater than the lowermost height of the upper surface of the first resin portion.
    Type: Grant
    Filed: April 14, 2023
    Date of Patent: January 16, 2024
    Assignee: LG INNOTEK CO., LTD.
    Inventor: Young Jae Choi
  • Patent number: 11876403
    Abstract: An embodiment provides a stator comprising a stator core having a plurality of teeth and coils wound around the teeth, wherein the tooth includes a body around which the coil is wound and a shoe connected to the body, the shoe includes a plurality of grooves and a curvature center of the inner peripheral surface of the shoe is the same as the center of the stator core.
    Type: Grant
    Filed: March 13, 2023
    Date of Patent: January 16, 2024
    Assignee: LG INNOTEK CO., LTD.
    Inventors: Jin Su Pyeon, Shung Hun Woo
  • Patent number: 11875525
    Abstract: According to one embodiment, disclosed is a method by which a camera module capable of acquiring depth information controls the output time point and the reception time point of light. By controlling both the output time point and the reception time point of light, the camera module can acquire the light of phases in which adjacent reception pixels differ from one another despite controlling light sources or reception pixels in line units.
    Type: Grant
    Filed: October 7, 2019
    Date of Patent: January 16, 2024
    Assignee: LG INNOTEK CO., LTD.
    Inventors: Yang Hyun Joo, Chang Hyuck Lee, Hyeong Jin Kim
  • Patent number: 11877042
    Abstract: An embodiment of the present invention comprises: a housing; a bobbin disposed within the housing; a first magnet disposed on a first side of the bobbin; a second magnet disposed on a second side of the bobbin; a first coil disposed in the housing so as to correspond to the first magnet; a second coil disposed in the housing so as to correspond to the second magnet; first to third springs coupled to the bobbin; and a circuit board disposed in the housing and having first and second terminals, wherein the first spring connects one end of the first coil with the first terminal of the circuit board, the second spring connects one end of the second coil with the second terminal of the circuit board, and the third spring connects the other end of the first coil with the other end of the second coil.
    Type: Grant
    Filed: August 20, 2018
    Date of Patent: January 16, 2024
    Assignee: LG INNOTEK CO., LTD.
    Inventor: Sung Guk Lee
  • Patent number: 11877393
    Abstract: A stretchable circuit board according to an embodiment comprises: a substrate including one surface and the other surface opposite to the one surface; an electronic component disposed on the one surface of the substrate; and a wiring electrode disposed on the one surface of the substrate and connecting the electronic component, wherein the substrate includes an effective area, in which the electronic component is formed, and an ineffective area other than the effective area and includes a pattern part which is formed in the ineffective area and extends through the substrate from one surface to the other surface thereof.
    Type: Grant
    Filed: February 26, 2020
    Date of Patent: January 16, 2024
    Assignee: LG INNOTEK CO., LTD.
    Inventors: Duck Hoon Park, Woo Young Chang, Jee Heum Paik
  • Patent number: 11874482
    Abstract: A camera module includes a lens holder having a hollow region; a first lens unit disposed in the hollow region and including at least one lens; a second lens unit disposed above the lens holder; a circuit board disposed under the lens holder; an adhesion unit disposed between a lower surface of the lens holder and an upper surface of the circuit board and configured to couple the lens holder and the circuit board to each other. The adhesion unit includes an opening and a portion of an internal space formed by a coupling of the circuit board and the lens holder is to be open to an outside through the opening of the adhesion.
    Type: Grant
    Filed: September 9, 2021
    Date of Patent: January 16, 2024
    Assignee: LG INNOTEK CO., LTD.
    Inventors: Ji Hwan Park, Myoung Jin An, Dong Wook Park
  • Patent number: 11874523
    Abstract: A lens moving apparatus can include a housing; a base disposed below the housing; a bobbin disposed inside the housing and configured to move in a first direction along or parallel with an optical axis within the housing; driving magnets disposed on the housing; a coil provided at an outer surface of the bobbin; an elastic member coupled to the bobbin and supporting the bobbin; a sensing magnet coupled to the bobbin; and a position sensor coupled to a printed circuit board, wherein the position sensor is configured to sense a displacement of the sensing magnet in the first direction, in which the bobbin includes a reception recess formed on the outer surface of the bobbin such that at least a part of the reception recess is located at an inside of the coil, the sensing magnet is disposed in the reception recess, and the position sensor is disposed on another side of the housing than sides on which the driving magnets are disposed.
    Type: Grant
    Filed: March 3, 2022
    Date of Patent: January 16, 2024
    Assignee: LG INNOTEK CO., LTD.
    Inventors: Seong Min Lee, Sang Ok Park, Hyune O Yoo, Byung Wook Son, Jun Taek Lee
  • Patent number: 11874955
    Abstract: One embodiment discloses an electronic device including a first acquisition unit which outputs first motion information about a detection target in a first detection region, a second acquisition unit which outputs second motion information about the detection target in a second detection region, and a control unit which executes an instruction according to the first motion information and the second motion information, wherein the first detection region and the second detection overlap at least partially.
    Type: Grant
    Filed: July 3, 2020
    Date of Patent: January 16, 2024
    Assignee: LG INNOTEK CO., LTD.
    Inventors: Min Seok Kang, Ellen Park, Eun Yeob Kang, Keal Doo Moon
  • Publication number: 20240012312
    Abstract: An aperture set includes a support including a first opening overlapping with a lens, a rotor rotatably disposed on the support and including a second opening overlapping with the lens and the first opening, and a plurality of blades disposed on the support and respectively rotatably disposed on the rotor, wherein an inner surface of the blade for adjusting an amount of light incident on the lens includes a curved portion and a straight portion.
    Type: Application
    Filed: September 21, 2023
    Publication date: January 11, 2024
    Applicant: LG INNOTEK CO., LTD.
    Inventors: Bon Seok KU, Kyung Won KIM