Patents Assigned to Lite-On Opto Technology (Changzhou) Co., Ltd.
  • Patent number: 11437355
    Abstract: A light-emitting package structure and a manufacturing method thereof are provided. The light-emitting package structure includes a driving device and at least one light-emitting chip. The driving device includes a driving chip and a redistribution layer structure formed over the driving chip. The driving chip has a first surface and a second surface opposite to the first surface. The redistribution layer structure includes a plurality of first conductive pads disposed on the first surface and a plurality of second conductive pads disposed on the second surface, and one of the first conductive pads is electrically connected to one of the second conductive pads. The at least one light-emitting chip is disposed on the first surface of the driving chip and electrically connected to the driving chip through the first conductive pads.
    Type: Grant
    Filed: July 22, 2020
    Date of Patent: September 6, 2022
    Assignees: LITE-ON OPTO TECHNOLOGY (CHANGZHOU) CO., LTD., LITE-ON TECHNOLOGY CORPORATION
    Inventors: Chien-Feng Kao, Chen-Hsiu Lin, Wen-Hsiang Lin
  • Patent number: 11380821
    Abstract: A light emitting diode package structure includes a substrate, a light emitting unit, a wavelength conversion layer, and a reflective structure. The light emitting unit and the reflective structure are disposed on a mounting surface of the substrate. The wavelength conversion layer is disposed on the light emitting unit. The wavelength conversion layer has a light input surface, a top light output surface opposite to the light input surface, and a side light output surface connecting the light input surface and the top light output surface. The reflective structure surrounds the light emitting unit and the wavelength conversion layer. The reflective structure has a top reflecting surface located on a top of the reflective structure, and a height position of the top reflecting surface is higher than a height position of the light input surface and lower than a height position of the top light output surface.
    Type: Grant
    Filed: September 28, 2020
    Date of Patent: July 5, 2022
    Assignee: LITE-ON OPTO TECHNOLOGY (CHANGZHOU) CO., LTD.
    Inventors: Shu-yong Jia, Abner Li, Li Zhang
  • Patent number: 11322663
    Abstract: A lighting device is provided. The lighting device includes a carrier, a light-emitting diode chip, and a wavelength up-conversion structure. The light-emitting diode chip is disposed on the carrier and is configured to emit a first light, which has a peak wavelength between 800 nm and 1000 nm. The wavelength up-conversion structure is disposed on the light-emitting diode chip and is configured to convert part of the first light into a second light, which has a converted spectrum between 400 nm and 700 nm.
    Type: Grant
    Filed: August 12, 2020
    Date of Patent: May 3, 2022
    Assignees: LITE-ON OPTO TECHNOLOGY (CHANGZHOU) CO., LTD., LITE-ON TECHNOLOGY CORPORATION
    Inventors: Fang-Jung Sun, Shih-Chang Hsu
  • Patent number: 11309466
    Abstract: A light emitting unit includes a reflective structure, a light transmitting body and a light emitting chip. The reflective structure has a recess formed by inner side surfaces thereof, and the reflective structure includes a side opening and a bottom opening corresponding to the recess. The side opening and the bottom opening are adjacent to each other, and the inner side surfaces are defined as a top surface and a surrounding side surface. The light transmitting body is disposed within the recess and doped with fluorescent powder. The light transmitting body includes a light emitting surface and an electrode exposing surface. The light emitting surface is corresponding to the side opening; and the electrode exposing surface is corresponding to the bottom opening. The light emitting chip is partially disposed within the light transmitting body and has a bottom, a top light emitting and side light emitting surfaces.
    Type: Grant
    Filed: November 29, 2019
    Date of Patent: April 19, 2022
    Assignees: LITE-ON OPTO TECHNOLOGY (CHANGZHOU) CO., LTD., LITE-ON TECHNOLOGY CORPORATION
    Inventors: Yu-Yu Chang, Chih-Yuan Chen, Yung-Chang Jen
  • Patent number: 11307085
    Abstract: A light detecting device, a lighting module, and a manufacturing method for the same are provided. The lighting module includes a carrier, a light assembly having a first lighting unit and a second lighting unit, a lens assembly having a first lens and a second lens, and a casing surrounding the lens assembly. The first lighting unit emits a first beam having a first wavelength through the first lens to define a first view angle and the second lighting unit emits a second beam having a second wavelength through the second lens to define a second view angle. The first wavelength is smaller than the second wavelength, and the first view angle is greater than the second view angle.
    Type: Grant
    Filed: November 13, 2020
    Date of Patent: April 19, 2022
    Assignees: LITE-ON OPTO TECHNOLOGY (CHANGZHOU) CO., LTD., LITE-ON TECHNOLOGY CORPORATION
    Inventors: Chen-Hsiu Lin, Wen-Hsiang Lin, Yung-Chang Jen, Shih-Chung Huang
  • Patent number: 11296064
    Abstract: A substrate structure with a buried chip and a light emitting device using the same are provided. The substrate structure includes a base layer, a control chip, a filling layer, a first upper resin layer and a first lower resin layer. The substrate layer has a first surface, a second surface opposite to the first surface, and an opening passing through the first surface and the second surface. The control chip is disposed in the opening, and an annular space having a specific width is defined by an outer wall surface of the control chip and an inner wall surface of the opening. The filling layer is filled in the annular space. The first upper resin layer and the first lower resin layer are respectively disposed on the first surface and the second surface of the base layer.
    Type: Grant
    Filed: June 11, 2020
    Date of Patent: April 5, 2022
    Assignees: LITE-ON OPTO TECHNOLOGY (CHANGZHOU) CO., LTD., LITE-ON TECHNOLOGY CORPORATION
    Inventors: Chen-Hsiu Lin, Tsung-Kang Ying, Erh-Chan Hsu
  • Patent number: 11289880
    Abstract: A light source package structure is provided. The light source package structure includes a substrate, an upper electrode layer, a surrounding wall, a light emitting unit, an adhesive, and a light permeable element. The surrounding wall is annular with step structure and includes an upper tread surface arranged away from the substrate, an upper riser surface connected to an inner edge of the upper tread surface, a lower tread surface disposed at an inner side of the upper riser surface, an accommodating groove disposed between the lower tread surface and the upper riser surface, and a lower riser surface connected to an inner edge of the lower tread surface and arranged away from the upper tread surface. The lower riser surface and the first surface jointly define a receiving space.
    Type: Grant
    Filed: May 7, 2020
    Date of Patent: March 29, 2022
    Assignees: LITE-ON OPTO TECHNOLOGY (CHANGZHOU) CO., LTD., LITE-ON TECHNOLOGY CORPORATION
    Inventors: Wen Lee, Hsiang-Chih Hung, Shu-Hua Yang, Yu-Hung Su
  • Patent number: 11262060
    Abstract: A light source device includes a substrate, an electrode layer and an annular step-like surrounding frame both disposed on the substrate, a light emitter and a light detector both spaced apart from each other and mounted on the electrode layer in the surrounding frame, and a light permeable member disposed on the surrounding frame. The surrounding frame includes an upper tread arranged away from the substrate, an upper riser connected to an inner edge of the upper tread, a lower tread arranged at an inner side of the upper riser, and a lower riser connected to an inner edge of the lower tread and arranged away from the upper tread. The surrounding frame has a notch recessed in the lower tread and the lower riser for spatially communicating an inner side of the surrounding frame to an external space.
    Type: Grant
    Filed: August 8, 2019
    Date of Patent: March 1, 2022
    Assignees: LITE-ON OPTO TECHNOLOGY (CHANGZHOU) CO., LTD., LITE-ON TECHNOLOGY CORPORATION
    Inventors: Hsin-Wei Tsai, I-Ju Chen, Hou-Yen Tsao, Shu-Hua Yang, Yu-Hung Su
  • Patent number: 11264370
    Abstract: A light-emitting diode (LED) package structure includes a substrate, an LED, a side wall, an encapsulant, and a waterproof protective coating. The LED is disposed on the substrate, the side wall defines a through hole and is disposed on the substrate, and the LED is accommodated in the through hole. The encapsulant is filled in the through hole and covers the LED. A heterojunction is disposed between the encapsulant and the side wall, and the waterproof protective coating seals the heterojunction. Furthermore, the encapsulant includes a first fluoropolymer, the waterproof protective coating includes a second fluoropolymer, and the light transmittance of the first fluoropolymer is greater than that of the second fluoropolymer.
    Type: Grant
    Filed: June 11, 2020
    Date of Patent: March 1, 2022
    Assignees: LITE-ON OPTO TECHNOLOGY (CHANGZHOU) CO., LTD., LITE-ON TECHNOLOGY CORPORATION
    Inventors: Wei-Te Cheng, Kuo-Ming Chiu, Kai-Chieh Liang, Jie-Ting Tsai
  • Patent number: 11257795
    Abstract: A chip-scale LED package structure includes a white light emitting unit for emitting a white light, a red flip-chip LED for emitting a red light, a green flip-chip LED for emitting a green light, a blue flip-chip LED for emitting a blue light, and an encapsulation layer. The encapsulation includes an encapsulation resin and a plurality of refractive particles distributed in the encapsulation resin. The encapsulation layer encapsulates the white light emitting unit, the red flip-chip LED, the green flip-chip LED, and the blue flip-chip LED. Moreover, electrodes of the white light emitting unit, electrodes of the red flip-chip LED, electrodes of the green flip-chip LED, and electrodes of the blue flip-chip LED are exposed from the encapsulation layer.
    Type: Grant
    Filed: December 18, 2019
    Date of Patent: February 22, 2022
    Assignees: LITE-ON OPTO TECHNOLOGY (CHANGZHOU) CO., LTD., LITE-ON TECHNOLOGY CORPORATION
    Inventors: Tien-Yu Lee, Chih-Yuan Chen, Wei-Lun Tsai, Chien-Tung Huang, Wei-Hsun Hsu, Wei-Chien Hung
  • Patent number: 11251346
    Abstract: A light emitting diode (LED) package structure is provided and includes a substrate, an LED chip and a reflective component. The substrate has a first and a second region, and the substrate includes at least one electrode pad disposed on the second region. The LED chip is disposed on the substrate and has a chip upper surface with a light emitting region and a wire bonding region. The LED chip includes at least one electrode contact located at the wire bonding region and is electrically connected to the at least one electrode pad via a metal wire. The reflective component includes a first portion and a second portion. The first portion includes a first surface flush with the light emitting region and the second portion includes a second surface above a highest point of the metal wire.
    Type: Grant
    Filed: August 21, 2020
    Date of Patent: February 15, 2022
    Assignees: LITE-ON OPTO TECHNOLOGY (CHANGZHOU) CO., LTD., LITE-ON TECHNOLOGY CORPORATION
    Inventors: Hung-Jui Chen, Po-Jui Lin
  • Patent number: 11217572
    Abstract: The light source device includes a substrate, a light emitting unit mounted on the substrate, a frame disposed on the substrate, a metal shield fixed to an inner side of the frame and electrically coupled to the substrate, a light permeable member disposed on the frame, a cover plate disposed on the light permeable member and fixed to the frame, a detection unit electrically coupled to the substrate, and an uplift block that provides for the substrate to be disposed thereon.
    Type: Grant
    Filed: January 30, 2020
    Date of Patent: January 4, 2022
    Assignees: LITE-ON OPTO TECHNOLOGY (CHANGZHOU) CO., LTD., LITE-ON TECHNOLOGY CORPORATION
    Inventors: Hsin-Wei Tsai, Jui-Lin Tsai, Chia-Cheng Wu, You-Chen Yu, Chien-Tien Wang, Tai-Wen Tsai, Pai-Hao Chang, Shu-Hua Yang, Yu-Hung Su
  • Patent number: 11211313
    Abstract: A lead frame array for carrying chips includes a plurality of lead frames. Any four lead frames adjacent to each other and have two pairs of linking bridge groups which are connected any two lead frames adjacent to each other by one of the linking bridge groups. Each linking bridge group has an inner linking bridge, a slanted linking bridge and an outer linking bridge. An LED package structure with multiple chips is further provided, which includes a lead frame formed by cutting the lead frame array.
    Type: Grant
    Filed: September 27, 2019
    Date of Patent: December 28, 2021
    Assignees: LITE-ON OPTO TECHNOLOGY (CHANGZHOU) CO., LTD., LITE-ON TECHNOLOGY CORPORATION
    Inventors: Chen-Hsiu Lin, Ming-Kun Weng
  • Patent number: 11209146
    Abstract: A miniaturized structured light projection module is provided. The miniaturized structured light projection module includes a light source assembly and a projecting lens. The light source assembly has a plurality of light source units, each of which is provided with a default projected pattern on its surface. The projecting lens is disposed above the light source units. The default projected patterns of the light source units are disposed on a front focal plane of the projecting lens.
    Type: Grant
    Filed: January 18, 2019
    Date of Patent: December 28, 2021
    Assignees: LITE-ON OPTO TECHNOLOGY (CHANGZHOU) CO., LTD., LITE-ON TECHNOLOGY CORPORATION
    Inventors: Yu-Yu Chang, Yung-Chang Jen, Chen-Hsiu Lin
  • Patent number: 11205731
    Abstract: A light source package structure is provided. The light source package structure includes a substrate, an upper electrode layer, a light emitting unit, a photodiode, a surrounding wall, a light permeable element, and a coating layer. The substrate includes a first surface and a second surface that is opposite to the first surface. The upper electrode layer is disposed on the first surface of the substrate. The light emitting unit and the photodiode both are disposed on the upper electrode layer. The surrounding wall is disposed on the first surface and is arranged to surround the light emitting unit and the photodiode. The light permeable element is disposed on the surrounding wall. The coating layer is disposed inside of the surrounding wall and is coated on a part of the first surface and a part of the upper electrode layer.
    Type: Grant
    Filed: May 5, 2020
    Date of Patent: December 21, 2021
    Assignees: LITE-ON OPTO TECHNOLOGY (CHANGZHOU) CO., LTD., LITE-ON TECHNOLOGY CORPORATION
    Inventors: Wen Lee, Hsiang-Chih Hung, I-Ju Chen, Shu-Hua Yang, Yu-Hung Su
  • Patent number: 11145777
    Abstract: An optical sensor module includes a first frame set, a second frame set and a housing which partially covers the first frame set and the second frame set. The first frame set has a first chip-mounting frame and a first wiring frame. The first chip-mounting frame has a first chip-mounting section, and a first conductive lead. At least one first indentation is formed on the first chip-mounting section. The second frame set has a second chip-mounting frame and a second wiring frame. The second chip-mounting frame has a second chip-mounting section and a second conductive lead. At least one second indentation is formed on the second chip-mounting section.
    Type: Grant
    Filed: January 9, 2020
    Date of Patent: October 12, 2021
    Assignees: LITE-ON OPTO TECHNOLOGY (CHANGZHOU) CO., LTD., LITE-ON TECHNOLOGY CORPORATION
    Inventors: Chen-Hsiu Lin, Shih-Chung Huang, Bo-Jhih Chen
  • Patent number: 11139420
    Abstract: An LED package structure includes a multilayered circuit board, a plurality of lighting elements, a control unit, a reflecting unit, a package unit, a plurality of test paths and a plurality of operation paths. The multilayered circuit board includes a plurality of testing pads, a first electrical connecting pad and a plurality of second electrical connecting pads. The lighting elements are disposed on the multilayered circuit board. The control unit is electrically connected to the lighting elements. The reflecting unit is disposed on the multilayered circuit board and surrounds the lighting elements. The package unit covers the lighting elements. The test paths are in electrical connection with the first electrical connecting pad, the lighting elements and one of the testing pads. The operation paths are in electrical connection with the first electrical connecting pad, the control unit, the lighting elements and one of the second electrical connecting pads.
    Type: Grant
    Filed: May 1, 2020
    Date of Patent: October 5, 2021
    Assignees: LITE-ON OPTO TECHNOLOGY (CHANGZHOU) CO., LTD., LITE-ON TECHNOLOGY CORPORATION
    Inventors: Chen-Hsiu Lin, Wen-Hsiang Lin, Chung-Hsien Yu
  • Patent number: 11035563
    Abstract: A light source device includes a substrate, an upper electrode layer and a lower electrode layer respectively disposed on two opposite surfaces of the substrate, a plurality of first conductive posts and second conductive posts embedded in the substrate and having the same number, a light emitter, a surrounding frame surrounding the light emitter, and a light permeable member disposed on the surrounding frame and covering the light emitter. The first conductive posts connect a first upper electrode pad of the upper electrode layer and a first lower electrode pad of the lower electrode layer. The second conductive posts connect a second upper electrode pad of the upper electrode layer and a second lower electrode pad of the lower electrode layer. The light emitter is mounted on the first upper electrode pad and is electrically connected to the second upper electrode pad.
    Type: Grant
    Filed: August 8, 2019
    Date of Patent: June 15, 2021
    Assignees: LITE-ON OPTO TECHNOLOGY (CHANGZHOU) CO., LTD., LITE-ON TECHNOLOGY CORPORATION
    Inventors: Hsin-Wei Tsai, I-Ju Chen, Hou-Yen Tsao, Shu-Hua Yang, Yu-Hung Su
  • Patent number: 11024205
    Abstract: A display device includes a patterned panel and a light emitting module. The patterned panel includes a light-transmitting substrate, a first light-transmitting portion, a second light-transmitting portion and a third light-transmitting portion. Each of the light-transmitting portions respectively has a first transmission spectrum, a second transmission spectrum and a third transmission spectrum. The third light-transmitting portion is adjacent to the first light-transmitting portion and the second light-transmitting portion, and the third transmission spectrum has a first overlapping part with the first transmission spectrum, and has a second overlapping part with the second transmission spectrum. The light emitting module includes a first light emitting unit and a second light emitting unit, the first light emitting unit emits a first light having a peak wavelength in the first overlapping part, and the second light emitting unit emits a second light having a peak wavelength in the second overlapping part.
    Type: Grant
    Filed: February 3, 2020
    Date of Patent: June 1, 2021
    Assignees: LITE-ON OPTO TECHNOLOGY (CHANGZHOU) CO., LTD., LITE-ON TECHNOLOGY CORPORATION
    Inventors: Fang-Jung Sun, Shih-Chang Hsu, Chao-Ming Wu
  • Patent number: 10916685
    Abstract: An package structure includes a substrate, a pair of electrodes and a solder pad layer both electrically connected to each other and respectively disposed on two opposite surfaces of the substrate, a lighting diode arranged above the substrate and electrically connected to the pair of electrodes, a wall disposed on the substrate and arranged around the lighting diode, and a package compound disposed inside of the wall and covering the lighting diode. The package compound includes an attaching portion disposed on a top surface of the lighting diode, and a surrounding portion arranged around the attaching portion. The surrounding portion has an annular slot arranged on a top surface thereof. A bottom end of the annular slot is located at a position aligning with 25%˜90% of a thickness of the lighting diode along a height direction.
    Type: Grant
    Filed: June 14, 2018
    Date of Patent: February 9, 2021
    Assignees: LITE-ON OPTO TECHNOLOGY (CHANGZHOU) CO., LTD., LITE-ON TECHNOLOGY CORPORATION
    Inventors: Wei-Te Cheng, Kuo-Ming Chiu, Meng-Sung Chou, Kai-Chieh Liang