Abstract: Non-staining, active metal-working compositions are disclosed. The compositions contain active sulfur to provide extreme pressure properties for metal-working fluids. A metal corrosion inhibitor is disclosed that reduces the corrosivity of free sulfur on non-ferrous metallic objects.

Abstract: This invention relates to fluxing underfill compositions useful for fluxing metal surfaces in preparation for providing an electrical connection and sealing the space between semiconductor devices, such as chip size or chip scale packages (“CSPs”), ball grid arrays (“BGAs”), land grid arrays (“LGAs”), flip chip assemblies (“FCs”) and the like, each of which having a semiconductor chip, such as large scale integration (“LSI”), or semiconductor chips themselves and a circuit board to which the devices or chips, respectively, are electrically interconnected. The inventive fluxing underfill composition begins to cure at about the same temperature that solder used to establish the electrical interconnection melts.

Abstract: A radiation-curable composition which includes a cyanoacrylate component or a cyanoacrylate-containing formulation; a metallocene component; a photoinitiator; and a luminescent and/or fluorescent dye.

Abstract: An article of manufacture which comprises a material for sealing threaded pipe joints comprising a multifilament yarn ready-coated with a joint sealing composition and packaged in a dispenser from which the coated yarn may be supplied for direct application to a threaded area of a pipe.

Abstract: Cyanoacrylate composition, having a cure indicator within the composition, is disclosed herein. The cyanoacrylate composition is “self-indicating” with respect to its ability to allow the end user to visually inspect the composition to determine whether, and the extent to which, cure has occurred. The composition includes a cyanoacrylate component, and a dye dissolved in the cyanoacrylate component. The cyanoacrylate composition has an initial color, oftentimes colorless or substantially so to the naked eye, and when cured, the cured cyanoacrylate composition has a different or second color. Observation of the second or different color is indicative that cure has occurred and the extent of the color change can be used to determine the degree of cure that has occurred.

Abstract: In accordance with the present invention, there are provided thermosetting resin compositions with a reduced propensity to shrink in volume upon cure and methods of use therefor. The compositions of the present invention include compounds having aromatic, rigid-rod like spacer groups between the crosslinkable moieties. As such, these compounds impart a degree of liquid crystal-like character to the thermosetting resin composition which results in lower shrinkage upon cure. This effect follows from the well-known expansion that occurs when liquid crystal-like materials pass from a nematic liquid crystal-like state to an isotropic state. Further provided by the present invention are low shrinkage die attach pastes and methods of use therefor.

Abstract: A method of preparing a bonded assembly of two substrates at least one of which is transparent or translucent to UV or visible light, comprises a) applying, to at least one of the substrates, a photo/anaerobic dual cure composition comprising: i) a (meth)acrylate-capped urethane oligomer, ii) at least one (meth)acrylate diluent monomer, iii) an anaerobic curing system, and iv) a free-radical photoinitiator; b) joining the two substrates c) irradiating the adhesive through said transparent or translucent substrates with light of a wavelength effective to activate the photoinitiator for a time sufficient to at least fixture the adhesive, and then d) allowing the assembly to further cure at ambient conditions without for at least 24 hrs without subjecting the fixtured assembly to substantial peel stresses.

Abstract: In accordance with the present invention, methods have been developed for the reduction of the chloride content of epoxy compound starting materials. Invention methods comprise fractionating an epoxy compound starting material into portions (e.g., fractions or cuts) having different chloride content relative to the epoxy compound starting material. Certain of these collected portions (i.e., the portions fractionated and collected after collection of the forecut and before discontinuation of the fractionation) contain substantially reduced chloride levels relative to the epoxy compound starting material.

Abstract: In accordance with the present invention, there are provided novel coupling agents which are compatible with a wide variety of adhesive formulations and which provide substantial adhesion enhancement relative to base formulations to which they are added. Invention compounds comprise at least one free-radically polymerizable group (other than acrylate) and at least one reactive moiety which forms covalent bond(s) with substrates having free hydroxyl groups on the surface thereof. Thus, invention compounds are covalently linked to adhesive formulations upon free radical cure, while at the same time providing “residual” functionality which is capable of undergoing reaction with any substrate having reactive (e.g., hydroxyl) groups in the surface thereof.

Abstract: The present invention is directed to a photocurable composition for use as an encapsulant, for underfill or attachment adhesives, capable of curing at wavelengths greater than 290 nm. Reaction products of these photocurable compositions have a low level of extractable halide ion, such as less than 100 ppm. In use, the photocurable composition may be applied, for instance, over the wire bonds that electrically connect a semiconductor device to a substrate to maintain a fixed positional relationship and protect the integrity of the electrical connection from vibrational and shock disturbances, as well as from interference from environmental contaminants.

Abstract: An anaerobic adhesive composition having enhanced toughness and resistance to crack propagation, particularly subsequent to thermal exposure, comprising a combination of three monomers consisting of (a) at least one (meth) acrylate monomer, (b) at least one (meth)acrylate-terminated urethane modified acrylonitrile/butadiene prepolymer, and (c) at least one (meth)acrylate-terminated acrylic/polyisocyanate adduct.

Abstract: Primers for cyanoacrylate adhesives which are based on compounds having multiple amine groups thereon (“multi-amines”) which have at least three secondary or tertiary amine groups, at least one of which is a tertiary amine group. The multi-amine compounds are characterized by having thereon at least three terminal and/or pendant aliphatic hydrocarbon groups of at least 4 carbon atoms in length. Such primers give substantially improved bond strengths to cyanoacrylate adhesive bonded assemblies comprising a polyolefin substrate such as high density polyethylene, LDPE or polypropylene. The multi-amine may have a cascade, dendrimer, hyperbranched or comb-like structure.

Abstract: A thermal interface wafer for facilitating heat transfer from an electronic component to a heat sink. The wafer is formed from at least one elongate, vertically-oriented strip of thermally conductive material having a layer of conformable, heat-conducting material formed thereon. Preferably, the substrate comprises a metal foil, such as aluminum or some other thermally-conductive metal, that is formed as a flat, spiral-like coil. Such strip may further be configured to have a serpentine configuration, or may alternatively be formed from a multiplicity of strips. The present invention further provides for methods of transferring heat from an electronic component to a heat sink, as well as methods for fabricating the thermal interface wafers of the present invention.

Abstract: Thermosetting resin compositions useful as underfill sealants for mounting a semiconductor devices onto a circuit board are provided, which include epoxy resins, an adhesion promoter having at least two secondary amine groups, and a curative based on the combination of nitrogen-containing compounds and transition metal complexes.

Abstract: A latent fluxing agent comprising a material which liberates phenol or a carboxylic acid containing compound when heated above 140° C. The latent fluxing agent may be incorporated into a thermoset resin, which includes an epoxy resin. The uncured epoxy resin, which includes the epoxy resin, the latent fluxing agent and an epoxy curing agent are useful as an underfill composition in a method for applying a chip die, having one or more solder balls, to a substrate. The method is used to produce an integrated circuit chip that includes a chip die having electrical contacts arranged in a predetermined pattern and capable of providing electrical engagement with a carrier substrate.

Abstract: A method for sealing graphite plates formed from mechanically processed graphite sheets of exfoliated graphite particles is provided. The graphites sheets are infused with a sealant to fill about 90 volume percent of the pores contained in the sheet. Upon curing the sealant, a substantially gas impermeable graphite plate is provides. Such a plate is useful in fuel cell construction.

Abstract: This invention relates to thermosetting resin compositions useful for mounting semiconductor devices onto a circuit board, such as chip size or chip scale packages (“CSPs”), ball grid arrays (“BGAs”), land grid arrays (“LGAs”), and the like, each of which having a semiconductor chip, such as large scale integration (“LSI”), on a carrier substrate. The compositions of this invention are reworkable when subjected to appropriate conditions.

Abstract: An improved method is disclosed for heat curing a polymerizable impregnant composition within an impregnated porous article. The amount of the article's porosity that is filled with the impregnant composition is maximized by applying successively discrete temperature and pressure increments in a system comprising at least one porous impregnated article and a curing chamber having a heat transfer medium therein. During such curing, both temperature and pressure are controlled for an initial duration and subsequently increased by successive increments wherein each successive temperature and pressure exceeds a previous temperature and pressure, respectively, until a maximum temperature and pressure is achieved. The maximum temperature and pressure are maintained until the impregnant composition is cured, resulting in an improved product having greater structural integrity and surface quality.

Abstract: Silicone compositions are disclosed which exhibit excellent adherence to magnesium-based substrates such as magnesium alloys and which exhibit excellent resistance to organic solvents. These compositions include at least one polymerizable silicone component, at least one amino-containing silane adhesion promoter which enhances adhesion of the composition to magnesium-based substrates, and at least one viscosity modifier, which enhances the resistance of the compositions to organic solvents. Methods of making these compositions, articles of manufacture including these compositions, and a method for providing enhanced adhesion to magnesium-based substrates using these compositions are also disclosed.