Patents Assigned to Magica Corporation
  • Publication number: 20110304008
    Abstract: A semiconductor chip includes a silicon substrate, a transistor in or on a bottom side surface of the substrate, a metallization structure under a bottom side surface of the substrate, a dielectric layer under the substrate and between a first and second metal layers of the metallization structure, a passivation layer under the metallization structure and the dielectric layer, where an opening in the passivation layer may be under a contact point of the metallization structure, a polymer layer under the passivation layer, a metal post under the passivation layer and in the polymer layer, where the polymer layer may not cover a bottom surface of the metal post, a metal bump connected with the bottom surface of the metal post, a micro-lense over the top side surface of the substrate, and a glass substrate over the micro-lense and over the top side surface of the substrate.
    Type: Application
    Filed: June 10, 2011
    Publication date: December 15, 2011
    Applicant: Magica Corporation
    Inventor: Ping-Jung Yang