Abstract: The base assembly of a dual in-line encapsulation package (DIP) is provided with a mounting surface such that the upper ends of the package pins are flat and are flush with the flat upper surface of the base enabling one-stage bonding of the integrated circuit chip to the inner leads of a lead frame and subsequently for one-stage bonding of the outer leads of the lead frame to the in-line pins of the encapsulation package.The configuration of the package lid and the hermetic sealing of the lid to the base yields a package having a double protection seal arrangement in which each pin seal is isolated from the encapsulated chip.