Abstract: In order to reduce the chip size of a semiconductor device as well as to separate noises between at least two types of pads having different functions, at least one Vcc and at least one Vss are provided on opposite edges of a package (101) so that output pins or I/O pins are arranged therebetween and input pins are arranged outside the same. Non-connected excess pins (NC) are arranged on upper and lower boundaries, for omitting wires and reducing the chip size.

Abstract: In order to improve the degree of storage data integration, side walls (32) are selectively formed on side surfaces of word lines (22) to serve as masks for changing ON-state current values of memory cells by changing widths or lengths of active regions (24) of the memory cells, thereby forming a plurality of types of memory cells having different electrical properties. Thus, storage data per memory cell is so multivalued that the number of memory cells is reduced.

Abstract: In order to improve the degree of storage data integration, side walls (32) are selectively formed on side surfaces of word lines (22) to serve as masks for changing ON-state current values of memory cells by changing widths or lengths of active regions (24) of the memory cells, thereby forming a plurality of types of memory cells having different electrical properties. Thus, storage data per memory cell is so multivalued that the number of memory cells is reduced.

Abstract: A plurality of bare semiconductor IC chips are mounted on a base substrate. The base substrate and IC chips are sealed in a package to constitute a multichip module. Diodes are disposed on the base substrate so that an end of each diode is connected to a terminal for connecting each IC chip with said base substrate and the other end thereof is connected to a prescribed voltage. As a result, it is possible to inspect the base substrate by contacting probes only with a connecting pad between the base substrate and a package, to reduce the number of pins of a probe card, to produce a cheap probe card and to reduce a rate of imperfect contact between the probe card and an inspecting pad.

Abstract: In order to improve area efficiency of a mask ROM, a head address is inputted from a common pad (204) only in an initial access, so that addresses are thereafter changed by an internal counter (212). Data output is carried out through the common pad (204). Wires are employed for address input and data output in common, thereby remarkably reducing the number of wires.

Abstract: An apparatus for testing a semiconductor integrated circuit includes a plurality of probe lines and a plurality of sense lines which intersect each other to thereby define a plurality of intersections thereby as electrically isolated from each other. An electronic switch device is provided for each intersection for producing a multilevel signal, on an associated sense line, having one of a predetermined number of voltage levels corresponding to various combinations definable by a predetermined number of binary numbers supplied to test points from logic elements to be tested.In a four test point embodiment, four test points are arranged such that each test point is located in a corresponding one of four quadrants defined by a pair of probe and sense lines intersecting each other. Preferably, the integrated circuit is in the form of a gate array.

Abstract: In order to improve the degree of storage data integration, side walls (32) are selectively formed on side surfaces of word lines (22) to serve as masks for changing ON-state current values of memory cells by changing widths or lengths of active regions (24) of the memory cells, thereby forming several of types of memory cells having different electrical properties. Storage data per memory cell is therefore so multivalued that the number of memory cells is reduced.

Abstract: A multi-chip module semiconductor device including a plurality of IC chips arranged in a side-by-side relationship on a supporting member such as a tab is provided. Each of the IC chips is provided with an array of bonding pads for connection with the exterior of the device only along such side to which no other IC chip is disposed adjacent thereto.

Abstract: A simulation program conversion method and system is provided. The original simulation program is written by a function description language, such as Verilog-HDL, using a text editor, and, then, the original simulation program is converted into an executable program using a programming language, such as the C language, so that the simulation program may be compiled before execution. The speed of execution of the simulation program is significantly improved.