Abstract: An article of manufacture includes a medium with instructions that when read and executed by a processor, cause the processor to identify a code stream to be executed by a system-on-a-chip (SoC). The SoC is to include an open standard processor and hardware accelerators implemented in reprogrammable hardware. The processor is to, from the code stream, identify a first portion of the code stream to be executed as software by the open standard processor and a second portion to be executed in the accelerators, compile the first portion into a binary for execution by the open standard processor, and generate a hardware description for the second portion to be implemented by the hardware accelerators. The hardware description and the binary are to exchange data during execution of the code stream.

Abstract: Waveform circuitry and related apparatuses and methods are disclosed. An apparatus includes a memory device to store waveform data corresponding to a waveform, a processor, and a waveform circuitry to autonomously pre-process the waveform data independently from the processor and provide the pre-processed waveform data to one or more peripheral devices. A pre-processed waveform corresponding to the pre-processed waveform is data different from the waveform.

Abstract: An active inductor modulator circuit is provided. The active inductor modulator circuit may include a circuit to receive an input signal and provide an output signal at an output terminal of the circuit based on a clock signal, a modulated active inductor coupled to the circuit to improve a time delay between the input signal and the provided output signal, and a modulation clock circuit to generate a delayed clock signal to enable the modulated active inductor prior to a transition of the output signal from a first logic state to a second logic state.

Abstract: Common view time transfer and related apparatuses and methods are disclosed. An apparatus includes a receiver oscillator to provide a local clock signal and one or more processors. The one or more processors are to perform, at least partially based on the local clock signal, event time tagging pre-processing at least partially responsive to satellite signals received from one or more satellites to generate a decimated precision correction state estimate; determine, per satellite signal pseudo range residuals; determine a navigation engine clock state; perform a precision clock state pre-processing operation at least partially responsive to the navigation engine clock state and the decimated precision correction state estimate to generate a precision navigation clock state; and generate a common view real time report at least partially responsive to the per satellite signal pseudo range residuals and the precision navigation clock state.

Abstract: A metal-insulator-metal (MIM) capacitor includes a bottom electrode, an insulator cup formed on the bottom electrode, a top electrode formed in an opening defined by the insulator cup, a top electrode connection element electrically connected to the top electrode, a vertically-extending bottom electrode contact electrically connected to the bottom electrode, and a bottom electrode connection element electrically connected to the vertically-extending bottom electrode contact. The bottom electrode is formed in a lower metal layer. The insulator cup is formed in a tub opening in a dielectric region and includes a laterally extending insulator cup base formed on the bottom electrode and a vertically-extending insulator cup sidewall extending upwardly from the laterally extending insulator cup base. The top electrode connection element and bottom electrode connection element are formed in an upper metal layer.

Abstract: A fault event monitor and filter having a digital comparator receiving a digital input value, wherein the digital comparator generates a plurality of outputs based on programmable threshold input values, a first counter coupled to a first output of the plurality of outputs of the digital comparator, a second counter coupled to a second output of the plurality of outputs of the digital comparator, and an output controller with a first input coupled to an output of the first counter and with a second input coupled to an output of the second counter, wherein the output controller to generate a fault event signal based at least partially on signals received from the first and second counters.

Abstract: A system includes a metal tub structure formed in an integrated circuit (IC) structure, a first metal component, and a second metal component. The first metal component is formed from a first metal. The first metal component is formed in an opening defined by the metal tub structure, and includes a first metal first junction element, a first metal second junction element, and a first metal bridge electrically connected to the first metal first junction element and the first metal second junction element. The second metal component is formed from a second metal different than the first metal, and includes a second metal first junction element electrically connected to the first metal first junction element to define a first thermocouple junction, and a second metal second junction element electrically connected to the first metal second junction element to define a second thermocouple junction.

Abstract: A device for measuring phase noise, including a sampler to sample an input signal, an input filter to receive an input from the sampler, a noise generator to generate a noise signal, a combiner to receive input from, respectively, the input filter and the noise generator, the combiner to output an integrated noise output measurement. The input filter may operate in either the time domain or the frequency domain. The noise generate may generate a noise signal based on the sampler output, or may generate a noise estimate value based on the sampler output.

Abstract: Disclosed is a fault event detector configured to detect a fault injection event in an area of a chip that includes a vulnerable digital circuit. Such a fault event detector may include a bistable device that changes state at least partially in response to a presence of a fault injection event in a surrounding area of the fault event detector. Such a fault event detector may be arranged relative to a vulnerable digital circuit such that the vulnerable digital circuit is substantially located within the surrounding area of the first fault event detector.

Abstract: Disclosed embodiments of the present disclosure relate, generally, to systems, methods, and devices for correction of burst-errors induced during transmission of encoded blocks of information. Some embodiments relate to decoders configured to test candidate corrections on a received block of information and select a candidate correction that best fits the characteristics of burst-errors expected for a type of transmission scheme. Such tested candidate corrections may be selected based on characteristics of burst-errors typically induced for a type of transmission scheme. Some embodiments relate to decoders configured to test candidate corrections for correcting burst-errors and perform standard error correcting techniques such as Reed-Solomon forward error correction techniques. Some embodiments relate to systems, such as serial/deserializer interfaces, that incorporate such decoders.

Abstract: An device having an oscillator circuit modifiable between a first operating mode and a second operating mode, wherein the first operating mode has a first frequency accuracy and a first power consumption, wherein the second operating mode has a second frequency accuracy and a second power consumption, wherein the second frequency accuracy is more accurate than the first frequency accuracy and the second power consumption is higher than the first power consumption, and a control circuit in communication with the oscillator circuit to modify the operating mode of the oscillator circuit.

Abstract: An apparatus includes an adjustment circuit configured to receive a pulsed-width modulation (PWM) input, generate an adjusted PWM signal based upon the PWM input, and determine that a first pulse of the PWM input is shorter than a runt signal limit. The adjustment circuit is further configured to, in the adjusted PWM signal, extend the first pulse of the PWM input based on the determination that the PWM input is shorter than the runt signal limit, and output the adjusted PWM signal to an electronic device.

Abstract: An apparatus is provided comprising a first t-switch, which includes an input port arranged to be connected to a first voltage source, a center-tap port, and an output port arranged to be connected to a load. The first t-switch is configured to connect the input port to the output port in an on mode and disconnect the input port from the output port in an off mode. The apparatus further comprises a bias voltage generation circuit configured to generate a bias voltage, the generated bias voltage coupled to the center-tap port of the first t-switch, the bias voltage determined based upon an output port voltage.

Abstract: A PWM lighting bridge manages hardware PWM compensation components. One or more PWM outputs are driven based upon a master PWM input signal. The master PWM input signal is processed through a mapping function to produce a desired output signal(s) on the one or more PWM outputs. The mapping function comprises a set of compensation bins having a maxim input duty cycle, a minimum input duty cycle and an output duty cycle. The mapping process selects a bin based on determining whether the input duty cycle is within the minimum and maximum duty cycle ranges of the bins and then uses the specified output duty cycle for the one or more PWM outputs. The PWM lighting bridge provides configuration and runtime management of the hardware PWM compensation components. Read/write access to the PWM compensation bins provides customizable configurations of the input and output PWM characteristics.

Abstract: A thin film resistor (TFR) module may be formed in copper interconnect in an integrated circuit device. A pair of displacement-plated TFR heads may be formed by forming a pair of copper TFR head elements (e.g., damascene trench elements) spaced apart from each other in a dielectric region, and displacement plating a barrier region on each TFR head element to form a displacement-plated TFR head. A TFR element may be formed on the pair of displacement-plated TFR heads to define a conductive path between the pair of TFR head elements through the TFR element and through the displacement-plated barrier region on each metal TFR head. Conductive contacts may be formed connected to the pair of displacement-plated TFR heads. The displacement-plated barrier regions may protect the copper TFR heads from copper corrosion and/or diffusion, and may comprise CoWP, CoWB, Pd, CoP, Ni, Co, Ni—Co alloy, or other suitable material.

Abstract: A thin-film resistor (TFR) module is formed in an integrated circuit device. The TFR module includes a pair of metal TFR heads (e.g., copper damascene trench structures), a TFR element formed directly on the metal TFR heads to define a conductive path between the pair of TFR heads through the TFR element, and TFR contacts connected to the TFR heads. The TFR heads may be formed in a metal interconnect layer, along with various interconnect elements of the integrated circuit device. The TFR element may be formed by depositing and patterning a TFR element/diffusion barrier layer over the TFR heads and interconnect elements formed in the metal interconnect layer. The TFR element may be formed from a material that also provides a barrier against metal diffusion (e.g., copper diffusion) from each metal TFR head and interconnect element. For example, the TFR element may be formed from tantalum nitride (TaN).

Abstract: A hermetically sealed semiconductor die package having a sidewall structure having a first opening and a second opening; a lid attached to the sidewall structure to hermetically seal the first opening; a substrate attached to the sidewall structure to hermetically seal the second opening, wherein the substrate comprises first, second, and third apertures; a first button attached to the substrate to hermetically seal the first aperture; a second button attached to the substrate to hermetically seal the second aperture; and a third button attached to the substrate to hermetically seal the third aperture.

Abstract: A thin film resistor (TFR) module includes a metal cup structure, a dielectric liner region, a TFR element, and a pair of TFR heads electrically connected to the TFR element. The metal cup structure includes a laterally-extending metal cup base and multiple metal cup sidewalls extending upwardly from the laterally-extending metal cup base. The dielectric liner region is formed in an opening defined by the metal cup structure. The TFR element is formed in an opening defined by the dielectric liner region, wherein the TFR element is insulated from the metal cup structure by the dielectric liner region.

Abstract: Disclosed embodiments relate to sensing states and changes of states of a signal and sensors for the same, including but not limited to, autonomous sensors. Such sensor may include an analog signal threshold detection circuit, a state detection circuit, and a measurement circuit. The analog signal threshold detection circuit may be configured to alternately assert and de-assert a threshold detected indication in response to an input signal and a state thereof. The state detection circuit may be configured to generate a signal state indication about a state of the input signal. The measurement circuit may be configured to generate a measurement in response to assertions of the threshold detected indication and the signal state indication, such as a count, a slew rate, or a frequency. In some embodiments, disclosed sensors may have programmable thresholds for sensing the signal states and changes therein.

Abstract: Systems, methods and devices relate to remote temperature sensing responsive to fractional currents used to bias a remote temperature diode. Fractional currents may be selected to simplify at least some temperature calculations performed using digital logic. Values of at least two voltage changes may be determined at least partially based on values of voltages generated across a pair of nodes at least partially responsive to excitation currents. Such pair of nodes associated with sensing paths coupled with a remote diode. A value of temperature may be determined at least partially based on the values of at least two voltage changes and a stored value of a fractional mirror ratio. The fractional mirror ratio represents a relationship between current magnitudes of excitation currents.