Abstract: Methods, systems, and devices for cache management in a memory subsystem are described. An interface controller may include a first buffer and a second buffer. The interface controller may use the first and second buffers to facilitate operating a volatile memory as a cache for a non-volatile memory. During an access operation, the interface controller may use the buffer to transfer data between the volatile memory, non-volatile memory, and another device. In response to the access operation, the interface controller may use the second buffer to transfer second data from the volatile memory to the non-volatile memory.

Abstract: Memories might include an array of memory cells including a string of series-connected split-gate memory cells, and a controller configured to cause the memory to selectively activate a first memory cell portion of a selected split-gate memory cell of the string of series-connected split-gate memory cells in response to a data state of the first memory cell portion of the selected split-gate memory cell and deactivate a second memory cell portion of the selected split-gate memory cell, and activate a second memory cell portion of each remaining split-gate memory cell of the string of series-connected split-gate memory cells while selectively activating the first memory cell portion of the selected split-gate memory cell and deactivating the second memory cell portion of the selected split-gate memory cell.

Abstract: Disclosed is a system that comprises a memory device and a processing device, operatively coupled with the memory device, to perform operations that include, responsive to detecting a triggering event, selecting a family of memory blocks of the memory device, the selected family being associated with a set of bins, each bin associated with a plurality of read voltage offsets to be applied to base read voltages during read operations. The operations performed by the processing device further include calibration operations to determine data state metric values characterizing application of read voltage offsets of various bins. The operations performed by the processing device further include identifying, based on the determined data state metrics, a target bin and associating the selected family with the target bin.

Abstract: Semiconductor assemblies and packages using edge stacking and associated systems and methods are disclosed herein. A semiconductor package may include (1) a base substrate having a base surface, (2) one or more dies attached over the base surface, and (3) a mold material encapsulating the base substrate and the one or more dies. The package may further include connectors on a side surface thereof, wherein the connectors are electrically coupled to the base substrate and/or the one or more dies. The connectors may be further configured to electrically couple the package to one or more neighboring semiconductor packages and/or electrical circuits.

Abstract: A method of forming a microelectronic device comprises forming openings in an interdeck region and a first deck structure, the first deck structure comprising alternating levels of a first insulative material and a second insulative material, forming a first sacrificial material in the openings, removing a portion of the first sacrificial material from the interdeck region to expose sidewalls of the first insulative material and the second insulative material in the interdeck region, removing a portion of the first insulative material and the second insulative material in the interdeck region to form tapered sidewalls in the interdeck region, removing remaining portions of the first sacrificial material from the openings, and forming at least a second sacrificial material in the openings. Related methods of forming a microelectronic devices and related microelectronic devices are disclosed.

Abstract: An electronic device comprises a stack of alternating dielectric materials and conductive materials, a pillar region extending vertically through the stack, an oxide material within the pillar region and laterally adjacent to the dielectric materials and the conductive materials of the stack, and a storage node laterally adjacent to the oxide material and within the pillar region. A charge confinement region of the storage node is in horizontal alignment with the conductive materials of the stack. A height of the charge confinement region in a vertical direction is less than a height of a respective, laterally adjacent conductive material of the stack in the vertical direction. Related methods and systems are also disclosed.

Abstract: Some embodiments include a ferroelectric transistor. The transistor has gate dielectric material configured as a first container, with the first container having a first inner surface. Metal-containing material is configured as a second container nested within said first container. The second container has a second inner surface with an area less than the first inner surface. Ferroelectric material is configured as a third container nested within the second container. The third container has a third inner surface with an area less than the second inner surface. Gate material is within the third container. Some embodiments include memory arrays having ferroelectric transistors as memory cells. Some embodiments include methods of writing/reading relative to memory cells of memory arrays when the memory cells are metal-ferroelectric-metal-insulator-semiconductor (MFMIS) transistors.

Abstract: A memory system includes a memory device comprising a value data block a content addressable memory (CAM) block storing a plurality of stored search keys. The memory system further includes a processing device that receives an input search key, identifies, from the plurality of stored search keys in a CAM block of a memory device, multiple redundant copies of a stored search key that match the input search key, and determines a plurality of locations in a value data block, the plurality of locations corresponding to the multiple redundant copies, wherein one of the plurality of locations comprises a first timestamp and data representing a value associated with the input search key, and wherein a remainder of the plurality of locations comprises one or more additional timestamps.

Abstract: Systems, methods and apparatuses of distributed computing based on memory as a service are described. For example, a set of networked computing devices can each be configured to execute an application that accesses memory using a virtual memory address region. Each respective device can map the virtual memory address region to the local memory for a first period of time during which the application is being executed in the respective device, map the virtual memory address region to a local memory of a remote device in the group for a second period of time after starting the application in the respective device and before terminating the application in the respective device, and request the remote device to process data in the virtual memory address region during at least the second period of time.

Abstract: Apparatuses and methods for performing concurrent memory access operations for different memory planes are disclosed herein. An example apparatus may include a memory array having a plurality of memory planes. Each of the plurality of memory planes comprises a plurality of memory cells. The apparatus may further include a controller configured to receive a group of memory command and address pairs. Each memory command and address pair of the group of memory command and address pairs may be associated with a respective memory plane of the plurality of memory planes. The internal controller may be configured to concurrently perform memory access operations associated with each memory command and address pair of the group of memory command and address pairs regardless of page types associated with the pairs of the group (e.g., even if two or more of the memory command and address pairs may be associated with different page types).

Abstract: A memory device includes a memory cell array and a set of fuse banks including a common fuse bank storing common bit information corresponding to a plurality of defective memory cells in the memory cell array. The memory device including a plurality of match sub-circuits corresponding to respective defective memory cells of the plurality of defective memory cells. Each match sub-circuit can be configured to provide a determination of whether a memory cell address of a memory cell of the memory cell array matches an address of the respective defective memory cell. The plurality of match sub-circuit can include a shared common bit-processing circuit that is configured to receive common bit-by-bit results of a comparison between a portion of the memory cell address and the common bit information. The common bit-processing circuit can determine whether the common bit information matches the portion of the memory cell address.

Abstract: Methods, systems, and devices for masked training and analysis with a memory array are described. A memory device may operate in a first mode in which a maximum transition avoidance (MTA) decoder for a memory array of the memory device is disabled. During the first mode, the memory device may couple an input node of the MTA decoder with a first output node of a first decoder, such as a first pulse amplitude modulation (PAM) decoder. The memory device may operate in a second mode in which the MTA decoder for the memory array is enabled. During the second mode, the memory device may couple the input node of the MTA decoder with a second output node of a second decoder, such as a second PAM decoder.

Abstract: A liner is formed laterally-outside of individual channel-material strings in one of first tiers and in one of second tiers. The liners are isotropically etched to form void-spaces in the one second tier above the one first tier. Individual of the void-spaces are laterally-between the individual channel-material strings and the second-tier material in the one second tier. Conductively-doped semiconductive material is formed against sidewalls of the channel material of the channel-material strings in the one first tier and that extends upwardly into the void-spaces in the one second tier. The conductively-doped semiconductive material is heated to diffuse conductivity-increasing dopants therein from the void-spaces laterally into the channel material laterally there-adjacent and upwardly into the channel material that is above the void-spaces.

Abstract: An apparatus includes circuitry configured to generate multiple results, each result using a different read voltage, in response to one or each received data access command. The multiple read results may be used to dynamically calibrate a read voltage assigned to generate a read result in response to a read command.

Abstract: Implementations of the present disclosure are directed to systems and methods for mapping point-to-point channels to packet virtual channels. A chip with an point-to-point interface converts point-to-point data to a packet format. The point-to-point channels are mapped to virtual channels of the packet transmission protocol. Information from multiple point-to-point channels may be combined in a single packet. Among the benefits of implementations of the present disclosure is that point-to-point devices may be connected to a packetized network without losing the benefits of separate channels for different types of communication. This allows existing point-to-point devices to communicate using a packetized network without internal modification or performance degradation.

Abstract: A plurality of signals within a memory sub-system are analyzed by a signal analyzer component. Relevant signals among the plurality of signals are determined by the signal analyzer component such that the relevant signals comprise a subset of signals among the plurality of signals. Information corresponding to the relevant signals is sampled by the signal analyzer component and the signal analyzer component is responsible for extracting the information corresponding to the relevant signals among the plurality of signals.

Abstract: Encapsulation warpage reduction for semiconductor die assemblies, and associated methods and systems are disclosed. In one embodiment, a semiconductor die assembly includes an interface die, a stack of semiconductor dies attached to a surface of the interface die, where the stack of semiconductor dies has a first height from the surface. The semiconductor die assembly also includes an encapsulant over the surface and surrounding the stack of semiconductor dies, where the encapsulant includes a sidewall with a first portion extending from the surface to a second height less than the first height and a second portion extending from the second height to the first height. Further, the first portion has a first texture and the second portion has a second texture different from the first texture.

Abstract: Methods, systems, and devices for a memory device with an error correction memory device with fast data access are described. For example, during a read operation, a memory device may be configured to output the data indicated by the read operation concurrent with performing an error correction operation. If the memory device detects an error, the memory device may indicate the error to a host device and, in some cases, output the corrected data to the host device. During a write operation, the memory device may store error detection or correction information associated with data to be stored at the memory device. The memory device may, in some cases, store error detection or correction information generated by the host device.

Abstract: A cache system having cache sets, and the cache sets having a first cache set configured to provide a first physical output upon a cache hit and a second cache set configured to provide a second physical output upon a cache hit. The cache system also has a control register and a mapping circuit coupled to the control register to map respective physical outputs of the cache sets to a first logical cache and a second logical cache according to a state of the control register. The first logical cache can be a normal or main cache for non-speculative executions by a processor and the second logical cache can be a shadow cache for speculative executions by the processor.

Abstract: Methods, systems, and devices for cache architectures for memory devices are described. For example, a memory device may include a main array having a first set of memory cells, a cache having a second set of memory cells, and a cache delay register configured to store an indication of cache addresses associated with recently performed access operations. In some examples, the cache delay register may be operated as a first-in-first-out (FIFO) register of cache addresses, where a cache address associated with a performed access operation may be added to the beginning of the FIFO register, and a cache address at the end of the FIFO register may be purged. Information associated with access operations on the main array may be maintained in the cache, and accessed directly (e.g., without another accessing of the main array), at least as long as the cache address is present in the cache delay register.