Abstract: A magnetic detection device that comprises an amplification circuit amplifying a detection signal from a magnetic sensor that is positioned, for example, in a location where an alternating current magnetic field enters as noise, and detects an alternating current magnetic field targeted for monitoring, said magnetic detection device further comprising: timer circuits that are activated in response to a change in the output of the amplification circuit, and if these clock a prescribed time, the outputs thereof change; a logic circuit that treats the outputs of the timer circuits as inputs; and an oscillation circuit for generating an operation clock signal for the timer circuits. The timer circuits are structured such that if the output of the amplification circuit changes to a different direction before the clocking of the prescribed time is complete, the timer circuits are reset.

Abstract: This radar device can recognize the type of a specific target (in particular, a two-wheeled vehicle) with high precision, using only the radar device. The radar device comprises: a transmission unit that transmits a transmission wave, based on a transmission signal, toward the target; a receiving unit that receives a reflected wave generated by the transmission wave being reflected by the target, and thereby generates a reception signal; and a target detection unit that acquires information on the target on the basis of the transmission signal and the reception signal. The target detection unit calculates the relative speeds of a plurality of detection points within the same target, and determines the type of the target on the basis of the spread of the relative speeds.

Abstract: A sensing device includes a lead frame, a first insulating film, a semiconductor integrated circuit chip provided over the lead frame via the first insulating film, and a first bonding wire via which an external derivation lead and the semiconductor integrated circuit chip are electrically coupled to each other. The sensing device includes a sensor chip disposed over the semiconductor integrated circuit chip such that a first surface of the sensor chip faces the semiconductor integrated circuit chip. The sensing device includes a sensor provided on a second surface of the sensor chip. The sensing device includes a molding resin with which the lead frame, the semiconductor integrated circuit chip, the sensor chip, and the first bonding wire are sealed. The sensor chip is electrically coupled to the semiconductor integrated circuit chip, and the molding resin has an opening in which the sensor is exposed.

Abstract: A ranging device includes a light emitting circuit configured to emit light and a splitter configured to split the light into multiple beams. The ranging device includes a scanning circuit configured to perform scanning in two axial directions while aiming the multiple beams toward an emission area. The ranging device includes multiple light receiving circuits configured to respectively receive beams obtained from the multiple beams that are reflected or scattered by an object existing in the emission area, the light receiving circuits being configured to respectively output light reception signals. The ranging device includes a distance-information outputting circuit configured to output distance information about the object, the distance information being obtained based on each of the light reception signals that is output from a corresponding light receiving circuit among the multiple light receiving circuits.

Abstract: A light scanning apparatus includes a light source configured to intermittently emit light based on an irradiation timing signal; a mirror configured to reflect the light emitted by the light source; an actuator configured to cause the mirror to be deflected based on drive signals; a sensor configured to output a signal according to deflection of the mirror; an irradiation timing adjusting-unit configured to adjust the irradiation timing signal based on the output signal of the sensor; and an irradiation timing storage configured to store the adjusted irradiation timing signal.

Abstract: A secondary-battery protection circuit is configured to, in response to detecting that a first switching circuit is turned on and a second switching circuit is turned on, supply a first output voltage to a first load between a first terminal and a second terminal; and supply a third output voltage to a second load between the first terminal and a third terminal, the third output voltage indicating the sum of the first output voltage and a second output voltage, the second output voltage corresponding to a voltage across a second secondary battery. In response to detecting that the first switching circuit is turned off and the second switching circuit is turned on, the secondary-battery protection circuit is configured to stop supplying the first output voltage to the first load; and stop supplying the third output voltage via the first terminal and the third terminal.

Abstract: The push switch 1 includes a case 2, a pair of contacts 3 and 4, a movable contact 5, a cap 7 covering the case 2 from the upper side, and a cover 8 pressing the cap 7 from the upper side. The cover 8 includes a top plate 81 and a pair of extending portions 83 extending downward from opposite sides of the top plate 81. Each of the extending portions 83 of the cover 8 has a pair of leg portions 831 extending downward and a bridge portion 832 connecting the pair of leg portions 831. The bridge portion 832 has a pair of inclined portions 8321 formed at the lower end portion of the bridge portion 832 and inclined outward, and a cutout portion 8322 formed between the pair of inclined portions 8321.

Abstract: A method for manufacturing a semiconductor device includes providing a wafer that includes a device region and a peripheral region of the device region, the device region including multiple chip regions. The method includes removing a portion of the peripheral region such that the removed portion has an annular shape. The method includes forming a protective layer on a first surface of the wafer. The method includes grinding a second surface of the wafer in which the protective layer is formed on the first surface.

Abstract: A lens drive device is provided with a first fixed part, a first movable part, a first supporting part, and a Z-direction drive unit which moves the first movable section in an optical axis direction (the Z-direction) relative to the first fixed part and is constituted by an ultrasonic motor that converts vibration motion into rotational motion. The lens drive device further has a rotating body which rotates around the optical axis in response to rotational motion of the Z-direction drive unit, and a mechanical element which converts the rotational motion of the rotating body into linear motion in the optical axis direction, the first movable part being moved in the optical axis direction by rotation of the rotating body.

Abstract: A power control semiconductor device includes a voltage control transistor, a control circuit, a bias circuit, and external terminals. The voltage control transistor is connected between a voltage input terminal and an output terminal. The bias circuit generates a voltage that operates the control circuit. Output control signals provided from an outside are input to the external terminals to control an output voltage. The control circuit includes an error amplifier and a logic circuit. The error amplifier outputs a voltage corresponding to a potential difference between a reference voltage and a voltage divided by a voltage divider that divides the output voltage. The logic circuit generates: a signal that changes the divided voltage in accordance with the output control signals; and a signal that stops operation of the bias circuit in response to a combination of the output control signals.

Abstract: A DC power supply device includes a switching power supply and a current stabilizing circuit connected in a pre-stage or a post-stage of the switching power supply. The DC power supply voltage device is configured to receive an input DC voltage from a DC power source via a power-supply line, convert the input DC voltage into a different DC voltage, and output the converted DC voltage.

Abstract: A humidity sensor includes a lower electrode formed above a substrate, a first humidity sensing film covering the lower electrode, an upper electrode formed above the first humidity sensing film, and a second humidity sensing film covering the upper electrode and making contact with the first humidity sensing film through openings of the upper electrode. The upper electrode has a predetermined opening pattern. The area of the upper electrode is larger than the area of the lower electrode, and is smaller than the area of the first humidity sensing film.

Abstract: This distance measuring camera contains a first optical system for collecting light from a subject to form a first subject image, a second optical system for collecting the light from the subject to form a second subject image, an imaging unit for imaging the first subject image formed by the first optical system and the second subject image formed by the second optical system, and a distance calculating part 4 for calculating a distance to the subject based on the first subject image and second subject image imaged by the imaging part. The distance calculating part 4 calculates the distance to the subject based on an image magnification ratio between a magnification of the first subject image and a magnification of the second subject image.

Abstract: A rotary reciprocating drive actuator capable of increasing the size and amplitude of a movable object such as a mirror, and of stabilizing the drive performance is provided. The rotary reciprocating drive actuator includes a movable part including a rotating shaft, a fixed part supporting the rotating shaft, and a driving part that includes a coil and a core disposed on the fixed part and a magnet disposed on the rotating shaft, and rotates the rotating shaft about the axis thereof with respect to the fixed part by utilizing electromagnetic interaction. The fixed part includes first and second supports disposed so as to face each other with the magnet therebetween in the axial direction. The rotating shaft is rotatably attached to the first and second supports via first and second bearings. One of the first and second bearings is a rolling bearing, and the other is a slide bearing.

Abstract: Disclosed is a reset semiconductor integrated circuit that outputs a reset signal in response to a power supply voltage of a monitoring target becoming lower than a predetermined level, the reset semiconductor integrated circuit including: a voltage detection circuit; an output stage including a CMOS circuit that generates and outputs a signal according to a detection result of the voltage detection circuit; a monitored voltage input terminal to which the power supply voltage of the monitoring target is input; a reference potential terminal to which a voltage as a reference potential of a circuit is applied; an external voltage terminal which is connected to a power supply voltage terminal of the output stage to allow a power supply voltage as an operation voltage of the output stage to be applied from outside; and an output terminal to output the signal generated by the output stage.

Abstract: The distance-measuring camera contains a first optical system for forming a first subject image, a second optical system for forming a second subject image, an imaging part for imaging the first subject image and the second subject image and a distance calculating part for calculating a first candidate for a distance to the subject based on an image magnification ratio between a magnification of the first subject image imaged by the imaging part and a magnification of the second subject image imaged by the imaging part and a second candidate for the distance to the subject based on a parallel disparity between the first subject image and the second subject image. The distance calculating part selects either one of the first candidate and the second candidate as the distance to the subject according to a predetermined condition.

Abstract: A lens driving device, a camera module and a camera mounting device are provided, which are capable of ensuring a high reliability, improving the OIS sensitivity, and simplifying the assembly operation. The lens driving device includes an auto-focusing driving part and a shake-correcting driving part utilizing a voice coil motor. A shake-correcting magnet part of the shake-correcting driving part is comprised of two shake-correcting magnets disposed on two orthogonal sides of four sides that define a rectangle in a plane perpendicular to the light axis direction. An auto-focusing magnet part of the auto-focusing driving part is comprised of at least one of the shake-correcting magnets. An auto-focusing supporting part of the auto-focusing driving part is fixed on at least one side of the rectangle where the auto-focusing magnet part is not disposed, and elastically supports an auto-focusing movable part with respect to an auto-focusing fixing part in a cantilever fashion.

Abstract: A lens driving device includes: a movable part for accommodating a lens; and an ultrasonic motor having a resonance part configured to move the movable part by motion of the resonance part of the ultrasonic motor. The resonance part has a pair of arms, and is disposed such that only one of the arms is in contact with the movable part.

Abstract: Parking detection sensor (100) has a Doppler sensor (110), a magnetic sensor (120) that detects magnetism on XYZ axes, a change point detection unit (130) that detects a change point in the output of the Doppler sensor (110) and the magnetic sensor (120), a level difference detection unit (140) that detects the magnetic level difference over time in the output of the Doppler sensor (110) and the magnetic sensor (120), and a state assessment unit (150) that assesses the parking state of a vehicle on the basis of the detection results of the change point detection unit (130) and the detection results of the level difference detection unit (140).

Abstract: An optical deflection apparatus includes an optical deflection part configured to deflect light incident on a reflection surface by swinging the reflection surface about a swing axis, and a light transmission plate configured to transmit the light deflected by the optical deflection part, wherein an inclination angle of the light transmission plate with reference to a reference surface is equal to or greater than twice a maximum swing angle of the reflection surface with reference to the reference surface.