Patents Assigned to Momentive Performance Materials Japan LLC
  • Publication number: 20220267533
    Abstract: A thermally conductive polysiloxane composition includes (A) a thermally conductive filler and (B) one or more compounds selected from an alkoxysilyl group-containing compound and a dimethylpolysiloxane, wherein: component (A) includes (A-1) round, indefinite-shaped or polyhedral aluminum nitride particles having an average particle diameter of from 50 ?m to 150 ?m and (A-2) round, indefinite-shaped or polyhedral aluminum nitride particles having an average particle diameter of 10 ?m or more but less than 50 ?m in an amount of from 20% by mass to 100% by mass relative to the total amount of component (A); and the content ratio of component (A-1) to component (A-2) is from 50:50 to 95:5 on a mass basis.
    Type: Application
    Filed: June 24, 2020
    Publication date: August 25, 2022
    Applicant: MOMENTIVE PERFORMANCE MATERIALS JAPAN LLC
    Inventors: Atsushi SAKAMOTO, Sean CONTE
  • Patent number: 11359124
    Abstract: The present invention relates to a thermally conductive polysiloxane composition comprising: (A) a thermally conductive filler, (B) a siloxane compound having a specified structure; (C) an alkoxysilane compound having a specified structure; (D) a polyorganosiloxane containing at least one aliphatic unsaturated group per molecule; (E) a polyorganohydrogensiloxane having two or more hydrogen atoms bonded to silicon atoms per molecule; and (F) a platinum-based catalyst.
    Type: Grant
    Filed: May 31, 2018
    Date of Patent: June 14, 2022
    Assignee: MOMENTIVE PERFORMANCE MATERIALS JAPAN LLC
    Inventors: Kenji Takenaka, Atsushi Sakamoto
  • Patent number: 11286349
    Abstract: A siloxane compound represented by the general formula (1): where R1 is a group having an alkoxysilyl group having 1 to 4 carbon atoms, R2 is a linear organosiloxy group represented by the general formula (2): where each R4 is independently a monovalent hydrocarbon group having 1 to 12 carbon atoms, Y is a monovalent hydrocarbon group having 1 to 6 carbon atoms, and d is an integer of 10 to 50, each X is independently a divalent hydrocarbon group having 2 to 10 carbon atoms, each of a and b is independently an integer of 1 or more, c is an integer of 0 or more, a+b+c is an integer of 4 or more, and each R3 is independently a monovalent hydrocarbon group having 1 to 6 carbon atoms.
    Type: Grant
    Filed: July 20, 2017
    Date of Patent: March 29, 2022
    Assignee: MOMENTIVE PERFORMANCE MATERIALS JAPAN LLC
    Inventors: Eiji Tanigawa, Masanori Takanashi, Isao Iida, Daigo Hirakawa, Kenji Takenaka
  • Publication number: 20220081589
    Abstract: There is provided an aqueous coating agent composition that does not contain an organotin compound and forms a coating film having good slipperiness and having excellent adhesiveness (adhesion) and abrasion resistance. The aqueous coating agent composition contains: (A) polydiorganosiloxane having both terminals blocked with hydroxyl groups, the polydiorganosiloxane having a viscosity of 50 to 100,000,000 mPa·s (at 25° C.); (B) polyorganohydrogensiloxane having at least three hydrogen atoms in one molecule; (C) a zinc compound as a curing catalyst; (D) an organic compound and/or polyorganosiloxane having at least one of a primary amino group and a secondary amino group; (E) an adhesion improving component; and (F) spherical particles.
    Type: Application
    Filed: November 23, 2021
    Publication date: March 17, 2022
    Applicant: MOMENTIVE PERFORMANCE MATERIALS JAPAN LLC
    Inventor: Masanori KIMURA
  • Publication number: 20220056326
    Abstract: An adhesive polyorganosiloxane composition includes, at a specific composition ratio: (A) a linear polyorganosiloxane containing an alkenyl group including a low-viscosity linear polyorganosiloxane containing an alkenyl group; (B) a polyorganosiloxane containing at least three alkenyl groups in the molecule; (C1) a polyorganohydrogensiloxane having 3 or more hydrogen atoms bonded to a silicon atom in the molecule; (C2) a linear polyorganohydrogensiloxane having one hydrogen atom bonded to a silicon atom only at both terminals of the molecular chain, and having no aliphatic unsaturated bonds in the molecule; (D) a filler; (E) a platinum group metal compound; and (F) two or more kinds of specific adhesion imparting agent.
    Type: Application
    Filed: December 23, 2019
    Publication date: February 24, 2022
    Applicant: MOMENTIVE PERFORMANCE MATERIALS JAPAN LLC
    Inventors: Koki OTASHIRO, Koji MIYATA, Masanori TAKANASHI
  • Patent number: 11254849
    Abstract: A method for producing a polyorganosiloxane resin composition including: (a) mixing a thermally-conductive filler having a particle size distribution having a single peak, with a surface treatment agent containing a siloxane to form a mixture, and (b) mixing the mixture from step (a) with a polysiloxane resin.
    Type: Grant
    Filed: November 2, 2016
    Date of Patent: February 22, 2022
    Assignee: MOMENTIVE PERFORMANCE MATERIALS JAPAN LLC
    Inventors: Eiji Tanigawa, Masanori Takanashi, Isao Iida, Daigo Hirakawa, Kenji Takenaka
  • Publication number: 20210395582
    Abstract: An adhesive polyorganosiloxane composition includes: (A) a polyorganosiloxane having 2 or more alkenyl groups in each molecule thereof; (B) a polyorganohydrodienesiloxane having 3 or more hydrogen atoms bonded to a silicon atom in each molecule thereof; (C) a platinum-based catalyst; (D) at least two kinds of adhesion-imparting agents selected from the group consisting of specific organic silicon compounds, silane compounds, tetraalkoxysilane compounds, and/or partial hydrolysis condensates thereof; (E) hexamethyldisilazane; (F) water; and (G) at least one of (G1) and (G2), where (G1) is a non-surface-treated inorganic filler having a BET specific surface area of 50 to 500 m2/g, and (G2) is an inorganic filler obtained by surface-treating said (G1) with hexamethyldisilazane.
    Type: Application
    Filed: November 13, 2019
    Publication date: December 23, 2021
    Applicant: MOMENTIVE PERFORMANCE MATERIALS JAPAN LLC
    Inventor: Masanori TAKANASHI
  • Publication number: 20210317313
    Abstract: A thermally conductive polysiloxane composition comprising: (A) a thermally conductive filler; (B) a polyorganosiloxane resin having a curable functional group in the polysiloxane molecule, the polyorganosiloxane resin comprising at least one polysiloxane (b1) having one curable functional group in the molecule thereof; (C) a siloxane compound having an alkoxysilyl group and a linear siloxane structure; (D) a hydrogenpolyorganosiloxane; and (E) a platinum catalyst, wherein the content of the polysiloxane (b1) having one curable functional group in the molecule thereof in the polyorganosiloxane resin (B) is more than 80% by mass.
    Type: Application
    Filed: June 24, 2021
    Publication date: October 14, 2021
    Applicant: MOMENTIVE PERFORMANCE MATERIALS JAPAN LLC
    Inventors: Atsushi SAKAMOTO, Isao IIDA
  • Patent number: 11142644
    Abstract: The present invention relates to a thermally conductive polysiloxane composition that provides a cured product having excellent tackiness and flexibility in which the composition contains (A) a thermally conductive filler, (B) a siloxane compound having an alkoxysilyl group and a linear siloxane structure, (C) a polyorganosiloxane having at least two alkenyl groups bonded to silicon atoms per molecule, (D1) a linear polyorganohydrogensiloxane represented by the general formula (4), (D2) a polyorganohydrogensiloxane having per molecule at least three units represented by the general formula (5), and (E) a platinum catalyst.
    Type: Grant
    Filed: January 25, 2018
    Date of Patent: October 12, 2021
    Assignee: MOMENTIVE PERFORMANCE MATERIALS JAPAN LLC
    Inventors: Daigo Hirakawa, Masanori Takanashi, Atsushi Sakamoto
  • Patent number: 11118056
    Abstract: A thermally conductive polysiloxane composition includes (A) a thermally conductive filler, and (B) at least one member selected from the group consisting of an alkoxysilyl group-containing compound and a dimethylpolysiloxane. The component (A) includes at least two thermally conductive fillers having different average particle diameters, and (A-1) indefinite-shaped aluminum nitride particles having an average particle diameter of 30 ?m to 150 ?m in an amount of at least 20% by mass, based on the mass of a total of the component (A).
    Type: Grant
    Filed: July 20, 2017
    Date of Patent: September 14, 2021
    Assignee: MOMENTIVE PERFORMANCE MATERIALS JAPAN LLC
    Inventors: Daigo Hirakawa, Masanori Takanashi, Isao Iida, Kenji Takenaka, Eiji Tanigawa
  • Publication number: 20210277241
    Abstract: There is provided a polyorganosiloxane composition capable of providing a cured product which has low hardness, high transparency, high tensile strength, and low surface tackiness. A curable polyorganosiloxane composition includes: (A) alkenyl group-containing polyorganosiloxane containing straight-chained polyorganosiloxane composed of (A1) both ends alkenyl group polyorganosiloxane having a predetermined viscosity and (A2) polyorganosiloxane having a predetermined viscosity and having 0.6 or more and less than 2 alkenyl groups on average, and (A3) resinous polyorganosiloxane; (B) polyorganohydrogensiloxane composed of (B1) both ends Si—H-containing straight-chained polyorganosiloxane, and (B2) polyorganosiloxane having 3 or more Si—H; and (C) a hydrosilylation reaction catalyst, in mounts that satisfy predetermined relationships.
    Type: Application
    Filed: May 24, 2021
    Publication date: September 9, 2021
    Applicant: MOMENTIVE PERFORMANCE MATERIALS JAPAN LLC
    Inventors: Kikuo MOCHIZUKI, Masahiro FUJITA
  • Publication number: 20210260833
    Abstract: There is provided an adhesive application apparatus capable of efficiently applying an adhesive without inhibiting curing of the adhesive. An adhesive application apparatus of the present invention includes a mounting table 10, an adhesive dosing unit 20, and an ultraviolet irradiation unit 30, and it applies a delayed-ultraviolet-curable adhesive 200 to a surface of a panel 100. The panel 100 is mounted on a mounting surface S10 of the mounting table 10. The adhesive dosing unit 20 applies the adhesive 200 to the surface of the panel 100 mounted on the mounting table 10 by discharging the adhesive 200 from an adhesive dosing port H20. The ultraviolet irradiation unit 30 irradiates the adhesive 200 dosed from the adhesive dosing port H20 with ultraviolet light L. Here, the ultraviolet irradiation unit 30 irradiates the adhesive 200 with the ultraviolet light L along the mounting surface S10 before the adhesive 200 dosed from the adhesive dosing port H20 is applied to the surface of the panel 100.
    Type: Application
    Filed: May 12, 2021
    Publication date: August 26, 2021
    Applicant: MOMENTIVE PERFORMANCE MATERIALS JAPAN LLC
    Inventors: Makoto SAKAKIBARA, Hiroyuki UENO
  • Patent number: 11084927
    Abstract: A thermally conductive polysiloxane composition includes (A) a thermally conductive filler, and (B) at least one member selected from the group consisting of an alkoxysilyl group-containing compound and a dimethylpolysiloxane. The component (A) includes at least two thermally conductive fillers having different average particle diameters, and (A-1) indefinite-shaped aluminum nitride particles having an average particle diameter of 30 ?m to 150 ?m in an amount of at least 20% by mass, based on the mass of a total of the component (A).
    Type: Grant
    Filed: July 20, 2017
    Date of Patent: August 10, 2021
    Assignee: MOMENTIVE PERFORMANCE MATERIALS JAPAN LLC
    Inventors: Daigo Hirakawa, Masanori Takanashi, Isao Iida, Kenji Takenaka, Eiji Tanigawa
  • Publication number: 20210147633
    Abstract: A siloxane compound represented by the general formula (1): where R1 is a group having an alkoxysilyl group having 1 to 4 carbon atoms, R2 is a linear organosiloxy group represented by the general formula (2): where each R4 is independently a monovalent hydrocarbon group having 1 to 12 carbon atoms, Y is a monovalent hydrocarbon group having 1 to 6 carbon atoms, and d is an integer of 10 to 50, each X is independently a divalent hydrocarbon group having 2 to 10 carbon atoms, each of a and b is independently an integer of 1 or more, c is an integer of 0 or more, a+b+c is an integer of 4 or more, and each R3 is independently a monovalent hydrocarbon group having 1 to 6 carbon atoms.
    Type: Application
    Filed: July 20, 2017
    Publication date: May 20, 2021
    Applicant: MOMENTIVE PERFORMANCE MATERIALS JAPAN LLC
    Inventors: Eiji TANIGAWA, Masanori TAKANASHI, Isao IIDA, Daigo HIRAKAWA, Kenji TAKENAKA
  • Publication number: 20210147738
    Abstract: A thermally conductive polysiloxane composition includes (A) a thermally conductive filler, (B) a polyorganosiloxane resin including at least one polysiloxane having one curable functional group in the molecule thereof, and (C) a siloxane compound having an alkoxysilyl group and a linear siloxane structure
    Type: Application
    Filed: July 20, 2017
    Publication date: May 20, 2021
    Applicant: MOMENTIVE PERFORMANCE MATERIALS JAPAN LLC
    Inventors: Masanori TAKANASHI, Isao IIDA, Daigo HIRAKAWA, Kenji TAKENAKA, Eiji TANIGAWA
  • Publication number: 20210147683
    Abstract: There is provided silicone rubber that achieves both a low modulus and high tear strength and a liquid silicone rubber composition that gives the silicone rubber. The liquid silicone rubber composition contains: (A) an alkenyl group-containing linear polyorganosiloxane; (B) a 0.1 to 39 parts by mass linear hydrogenorganopolysiloxane relative to 100 parts by mass of (A); (C) a polyorganosiloxane having alkenyl groups and Si—H whose total number in one molecule is three or more; (D) a hydrosilylation catalyst; and (E) a silica powder having a specific surface area of 100 to 420 m2/g, the content of the silica powder being 10 to 50 parts by mass relative to 100 parts by mass of (A). Relative to the total mass of (A), (B), and (C), the total molar amount of the alkenyl groups of (A) and Si—H of (B) is 0.03 to 0.19 mmol/g, and the total molar amount of the alkenyl groups and SiH of (C) is 0.01 to 0.05 mmol/g. An Si—H/alkenyl group ratio of the composition is 0.7 to 1.3.
    Type: Application
    Filed: January 26, 2021
    Publication date: May 20, 2021
    Applicant: MOMENTIVE PERFORMANCE MATERIALS JAPAN LLC
    Inventor: Masanari SHIMAKAWA
  • Publication number: 20210147681
    Abstract: A thermally conductive polysiloxane composition includes (A) a thermally conductive filler, and (B) at least one member selected from the group consisting of an alkoxysilyl group-containing compound and a dimethylpolysiloxane. The component (A) includes at least two thermally conductive fillers having different average particle diameters, and (A-1) indefinite-shaped aluminum nitride particles having an average particle diameter of 30 ?m to 150 ?m in an amount of at least 20% by mass, based on the mass of a total of the component (A).
    Type: Application
    Filed: July 20, 2017
    Publication date: May 20, 2021
    Applicant: MOMENTIVE PERFORMANCE MATERIALS JAPAN LLC
    Inventors: Daigo HIRAKAWA, Masanori TAKANASHI, Isao IIDA, Kenji TAKENAKA, Eiji TANIGAWA
  • Publication number: 20210130615
    Abstract: The present invention relates to a thermally conductive polysiloxane composition that provides a cured product having excellent tackiness and flexibility in which the composition contains (A) a thermally conductive filler, (B) a siloxane compound having an alkoxysilyl group and a linear siloxane structure, (C) a polyorganosiloxane having at least two alkenyl groups bonded to silicon atoms per molecule, (D1) a linear polyorganohydrogensiloxane represented by the general formula (4), (D2) a polyorganohydrogensiloxane having per molecule at least three units represented by the general formula (5), and (E) a platinum catalyst.
    Type: Application
    Filed: January 25, 2018
    Publication date: May 6, 2021
    Applicant: MOMENTIVE PERFORMANCE MATERIALS JAPAN LLC
    Inventors: Daigo HIRAKAWA, Masanori TAKANASHI, Atsushi SAKAMOTO
  • Publication number: 20210102070
    Abstract: To provide a polyorganosiloxane composition whose cured product has uniform good flame retardancy and good physical properties with less discoloring, for example, yellowing, and which has excellent temporal stability when stored. A flame-retardant polyorganosiloxane composition contains: (A) straight-chain polyalkylsiloxane having two or more alkenyl groups in one molecule and having a 10,000 to 1,000,000 mPa·s viscosity (25° C.); (B) resinoid polyorganosiloxane containing a Q unit and having 1.5 or more alkenyl groups on average, mass % of the component (B) being 30 to 80 mass % of the total of the components (A), (B); (C) polyorganohydrogensiloxane having three or more Si—H, an amount of the component (C) being such that Si—H/(total of the alkenyl groups in the components (A), (B)) becomes 1.0 to 3.0 moles; and (D) a catalytic amount of a hydrosilylation reaction catalyst, wherein the total content of phosphorus and an alkali metal is 20 mass ppm or less.
    Type: Application
    Filed: December 11, 2020
    Publication date: April 8, 2021
    Applicant: MOMENTIVE PERFORMANCE MATERIALS JAPAN LLC
    Inventors: Kikuo MOCHIZUKI, Hidefumi TAGAI
  • Publication number: 20210102069
    Abstract: To provide a polyorganosiloxane composition with good moldability, and a cured product with good mold release property and excellent non-contamination property to the metal mold. A polyorganosiloxane composition for molding includes: (A) a straight-chain polyorganosiloxane having two or more alkenyl groups in one molecule, and having a viscosity (at 25° C.) of 10,000 to 1,000,000 mPa·s; (B) 30 to 80 mass % of a resinoid polyorganosiloxane containing Q units, and having 1.5 or more alkenyl groups on average in one molecule, to a total of the components (A) and (B); (C) a polyorganohydrogensiloxane containing M units and Q units, having a molar ratio of alkoxy groups and Si—H of less than 0.15, and having a mass decrease rate when heated at 150° C. for 30 minutes of 2.0% or less, wherein an amount of the (Si—H/alkenyl groups) is 1.0 to 3.0 mol; and (D) a catalytic amount of a hydrosilylation reaction catalyst.
    Type: Application
    Filed: December 11, 2020
    Publication date: April 8, 2021
    Applicant: MOMENTIVE PERFORMANCE MATERIALS JAPAN LLC
    Inventor: Kikuo MOCHIZUKI