Abstract: A curable polyorganosiloxane composition includes (a) a polyorganosiloxane having two or more curable functional group capable of causing addition reaction in one molecule; (b) a crosslinking agent having three or more crosslinking groups which have reactivity with the curable functional group of the (a) in one molecule; (c) a curing catalyst capable of catalyzing a crosslinking reaction of the (a) and (b); and (d) a silicon compound having a monovalent alkyl group of 8 to 30 carbon atoms and a hydrolyzable group which are directly bonded to a silicon atom; and in some cases, (e) scaly inorganic fine particles. An adhesive may use the curable polyorganosiloxane composition.

Abstract: A thermally conductive polysiloxane composition comprising: (A) a thermally conductive filler; (B) a polyorganosiloxane resin having a curable functional group in the polysiloxane molecule, the polyorganosiloxane resin comprising at least one polysiloxane (b1) having one curable functional group in the molecule thereof; (C) a siloxane compound having an alkoxysilyl group and a linear siloxane structure; (D) a hydrogenpolyorganosiloxane; and (E) a platinum catalyst, wherein the content of the polysiloxane (b1) having one curable functional group in the molecule thereof in the polyorganosiloxane resin (B) is more than 80% by mass.

Abstract: A thermally conductive polysiloxane composition includes (A) a thermally conductive filler, (B) a polyorganosiloxane resin including at least one polysiloxane having one curable functional group in the molecule thereof, and (C) a siloxane compound having an alkoxysilyl group and a linear siloxane structure.

Abstract: A curable polyorganosiloxane composition includes (a) a polyorganosiloxane having two or more curable functional groups per molecule; (b) a crosslinking agent having per molecule two or more crosslinkable groups having reactivity with the curable functional groups of the component (a); (c) a curing catalyst capable of catalyzing a crosslinking reaction of the component (a) and the component (b); (d) a pigment which itself does not emit a fluorescent light; and (e) a UV tracer. The composition can be used as an adhesive.

Abstract: A curable composition includes a perfluoro(poly)ether group-containing silane compound represented by the general formula (I) (wherein, definitions of each group are as described in the specification); (b) an organic silicon compound having at least two OR2 groups bonded to Si atom (here, R2s are each independently a hydrogen atom or a monovalent organic group at each appearance) or a partially hydrolyzed condensate thereof; and (c) a condensation catalyst.

Abstract: A curable composition contains (A) a perfluoro(poly)ether group-containing silane compound having two or more Si atoms bonded to at least one group selected from the group consisting of a hydroxyl group and a hydrolyzable group, (B) a compound (other than (A)) having at least two OR2 groups bonded to an Si atom (in the formula, R2 each independently are a hydrogen atom or a monovalent organic group at each occurrence) or a partial hydrolysis condensate thereof, (C) a condensation catalyst, and (D) surface-treated silica.

Abstract: A curable composition includes: (A) a perfluoro(poly)ether group-containing silane compound having two or more Si atoms bonded to at least one group selected from the group consisting of a hydroxyl group and hydrolyzable groups; (B) a compound having at least two OR2 groups (in the formula, R2 is independently a hydrogen atom or a monovalent organic group at each occurrence) bonded to an Si atom (provided that (A) and (D) are excluded) or a partially hydrolyzed condensate thereof; (C) a condensation catalyst; and (D) a compound containing two or more alkoxysilyl groups in one molecule or a partially hydrolyzed condensate thereof (provided that (A) is excluded), with the linking group between the alkoxysilyl groups being a group other than that selected from the group consisting of an —O— group and a group having a siloxane bond.

Abstract: A moisture-curable curable composition includes a perfluoro(poly)ether group-containing silane compound (a1) represented by formula (I); a perfluoro(poly)ether group-containing silane compound (a2) represented by formula (II) (in each formula, the definition of each group is as defined in the specification); (b) an organic silicon compound having at least two OR2 groups (here, R2s are each independently a hydrogen atom or a monovalent organic group at each appearance) bonded to Si atom or a partially hydrolyzed condensate thereof; and (c) a condensation catalyst.

Abstract: A curable composition contains (A) a perfluoro(poly)ether group-containing silane compound having two or more Si atoms bonded to at least one group selected from the group consisting of a hydroxyl group and a hydrolyzable group, (B) a compound (other than (A)) having at least two OR2 groups bonded to an Si atom (in the formula, R2 each independently are a hydrogen atom or a monovalent organic group at each occurrence) or a partial hydrolysis condensate thereof, (C) a condensation catalyst, and (D) an inorganic filler with a primary particle size from 0.01 to 0.1 ?m.

Abstract: An addition reaction curing type polyorganosiloxane composition for bonding poly(phenylene sulfide) resins includes (A) a polyorganosiloxane containing two or more alkenyl groups in the molecule, (B) a polyorganohydrogensiloxane having, in the molecule, three or more silicon-atom-bonded hydrogen atoms, (C) a platinum-based catalyst, (D) an oxide or carbonate of a metal selected from among the metals in Groups 2 and 12 of the periodic table, and (E) an adhesion promoter, the content of the ingredient (D) being 0.1-20 wt % with respect to the whole composition.

Abstract: There is provided an adhesive application apparatus capable of efficiently applying an adhesive without inhibiting curing of the adhesive. An adhesive application apparatus of the present invention includes a mounting table 10, an adhesive dosing unit 20, and an ultraviolet irradiation unit 30, and it applies a delayed-ultraviolet-curable adhesive 200 to a surface of a panel 100. The panel 100 is mounted on a mounting surface S10 of the mounting table 10. The adhesive dosing unit 20 applies the adhesive 200 to the surface of the panel 100 mounted on the mounting table 10 by discharging the adhesive 200 from an adhesive dosing port H20. The ultraviolet irradiation unit 30 irradiates the adhesive 200 dosed from the adhesive dosing port H20 with ultraviolet light L. Here, the ultraviolet irradiation unit 30 irradiates the adhesive 200 with the ultraviolet light L along the mounting surface S10 before the adhesive 200 dosed from the adhesive dosing port H20 is applied to the surface of the panel 100.

Abstract: A thermally conductive polysiloxane composition includes (A) a thermally conductive filler and (B) one or more compounds selected from an alkoxysilyl group-containing compound and a dimethylpolysiloxane, wherein: component (A) includes (A-1) round, indefinite-shaped or polyhedral aluminum nitride particles having an average particle diameter of from 50 ?m to 150 ?m and (A-2) round, indefinite-shaped or polyhedral aluminum nitride particles having an average particle diameter of 10 ?m or more but less than 50 ?m in an amount of from 20% by mass to 100% by mass relative to the total amount of component (A); and the content ratio of component (A-1) to component (A-2) is from 50:50 to 95:5 on a mass basis.

Abstract: The present invention relates to a thermally conductive polysiloxane composition comprising: (A) a thermally conductive filler, (B) a siloxane compound having a specified structure; (C) an alkoxysilane compound having a specified structure; (D) a polyorganosiloxane containing at least one aliphatic unsaturated group per molecule; (E) a polyorganohydrogensiloxane having two or more hydrogen atoms bonded to silicon atoms per molecule; and (F) a platinum-based catalyst.

Abstract: A siloxane compound represented by the general formula (1): where R1 is a group having an alkoxysilyl group having 1 to 4 carbon atoms, R2 is a linear organosiloxy group represented by the general formula (2): where each R4 is independently a monovalent hydrocarbon group having 1 to 12 carbon atoms, Y is a monovalent hydrocarbon group having 1 to 6 carbon atoms, and d is an integer of 10 to 50, each X is independently a divalent hydrocarbon group having 2 to 10 carbon atoms, each of a and b is independently an integer of 1 or more, c is an integer of 0 or more, a+b+c is an integer of 4 or more, and each R3 is independently a monovalent hydrocarbon group having 1 to 6 carbon atoms.

Abstract: There is provided an aqueous coating agent composition that does not contain an organotin compound and forms a coating film having good slipperiness and having excellent adhesiveness (adhesion) and abrasion resistance. The aqueous coating agent composition contains: (A) polydiorganosiloxane having both terminals blocked with hydroxyl groups, the polydiorganosiloxane having a viscosity of 50 to 100,000,000 mPa·s (at 25° C.); (B) polyorganohydrogensiloxane having at least three hydrogen atoms in one molecule; (C) a zinc compound as a curing catalyst; (D) an organic compound and/or polyorganosiloxane having at least one of a primary amino group and a secondary amino group; (E) an adhesion improving component; and (F) spherical particles.

Abstract: An adhesive polyorganosiloxane composition includes, at a specific composition ratio: (A) a linear polyorganosiloxane containing an alkenyl group including a low-viscosity linear polyorganosiloxane containing an alkenyl group; (B) a polyorganosiloxane containing at least three alkenyl groups in the molecule; (C1) a polyorganohydrogensiloxane having 3 or more hydrogen atoms bonded to a silicon atom in the molecule; (C2) a linear polyorganohydrogensiloxane having one hydrogen atom bonded to a silicon atom only at both terminals of the molecular chain, and having no aliphatic unsaturated bonds in the molecule; (D) a filler; (E) a platinum group metal compound; and (F) two or more kinds of specific adhesion imparting agent.

Abstract: A method for producing a polyorganosiloxane resin composition including: (a) mixing a thermally-conductive filler having a particle size distribution having a single peak, with a surface treatment agent containing a siloxane to form a mixture, and (b) mixing the mixture from step (a) with a polysiloxane resin.

Abstract: An adhesive polyorganosiloxane composition includes: (A) a polyorganosiloxane having 2 or more alkenyl groups in each molecule thereof; (B) a polyorganohydrodienesiloxane having 3 or more hydrogen atoms bonded to a silicon atom in each molecule thereof; (C) a platinum-based catalyst; (D) at least two kinds of adhesion-imparting agents selected from the group consisting of specific organic silicon compounds, silane compounds, tetraalkoxysilane compounds, and/or partial hydrolysis condensates thereof; (E) hexamethyldisilazane; (F) water; and (G) at least one of (G1) and (G2), where (G1) is a non-surface-treated inorganic filler having a BET specific surface area of 50 to 500 m2/g, and (G2) is an inorganic filler obtained by surface-treating said (G1) with hexamethyldisilazane.

Abstract: A thermally conductive polysiloxane composition comprising: (A) a thermally conductive filler; (B) a polyorganosiloxane resin having a curable functional group in the polysiloxane molecule, the polyorganosiloxane resin comprising at least one polysiloxane (b1) having one curable functional group in the molecule thereof; (C) a siloxane compound having an alkoxysilyl group and a linear siloxane structure; (D) a hydrogenpolyorganosiloxane; and (E) a platinum catalyst, wherein the content of the polysiloxane (b1) having one curable functional group in the molecule thereof in the polyorganosiloxane resin (B) is more than 80% by mass.

Abstract: The present invention relates to a thermally conductive polysiloxane composition that provides a cured product having excellent tackiness and flexibility in which the composition contains (A) a thermally conductive filler, (B) a siloxane compound having an alkoxysilyl group and a linear siloxane structure, (C) a polyorganosiloxane having at least two alkenyl groups bonded to silicon atoms per molecule, (D1) a linear polyorganohydrogensiloxane represented by the general formula (4), (D2) a polyorganohydrogensiloxane having per molecule at least three units represented by the general formula (5), and (E) a platinum catalyst.