Patents Assigned to Moulded Circuits Limited
  • Patent number: 5755027
    Abstract: A method of producing an electrical circuit board comprises mounting electrically conducting circuit elements moulded from plastics material on a preformed board. The circuit elements are preferably made electrically conducting prior to mounting on the board by plating with an electrical conductor. The method is of particular utility in the manufacture of three-dimensional circuit boards.
    Type: Grant
    Filed: June 17, 1994
    Date of Patent: May 26, 1998
    Assignee: Moulded Circuits Limited
    Inventor: John Impey