Patents Assigned to Nakamura Seisakusho Kabushikigaisha
  • Patent number: 8702359
    Abstract: A method of forming a recess in a work, a work in which the recess is to be formed is a material that can be cut. A cutting tool for forming the recess is held by a moving apparatus at a prescribed angle relative to the work. The cutting tool is moved in a carving direction for carving the work at the prescribed angle, and a thin cutting fin is vertically formed. Then, the cutting tool is moved in the horizontal direction, and the cutting fin is cut and separated from the work. The fin-forming step and the cutting step are repeatedly performed in sequence, whereby a recess having a prescribed depth d and area is formed in the work.
    Type: Grant
    Filed: May 27, 2008
    Date of Patent: April 22, 2014
    Assignee: Nakamura Seisakusho Kabushikigaisha
    Inventor: Hideyuki Miyahara
  • Patent number: 8387247
    Abstract: A gouging tool is introduced at a slope angle ? to form small, low fins at a position shifted inward from an edge of a surface of a metal plate having a high coefficient of thermal conductivity; and the small fins are sequentially formed in a plural number at a fixed pitch until a blade section of the gouging tool reaches a prescribed depth. A fin formation step in which plate-shaped heat-radiating fins are integrally formed upright by the gouging tool is subsequently repeated in sequential manner following formation of the small fins, and the heat-radiating fins are continuously formed in a plural number in the metal plate. Heat-radiating fins of a heat radiator can be formed by a gouging tool without generating scrap.
    Type: Grant
    Filed: July 3, 2008
    Date of Patent: March 5, 2013
    Assignee: Nakamura Seisakusho Kabushikigaisha
    Inventor: Hideyuki Miyahara
  • Patent number: 7969740
    Abstract: In a metal-based print board formed with radiators, a metal foil is affixed to a front surface of a metal plate having good thermal conductivity, an insulating adhesive layer interposed therebetween. A radiator is integrally provided on a reverse surface of the metal plate, the radiator having a plurality of thin radiating fins formed upright in a tabular shape due to having been dug out by an excavating tool. The radiating fins give the radiator a large area over which heat can be released. The thickness of a first metal plate portion formed between adjacent radiating fins is less than the original thickness of the metal plate.
    Type: Grant
    Filed: March 10, 2010
    Date of Patent: June 28, 2011
    Assignee: Nakamura Seisakusho Kabushikigaisha
    Inventor: Hideyuki Miyahara
  • Patent number: 7900692
    Abstract: In an electrical component package provided with a liquid-cooled heat exchanger, a main-body plate of the package and a crowning member that are composed of metal plates are joined together, forming a hollow part therebetween for use as a liquid-cooled heat exchanger in which a working fluid is sealed. A concavity for use in mounting an electrical component to be cooled is formed on the outer surface portion of the main-body plate of the package disposed opposite to the hollow part. An inner surface portion that faces into the hollow part of the main-body plate of the package is carved out using a carving tool, whereby fins are formed at a fine pitch on the inner surface portion. Minute channels for moving the working fluid are formed between the fins. Therefore, a flat electrical component package can be provided with a liquid-cooled heat exchanger that has excellent heat-radiating functionality.
    Type: Grant
    Filed: March 1, 2007
    Date of Patent: March 8, 2011
    Assignee: Nakamura Seisakusho Kabushikigaisha
    Inventor: Hideyuki Miyahara
  • Publication number: 20100202112
    Abstract: In a metal-based print board formed with radiators, a metal foil is affixed to a front surface of a metal plate having good thermal conductivity, an insulating adhesive layer interposed therebetween. A radiator is integrally provided on a reverse surface of the metal plate, the radiator having a plurality of thin radiating fins formed upright in a tabular shape due to having been dug out by an excavating tool. The radiating fins give the radiator a large area over which heat can be released. The thickness of a first metal plate portion formed between adjacent radiating fins is less than the original thickness of the metal plate.
    Type: Application
    Filed: March 10, 2010
    Publication date: August 12, 2010
    Applicant: Nakamura Seisakusho Kabushikigaisha
    Inventor: Hideyuki MIYAHARA
  • Patent number: 7770633
    Abstract: A method for manufacturing a plate-type heat exchanger in which a heat medium is sealed in a hollow part of an airtight structure formed in the interior of a plate-like container, and the heat medium is moved by capillary force from a condensing part to an evaporating part in the hollow part along heat-medium-guiding grooves formed in the container's inside surface portions that face the hollow part; wherein a plastic workable metal plate of specific thermal conductivity is prepared; a carving tool is used to repeatedly carve out a surface portion of the metal plate at specific intervals along the surface portion, forming a plurality of plate-like fins; and a plurality of grooves formed between these fins is used as heat-medium-guiding grooves.
    Type: Grant
    Filed: June 21, 2006
    Date of Patent: August 10, 2010
    Assignee: Nakamura Seisakusho Kabushikigaisha
    Inventor: Hideyuki Miyahara
  • Patent number: 7464575
    Abstract: A shearing method for a thin plate including forming a protruded product part having a first sagging part when the thin plate with a thickness of up to approximately 5 mm is performed with a half die cutting by pressing the half die cutting punch slightly larger than the half die cutting hole to form a shallow recessed part, fixing the product part by a fixing member, forming a second sagging part at an edge portion of the thin plate by pressurizing a scrap part by moving a pressure punch which is provided with a gap between the fixing member and the pressure punch and by being bent between the scrap part and the product part, and then separating the scrap part from the product part.
    Type: Grant
    Filed: August 21, 2006
    Date of Patent: December 16, 2008
    Assignee: Nakamura Seisakusho Kabushikigaisha
    Inventor: Hideyuki Miyahara
  • Patent number: 7320177
    Abstract: In a method of manufacturing a radiator, the blade of a carving tool is applied at a specific angle to the surface of a metal plate with a high coefficient of thermal conductivity, the carving tool is advanced while the angle is maintained, and the surface of the metal plate is carved out to form plate-shaped heat-radiating fins vertically upward. A radiator is manufactured in which a plurality of heat-radiating fins are integrally formed vertically upward at a specific pitch from a single metal plate by repeating a step in which the carving tool is retracted at a specific pitch, the metal plate is carved out, and a heat-radiating fin is formed. A radiator that has high radiation efficiency and is highly safe during handling can be manufactured at low cost.
    Type: Grant
    Filed: January 24, 2005
    Date of Patent: January 22, 2008
    Assignee: Nakamura Seisakusho Kabushikigaisha
    Inventor: Hideyuki Miyahara
  • Patent number: 7107808
    Abstract: A shearing method for a thin plate including forming a protruded product part having a first sagging part when the thin plate with a thickness of not more than approximately 0.3 mm is performed with a half die cutting by pressing the half die cutting punch slightly larger than the half die cutting hole to form a shallow recessed part, fixing the product part by a fixing member, forming a second sagging part at an edge portion of the thin plate by pressurizing a scrap part by moving a pressure punch which is provided with a gap between the fixing member and the pressure punch and by being bent between the scrap part and the product part, and then separating the scrap part from the product part.
    Type: Grant
    Filed: October 13, 2004
    Date of Patent: September 19, 2006
    Assignee: Nakamura Seisakusho Kabushikigaisha
    Inventor: Hideyuki Miyahara
  • Patent number: 6915676
    Abstract: In a method of forming a protruded shaft on a metal base for an electronic memory device, the metal base is pressed down with a pressing tool from upper face side of the metal base placed on a die. The die is provided with a hole having a predetermined inner diameter and the wall material of the metal base is moved into the hole of the die to form a protruded shaft having a hollow part inside and the tip end closed.
    Type: Grant
    Filed: December 9, 2002
    Date of Patent: July 12, 2005
    Assignee: Nakamura Seisakusho Kabushikigaisha
    Inventor: Hideyuki Miyahara
  • Patent number: 6662427
    Abstract: A method for forming a cavity structure provided with a thin bottom plate is comprises the following steps. The first step is to deform plastically a part of a metal plate so as to form a cavity on one surface of a metal plate wherein the cavity has an oddly bottom surface provided with subsections being different from each other in depth. Simultaneously a protrusion is formed on the other surface of the metal plate by shifting an amount of metal corresponding to the cavity into the protrusion wherein the protrusion has substantially similar figure to the cavity. Then a coupling section, which keeps the protrusion integral with the metal plate, is formed so as to make the protrusion smaller than the cavity. And the protrusion is removed from the metal plate so as to make the other surface of the metal plate flat and to form the bottom plate of the cavity thin while remaining the coupling section.
    Type: Grant
    Filed: February 26, 2001
    Date of Patent: December 16, 2003
    Assignee: Nakamura Seisakusho Kabushikigaisha
    Inventor: Hideyuki Miyahara
  • Patent number: 6571595
    Abstract: A package for receiving electronic parts is formed with decreased stress and stress concentration to obtain a desired warp and flatness. In particular, according to a cutting protruding part process, a package is accommodated to have a recessed part formed on one face of a metal plate by pressing the face of the metal plate so that a corresponding protruding part is formed bulging from an opposing face of the metal plate. The protruding part is cut by a cutting tool and a bottom which has a cavity shape and is thinner in size than the metal plate is formed at the recessed part. The protruding part is again formed bulging from the metal plate and cut by the cutting tool. The cutting direction is differed in alternately facing directions so that the stress from cutting is almost cancelled.
    Type: Grant
    Filed: July 18, 2001
    Date of Patent: June 3, 2003
    Assignee: Nakamura Seisakusho Kabushikigaisha
    Inventor: Hideyuki Miyahara
  • Patent number: 6374490
    Abstract: A method of forming a hollow pole projecting from a metal plate by plastic deformation and comprising the steps of: (a) pressing the plate from one surface of the plate using a press tool so as to form a hole on the one surface and a projection on the other surface thereof; (b) moving metal of the plate around said projection towards interior of said hole so as to gather the metal into a periphery of an opening of said hole using a tapered tool; (c) pressing said periphery of said hole using a flat press tool which is greater than said projection in an external diameter so as to move the metal gathered by said tapered tool further towards the interior of said hole and to increase a height of said projection; and (d) inserting said press tool into said hole while pressing the interior of said hole so as to increase further the height of said projection and to form the hollow pole.
    Type: Grant
    Filed: August 11, 1999
    Date of Patent: April 23, 2002
    Assignee: Nakamura Seisakusho Kabushikigaisha
    Inventor: Hideyuki Miyahara
  • Patent number: 6145365
    Abstract: An object of the present invention is to provide a method for forming a recess portion having an predetermined shape on one side of a metal plate without giving the metal plate any remarkable stress while forming the other side flat, which is suitable for a package for electronic parts such as an integrated circuit, etc. The method according to the present invention is characterized in that a recess portion having an predetermined shape is formed by plastically deforming a metal plate having a predetermined thickness by means of a press, etc. so as to form the recess portion having a depth smaller than the thickness on one side thereof and to form at the same time a protruding portion protruding on the other side of the metal plate. In the steps of plastically deforming the metal plate, metal corresponding to the recess portion is displaced to the protruding portion.
    Type: Grant
    Filed: September 28, 1998
    Date of Patent: November 14, 2000
    Assignee: Nakamura Seisakusho Kabushikigaisha
    Inventor: Hideyuki Miyahara