Patents Assigned to Neomax Materials Co., Ltd.
  • Patent number: 7790988
    Abstract: A hermetic sealing cap can be provided which is capable of suppressing that a production process becomes complicated, and additionally of suppressing that a solder layer wetly spreads inward on a sealing surface. This hermetic sealing cap (1, 30) includes a base member (2), a first plating layer (3, 31) that is formed on the surface of the base member, and a second plating layer (4, 32) that is formed on the surface of the first plating layer and is less oxidized than the first plating layer, wherein a part of the second plating layer in an area (S1, S5) inside an area (S2, S6) to which an electronic component accommodation member is joined is removed so that the surface of the first plating layer is exposed, and the surface of the first plating layer that is exposed in the area from which the second plating layer is removed is oxidized.
    Type: Grant
    Filed: February 13, 2007
    Date of Patent: September 7, 2010
    Assignee: Neomax Materials Co., Ltd.
    Inventors: Tsuyoshi Tanaka, Masaharu Yamamoto
  • Publication number: 20100212456
    Abstract: Disclosed is a method of manufacturing a composite ball for electronic parts by preparing a core ball with spherical shape, forming a solder-plated layer encompassing the core ball to obtain a composite ball, and then conducting a smoothing work on the surface of the solder-plated layer, therein the smoothing work is preferably conducted by bringing a medium into contact with the surface of the solder-plated layer.
    Type: Application
    Filed: February 18, 2010
    Publication date: August 26, 2010
    Applicants: HITACHI METALS, LTD., NEOMAX MATERIALS CO., Ltd.
    Inventor: Ken ASADA
  • Patent number: 7776452
    Abstract: A heat sink member capable of suppressing development of cracks and chaps in manufacturing, suppressing enlargement of a thermal expansion coefficient and suppressing lowering of thermal conductivity is obtained. This heat sink member comprises a ply member (1) mainly composed of Cu, a substrate (2) mainly composed of Mo and a brazing layer (4) consisting of an Sn—Cu alloy (Sn: 1 mass % to 13 mass %) arranged between the ply member and the substrate for bonding the ply member and the substrate to each other.
    Type: Grant
    Filed: July 27, 2005
    Date of Patent: August 17, 2010
    Assignee: Neomax Materials Co. Ltd.
    Inventors: Kazuhiro Shiomi, Masaaki Ishio, Tsuyoshi Hasegawa
  • Patent number: 7754973
    Abstract: A solar cell electrode wire includes a core material having a volume resistivity of not greater than about 2.3 ??·cm and a proof strength in the range of about 19.6 MPa to about 85 MPa, and a hot-dip solder plating layer disposed on a surface of the core material. The core material is preferably an annealed pure copper material having an oxygen content of not higher than about 20 ppm. The core material may be a clad material including an interlayer of aluminum and copper layers disposed on opposite surfaces of the interlayer.
    Type: Grant
    Filed: May 18, 2005
    Date of Patent: July 13, 2010
    Assignee: Neomax Materials Co., Ltd.
    Inventors: Kazuhiro Shiomi, Masaaki Ishio, Toshiaki Fujita
  • Publication number: 20100104887
    Abstract: Provided is an airtightly sealing cap, by which a use quantity of Au is reduced in a soldering material for sealing a miniaturized electronic component storing package. An airtightly sealing cap (10) is used for an electronic component storing package (100) which includes an electronic component storing member (20) for storing an electronic component (40). The airtightly sealing cap is provided with a base material (1); a base layer (2) which is formed on the surface of the base material and contains Ni; and a soldering material layer (6), which is formed on the base layer, has a thickness of 10 ?m or less and composed of Au and Sn. The content percentage of Au in the soldering material layer is 43 mass % or more but not more than 64 mass %.
    Type: Application
    Filed: February 19, 2008
    Publication date: April 29, 2010
    Applicant: NEOMAX MATERIALS CO., LTD.
    Inventors: Masaharu Yamamoto, Takayuki Furujo
  • Publication number: 20100055539
    Abstract: A separator for a fuel cell according to the present invention includes: a base 1 containing 70 mass % or more of Al; an underlying layer 2 being formed on the base and containing Ti; an intermediate layer 3 being formed on the underlying layer and containing TiNx or TiOy; and a conductive metal layer 4 being formed on the intermediate layer and containing Au or Pt. The separator for a fuel cell according to the present invention has an excellent anticorrosiveness although a base containing aluminum as a main component is used.
    Type: Application
    Filed: November 16, 2007
    Publication date: March 4, 2010
    Applicant: NEOMAX MATERIALS CO., LTD.
    Inventors: Masayuki Yokota, Fumiaki Kikui, Ken Asada
  • Publication number: 20090301749
    Abstract: A hermetic sealing cap can be provided which is capable of suppressing that a production process becomes complicated, and additionally of suppressing that a solder layer wetly spreads inward on a sealing surface. This hermetic sealing cap (1, 30) includes a base member (2), a first plating layer (3, 31) that is formed on the surface of the base member, and a second plating layer (4, 32) that is formed on the surface of the first plating layer and is less oxidized than the first plating layer, wherein a part of the second plating layer in an area (S1, S5) inside an area (S2, S6) to which an electronic component accommodation member is joined is removed so that the surface of the first plating layer is exposed, and the surface of the first plating layer that is exposed in the area from which the second plating layer is removed is oxidized.
    Type: Application
    Filed: February 13, 2007
    Publication date: December 10, 2009
    Applicant: NEOMAX MATERIALS CO., LTD.
    Inventors: Tsuyoshi Tanaka, Masaharu Yamamoto
  • Publication number: 20090286099
    Abstract: A silver-coated ball 10 according to the present invention includes: a spherical core 1; and a coating layer 2 including silver superfine particles, which is arranged so as to surround the core 1. The silver superfine particles included in the coating layer 2 have a mean particle size of 1 nm to 50 nm.
    Type: Application
    Filed: May 23, 2006
    Publication date: November 19, 2009
    Applicant: NEOMAX MATERIALS CO., LTD.
    Inventors: Ken Asada, Fumiaki Kikui
  • Publication number: 20090283573
    Abstract: An electrode wire material that can be used in a solar cell is produced without using flattening rolls or endless belts and has excellent solderability. The electrode wire material includes a core material formed of a strip-like conductive material and a hot-dip solder plated layer formed on a surface of the core material. A recessed portion for storing molten solder is formed in the core material along the longitudinal direction and the hot-dip solder plated layer is filled in the recessed portion. The recessed portion for storing molten solder preferably has an opening width in the lateral direction of the core material of about 90% or more of the width of the core material. The core material is preferably formed of a clad material including an interlayer of a low thermal expansion Fe alloy and copper layers formed on both surfaces of the interlayer.
    Type: Application
    Filed: July 24, 2009
    Publication date: November 19, 2009
    Applicant: NEOMAX MATERIALS CO., LTD.
    Inventors: Kazuhiro SHIOMI, Toshiaki FUJITA, Masaaki ISHIO
  • Publication number: 20090272577
    Abstract: A clad material for a wiring connection has an electroconductive layer formed from either pure Cu or a Cu alloy having higher electroconductivity than pure Al, a surface layer formed from either pure Al or an Al alloy and layered on one surface of the electroconductive layer, and a solder layer formed by hot-dip solder plating on the other surface of the electroconductive layer. The wiring connection member has a first connection end provided with an electroconductive layer soldered to an electrode of a semiconductor element, and a second connection end provided with an electroconductive layer soldered to, for example, an external wiring device. The wiring connection member is processed from the clad material for a wiring connection. This wiring member prevents molten solder from depositing on a pressing and heating portion of a local heating apparatus while also possessing excellent solderability.
    Type: Application
    Filed: April 25, 2007
    Publication date: November 5, 2009
    Applicant: NEOMAX MATERIALS CO., LTD.
    Inventors: Kazuhiro Shiomi, Masaaki Ishio
  • Publication number: 20090178831
    Abstract: An electroless Ni—P plating method according to the present invention includes the steps of: providing a substrate including an insulating substrate and a copper alloy layer that has a predetermined pattern including a plurality of island portions that are isolated from each other; providing a plating solution to carry out electroless Ni—P plating; providing a solid piece including Ni, Ni—P, Co or Co—Ni on at least the surface thereof; and bringing the solid piece into contact with the surface of at least two of the island portions that are both in contact with the plating solution, thereby selectively forming an electroless Ni—P plated coating on the surface of the island portions. Thus, the present invention provides a Ni—P plating method that can subject the copper pattern on the insulating substrate to high-precision selective Ni—P plating on an industrial basis.
    Type: Application
    Filed: June 22, 2007
    Publication date: July 16, 2009
    Applicant: NEOMAX MATERIALS CO., LTD.
    Inventors: Masayuki Yokota, Ken Asada, Fumiaki Kikui
  • Publication number: 20090045506
    Abstract: A Cu—Mo substrate 10 according to the present invention includes: a Cu base 1 containing Cu as a main component; an Mo base having opposing first and second principal faces 2a, 2b and containing Mo as a main component, the second principal face 2b of the Mo base 2 being positioned on at least a portion of a principal face 1a of the Cu base 1; and a first Sn—Cu-type alloy layer 3 covering the first principal face 2a and side faces 2c and 2d of the Mo base 2, the first Sn—Cu-type alloy layer 3 containing no less than 1 mass % and no more than 13 mass % of Sn.
    Type: Application
    Filed: May 23, 2006
    Publication date: February 19, 2009
    Applicant: NEOMAX MATERIALS CO., LTD.
    Inventors: Masayuki Yokota, Kazuhiro Shiomi, Fumiaki Kikui, Masaaki Ishio
  • Publication number: 20090038823
    Abstract: A wiring substrate with lead pins formed by bonding lead pins to electrode pads formed on a wiring substrate through conductive materials is provided and in the lead pin, the end face side bonded as opposed to the electrode pad of a head part formed in one end of a shaft part is formed in a conic protrusion part and also a vertex angle of the conic protrusion part is set in an angle range of 110° to 140°, and the conductive material is interposed between the conic protrusion part and the electrode pad and also extends to a flat part of the head part and reaches an outer surface of the shaft part and the lead pin is bonded to the electrode pad.
    Type: Application
    Filed: August 6, 2008
    Publication date: February 12, 2009
    Applicants: SHINKO ELECTRIC INDUSTRIES CO., LTD., NEOMAX MATERIALS CO., LTD.
    Inventors: Yoshinori Furihata, Toshifumi Machii, Kiyotaka Shimada, Kazuhiro Yoshida
  • Publication number: 20080271908
    Abstract: Cap for airtight sealing (1) that not only suppresses any deterioration of the properties of electronic parts (20) to thereby reduce material costs but also enables use of Pb-free solders, and that is capable of suppressing any airtightness deterioration. This cap for airtight sealing comprises low thermal expansion layer (2); Ni—Co alloy layer (3) superimposed on the surface of the low thermal expansion layer and composed mainly of Ni wherein a diffusion acceleration material is contained; Ni layer (4) superimposed on the surface of the Ni—Co alloy layer; and solder layer (5) superimposed on the surface of the Ni layer at regions for bonding of electronic part accommodation member (10) and composed mainly of Sn. The Ni layer has the functions of not only suppressing any diffusion of the Ni—Co alloy layer into the solder layer at about 235° C. (first temperature) but also at bonding of the solder layer with the electronic part accommodation member at about 300° to about 320° C.
    Type: Application
    Filed: September 26, 2005
    Publication date: November 6, 2008
    Applicant: NEOMAX MATERIALS CO., LTD.
    Inventors: Masaharu Yamamoto, Kenji Takano, Junji Hira
  • Publication number: 20080169020
    Abstract: A solar cell electrode wire includes a core material having a volume resistivity of not greater than about 2.3 ??·cm and a proof strength in the range of about 19.6 MPa to about 85 MPa, and a hot-dip solder plating layer disposed on a surface of the core material. The core material is preferably an annealed pure copper material having an oxygen content of not higher than about 20 ppm. The core material may be a clad material including an interlayer of aluminum and copper layers disposed on opposite surfaces of the interlayer.
    Type: Application
    Filed: May 18, 2005
    Publication date: July 17, 2008
    Applicant: NEOMAX MATERIALS CO., LTD.
    Inventors: Kazuhiro Shiomi, Masaaki Ishio, Toshiaki Fujita
  • Patent number: 7323070
    Abstract: A process of producing a maraging steel includes melting a steel of a defined composition, casting the molten steel to obtain a steel ingot, hot forging the steel ingot at a forging ratio of at least 4, then soaking the forged piece one or more times to keep the forged piece in a temperature range of 1100-1280° C. for 10-100 hours, and then plastic working the forged piece. A process of producing a maraging steel of another defined composition includes casting the molten steel to obtain a steel ingot with a defined taper, a defined height to diameter ratio and a defined flatness ratio and plastic working the steel ingot so that the size of a nonmetallic inclusion is 30 ?m or less expressed as the diameter of a circle of circumference equal to the perimeter (“circumference”) of the inclusion.
    Type: Grant
    Filed: March 26, 2004
    Date of Patent: January 29, 2008
    Assignee: Neomax Materials Co., Ltd.
    Inventors: Masami Ueda, Kenji Hirano
  • Publication number: 20070224445
    Abstract: A brazing filler metal capable of improving both of oxidation resistance and corrosion resistance is obtained. This brazing filler metal (1, 1d, 51 and 51a) consists of at least a three-layer structure of an Ni—Cr brazing layer (2 and 2a) consisting of an Ni—Cr alloy layer, a Ti brazing layer (3, 3a, 3b, 3c and 3d) consisting of a Ti layer or a Ti alloy layer and an Ni brazing layer (4, 4a, 4b, 4c and 4d) consisting of an Ni layer or an N alloy layer arranged between the Ni—Cr brazing layer and the Ti brazing layer.
    Type: Application
    Filed: March 24, 2006
    Publication date: September 27, 2007
    Applicant: NEOMAX MATERIALS CO., LTD.
    Inventors: Tsuyoshi Hasegawa, Masaaki Ishio, Yoshimitsu Oda
  • Patent number: 7265046
    Abstract: A solder ball 50 according to the present invention includes a spherical core 2 and a solder layer 4, which includes Sn and Ag and which is provided so as to wrap the core 2 up. The amount of water contained in the solder layer 4 is 100 ?l/g or less when represented by the amount of water vapor in standard conditions.
    Type: Grant
    Filed: September 24, 2003
    Date of Patent: September 4, 2007
    Assignee: Neomax Material Co., Ltd.
    Inventors: Masuo Kondo, Fumiaki Kikui
  • Publication number: 20070148490
    Abstract: A brazing method which provides a braze joint having excellent corrosion resistance and a brazed structure including such a braze joint includes assembling a first member and a second member to be joined into a temporary assembly, the first member including a base plate made of a ferrous material and a diffusion suppressing layer laminated on the base plate and composed of a Ni—Cr alloy essentially including not less than about 15% and not greater than about 40% of Cr, the second member being disposed on the diffusion suppressing layer of the first member with intervention of a brazing material of a Cu—Ni alloy essentially including not less than about 10% and not greater than about 20% of Ni, and maintaining the temporary assembly at a temperature of not less than about 1,200° C.
    Type: Application
    Filed: December 22, 2004
    Publication date: June 28, 2007
    Applicant: NEOMAX MATERIALS CO., LTD.
    Inventors: Tsuyoshi Hasegawa, Masaaki Ishio, Shunji Kajikawa, Yoshitsugu Sakamoto, Takayuki Hayashi
  • Publication number: 20070072425
    Abstract: A substrate according to the present invention includes a metal plate, and an insulating film, which is provided on the surface of the metal plate and which includes needle alumina particles and granular particles. The substrate of the present invention has excellent insulating property and can be manufactured on an industrial basis with acceptable efficiency.
    Type: Application
    Filed: October 6, 2004
    Publication date: March 29, 2007
    Applicant: NEOMAX MATERIALS CO., LTD.
    Inventors: Fumiaki Kikui, Akio Morishita, Masato Yasuoka